Tech Hub Equipment
Equipment and tools available at
the NextFlex Technology Hub
Print Lab Equipment
| COMPANY NAME | DESCRIPTION | PROCESS CAPABILITY | MODEL # |
| Optomec | Digital Printing on 3D Surfaces | 5 Axes of Motion, Down to 5 µm Features | Aerosol Jet 5X |
| nScrypt | Multifunction FHE Tool | Printing, PnP, Micromachining, and 3D Printing | 3Dn-500 |
| Komori | Offset Gravure Press for Fine Feature Printing | Development of Alternate Process for Fine Line (10 µm) Printing | PEPIO F6 |
| Space Foundry | Plasma-jet deposition system | Dry print process tailors ink material properties in-situ, improved adhesion | Printer: 74.3.3 Printhead: #135.3 |
| SUSS | Digital Print Dispensing Units 1 and 2 | Digital Printing with Wide Array of Print Heads for Fine Line | PiXDRO IP410 |
| SMIT | PECVD Deposition of Thin Films | Deposit Insulating Films for Multilayer Applications | FLEx |
| Fujifilm – Dimatix | Tabletop Inkjet Printing | Printing Down to 100 µm, Developing Narrower Print Traces | DMP-2850 |
| HMI | Screen Print Conductor/Solder (500mm × 500mm Frame) | Automatic Flood/Squeegee Bar, High Resolution Vision System | MSP-9156C |
| ESI | Laser Ablation, Via Drilling, Dicing | Laser Via Drilling and Precision Laser Micromachining | LodeStone |
| Keyence | Confocal Laser Scanning Microscope for Nano-Scale Inspection | 3D Confocal Microscope for Surface Inspection Display Resolution 1 nm | VK-X200K |
| ScanCAD International | High Precision Flat Bed Scanner | Screen/Stencil/Image Inspection | ScanINSPECT |
| IDS | Aerosol Printer | High resolution aerosol printing <<35µm resolution on 3 motion axes | Nanojet |
| COMPANY NAME | DESCRIPTION | PROCESS CAPABILITY | MODEL # |
| BTU International | Thermal Cure Conveyor Oven (8 Zone) | Cure Film Substrates up to 350ºC with Nitrogen | PYRAMAX 100N |
| adphos | IR Cure Conveyor | 5.5kW Power on 10″ × 12″ Substrate | Mini Lab 230V/25A |
| Uvitron International | UV Flood Cure Lamp | 100MW/sq cm Power, 320–390 nm Wavelength | Sunray 400 SM |
| TestEquity | Forced Air Oven | Maximum Temperature of 250ºC | FS4-1 |
| Blue-M | Convection Oven for Thermal Cure | Maximum Temperature of 300ºC | DCC-256-C |
| Teknek | Contact Cleaner for Substrate Cleaning | Tacky Roll Cleaning of Both Sides of 12″ Wide Substrate | DeskTop12″N |
| Olympus | Optical Microscope | Optical Inspection with Image Recording/Display | BH-2 |
| Heraeus | UV Cure Conveyor | 2 1300M UV Lamp and Conveyor, Speed 1-21 fpm | DRS6-210 |
| Yamato | Forced Air Oven | Curing of Medical Device Components | DX602C |
| COMPANY NAME | DESCRIPTION | PROCESS CAPABILITY | MODEL # |
| Anton Paar | Rheometer | Characterization of Printable Materials | MCR302 |
| Flacktek | Speed Mixer | Laboratory Mixing System | DAC 800.2 VAC LR |
| Print Head Doctor | Automated Ink Jet Head Cleaner | Recovery of solvent, UV and water-based print heads | PHD11 |
| Rhinotech | High Pressure Print Screen Washer | Automated washer with traveling, two-headed rotating spray wand | HP2536 |
| COMPANY NAME | DESCRIPTION | PROCESS CAPABILITY | MODEL # |
| Yield Engineering Systems | Plasma Asher | Multi-gas plasma wafer cleaning | YES-R1 |
| DISCO | Wafer Dicer | Dicing of wafers as part of dice-before-grind (DBG) process | DFD6360 |
| DISCO | Wafer Plasma Treatment | Plasma stress relief after DBG | FRFH-01 |
| K&S | Stud Bumper | Wafer level stud bumping and wire bonding. Low temperature gold bumping. Bond placement accuracy of 3.5µm @ 3 sigma | ATPremier Plus |
