Flexible Hybrid Electronics (FHE) Workshop: Modeling & Design Tools and Materials Data Schema & Curation
June 22-23, 2016
2244 Blach Place, Suite 150, San Jose, CA 95131
FHE Modeling & Design Tools
Day 1 focuses on the future of FHE modeling and design tools, bringing electronics designers from industry, government, and academia together with companies developing software tools. The goal of the workshop is to identify the critical path for adapting today’s computer-aided design tools for electrical, mechanical, thermal, and other modeling and simulation of FHE materials, devices, assemblies, and product demonstrators.
- Suresh Sitaraman, Georgia Institute of Technology, “Design and Modeling Roadmap Review and Workshop Goals”
- Jeff Duce, Boeing, “Design and Analysis Needs and for Printed Electronics in Aerospace”
- Narayanan TV, Zuken, “Enabling Intelligent Design for Manufacturing for Flexible Hybrid Electronics”
- Norman Chang, ANSYS, “Power and Reliability Analysis for Next Generation Flexible Hybrid Electronic”
- Sung Lee, Raytheon, “America Makes Multidisciplinary Design Analysis for Seamless Additive Manufacturing (Design, Analysis, Build, and Redesign Workflows)”
- T.-C. Jim Huang, Hewlett Packard Enterprise, “Flexible Hybrid Electronics for Wearables and IoT: Design Challenge and Opportunities”
- Metin Ozen, Ozen, “Current Capabilities and Challenges in Modeling Right Physics for FHE”
- Steve Ready, PARC, “Design for Additive Manufacturing”
- Madhavan Swaminathan, Georgia Institute of Technology, “3D Modeling and Process Design Kits for Flexible Hybrid Electronics Challenges and Opportunities”
- Design, Model, Simulation, and Validation Process Flow – How do we make it appropriate and efficient for FHE?
- 3D Multi-physics Modeling and Process Design Kits – What is missing and what is required?
- Workforce Development: What are barriers to widespread use of modeling and design tools in FHE manufacturing?
FHE Materials Data Schema & Curation
The second day focuses on FHE materials data schema and curation and will address what materials and processing data are needed to enable the proliferation of FHE devices, assemblies, and product demonstrators. Current materials database/curation and data mining approaches will be discussed. In addition to electronics developers and practitioners from industry, government, and academia, this workshop will bring together material database companies, material vendors, material processing and tool manufacturers, as well as software tool vendors with built-in material databases. By the close of the workshop participants will identify the types and the format of materials and processing data needed for FHE device & process design.
- Wayne Ziegler, Army Research Lab, “Materials & Process Information Management to Accelerate Discovery and Deployment”
- Nancy Jaster, IPC, “IPC’s Data Connect Initiative”
- Zachary Trautt, NIST, ” Materials Data Infrastructure Efforts at NIST”
- Bryce Meredig, Citrine, “Flexible Materials Data Infrastructure Optimized for Advanced Analytics”
- Harish Surendranath, Dassault, “Simulating Performance and Reliability of Flexible Hybrid Electronics”
- Gregory Blackman, DuPont, “Toolkit for Wearable Electronics and Devices”
- Catherine Shearer, Ormet Circuits, “Introducing Disruptive Technology: A Materials Supplier’s Perspective”
- Dan Gamota, Jabil, “An End-user Perspective on Data Approach and Needs”
- Materials Data – What do we have today?
- Materials Data – What can we do?
- What role should NextFlex take in addressing gaps in materials & process data, standards, and specifications?
Members & Government: Free
Day 1 Networking Dinner: $40
Register by: June 17
Each day opens with an overview of the relevant roadmap assembled by the NextFlex’s Technical Working Groups. Invited speakers will then present their perspective on the current state-of-the-art, as well as gaps and opportunities. Half of each day will be dedicated to facilitated discussion to capture the views of workshop participants and determine the role for NextFlex in each area. There will also be a no-host networking dinner event on June 22nd (details TBA).
Questions? Contact us.