Flexible Hybrid Electronics (FHE) combine the flexibility and low cost of printed plastic film substrates with the performance of semiconductor devices to create a new category of electronics that can bend, stretch, and conform to any shape.
In support of our mission to advance Flexible Hybrid Electronics (FHE) manufacturing in the U.S., our facility has two cleanrooms and lab space for printing, device integration and testing and measurement, that are fully compliant with ITAR’s (International Traffic in Arms Regulations) quality standard requirements for military electronics, materials, and guidance equipment manufacturing as well as the Food and Drug Administration’s (FDA) medical device manufacturing Quality Systems Regulations (QSR) for good manufacturing practices.
With this approach, there are no rigid printed circuit boards or chip packages, no high-temperature solder processes, and yet, no compromises in system performance.
Not only can FHE systems replace rigid systems in current applications, they can also enable applications that do not currently exist, such as smart bandages for wound monitoring and treatment, electronics that conform to curved surfaces on aircraft or vehicles, and flexible electronics for robotic applications.
In addition to its ongoing collaborative programs with members, NextFlex is developing the flexible hybrid electronics manufacturing ecosystem with system and component manufacturers and designers, product developers, and materials and equipment providers.