Assembly Lab Equipment
| COMPANY NAME | DESCRIPTION | PROCESS CAPABILITY | MODEL # |
| Besi Datacon | Die Bonder and PnP with Flipchip | Die Bonding to Substrates (from Wafer/Gelpak or Tray), +/- 10 µm Accuracy | 2200 evo |
| Universal Instrument Corp. | SMT PnP | SMT PnP Tool from Tape/Tray | Fuzion 1-30 |
| systeMECH | Precision Transfer Print System | Development of FHE Assembly Using Novel Transfer Print Methodology | PBDT |
| Nordson – ASYMTEK | Precision Dispense on X-Y Table | Interchangeable Dispense Heads for Adhesive/Inks/Encapsulation | D-585 Dispensemate |
| TPS – Blue M | Convection Oven for Thermal Cure | Maximum Temperature of 250ºC, Nitrogen Blanketing Available | DC-256-B-ST350 |
| Burton | Heated Press for Molding/Encapsulation | 13 Ton Heated Press with Adjustable Speed, Pressure, and Temperature | HP-800 |
| Elmarco | Conductive Fiber Spinning | Electrostatic Spinning of Doped Conductive Fibers for Textile Embedding | NS LAB 500 |
| UVP (Ultra-Violet Products Ltd) | High Intensity UV Lamp (365 nm) for Inspection | Fluoresces Contamination/Particles During Manual Inspection of Substrates | B-100AP |
| ProLam | Heated Roll Laminator – 12″ Wide | Adjustable Temperature, Speed and Nip Pressure | PL-1200 |
| Salvis Lab | Vacuum Oven | Vacuum, Nitrogen Purge, Maximum Temperature of 200ºC | VC-20 |
| Fanuc | Robotic Arm | Precision Placement and Assembly | SR-3iA |
| NSW | Dual head jet dispense | Jet dispense two adhesives simultaneously using two Vermes MDS-3280 jet dispensers | S400M |
| FineTech | Manual Die Bonder | Manual multi-purpose bonder; heated stage and tool; 5um placement accuracy | FINEPLACER pico ma |
| Digital Knight | Laminator/Swing-away press | 16 x 20” area, max. temperature 315ºC | DK20SP |
| Leica | Optical Microscope | Optical Inspection up to 55X with image recording | S9i |
Test Lab Equipment
| COMPANY NAME | DESCRIPTION | PROCESS CAPABILITY | MODEL # |
| TestEquity | Temperature Chamber (Environmental Testing) | Temperature Range from 23ºC to 175ºC | 115 |
| TestEquity | Temperature Humidity Chamber (Environmental Testing) 1 and 2 | Temperature Range from -73ºC to +175ºC, RH 10% to 98% | 1007H |
| Cincinnati Sub-Zero | Temperature Humidity Chamber (Environmental Testing) | Rapid Cycling, Temperature Range -73ºC to +190ºC, RH 10% to 98% | ZPHS-8 |
| Q-Lab | Xenon Test Chamber for Sunlight Exposure | Multiple Irradiance Ranges, Various Filters Available | Xe-3-B |
| Jovil Manufacturing Co. | Fatigue-Ductility Flex Testing | Flexural Fatigue Life at Various Bend Radii | 3FDF |
| Nikon | Optical Microscope | Manual Inspection 10X–50X | SMZ1000 |
| Yuasa | Endurance Tester | Tension-free Folding | ET254M002 |
| Yuasa | Cycling Stretch Tester Units 1 and 2 | Mechanical Cyclic Testing of FHE Circuits | DX-ST ST1500100-ST |
| Micromanipulator | Probe Station | Probe Circuit/Component Test Points | 450PM-A |
| Formlabs | 3D Print, Clean and Cure | Rapid Prototype and Build of 3-Dimensional Parts | Form 2 |
| Stäubli | 6-axis Robotic Tool | Multi-function robotic FHE tool incl. high resolution Keyence vision system, print heads and tool changer | TX2-60 |
| Space Foundry | Plasma Jet Printer | Print head capable of depositing a variety of materials sequentially. Installed on Stäubli tool | PJP5050-D-L-O |
| Resource Engineering, Inc. | Large 5-axis motion machine | Precise multi-modal and conformal printing on large parts | N/A |