Member Login

Tech Hub Equipment

Equipment and tools available at
the NextFlex Technology Hub

Print Lab Equipment

Company Name Description Process Capability Model #
Optomec Digital Printing on 3D Surfaces 5 Axes of Motion, Down to 5 μm Features Aerosol Jet 5X
nScrypt Multifunction FHE Tool Printing, PnP, Micromachining, and 3D Printing 3Dn-500
Komori Offset Gravure Press for Fine Feature Printing Development of Alternate Process for Fineline (10 μm) Printing PEPIO F6
Meyer Burger Automation / Integration Connects the Meyer Burger Tools Below CONx
Meyer Burger Digital Print Dispensing Units 1 and 2 Digital Printing with Wide Array of Print Heads for Fine Line CONx: PiXDRO IP410
Meyer Burger PECVD Deposition of Thin Films Deposit Insulating Films for Multilayer Applications CONx: FLEx
Fujifilm – Dimatix Tabletop Inkjet Printing Printing Down to 100 μm, Developing Narrower Print Traces DMP-2850
HMI Screen Print Conductor/ Solder (500mm × 500mm Frame) Automatic Flood/Squeegee Bar, High Resolution Vision System MSP-9156C
ESI Laser Ablation, Via Drilling, Dicing Laser Via Drilling and Precision Laser Micromachining LodeStone
Optomec Aerosol Jet 5X
  • Digital Printing on 3D Surfaces
  • 5 Axes of Motion, Down to 5 μm Features
nScrypt 3Dn-500
  • Multifunction FHE Tool
  • Printing, PnP, Micromachining, and 3D Printing
Komori PEPIO F6
  • Offset Gravure Press for Fine Feature Printing
  • Development of Alternate Process for Fineline (10 μm) Printing
Meyer Burger CONx
  • Automation / Integration
  • Connects the Meyer Burger Tools Below
Meyer Burger CONx: PiXDRO IP410
  • Digital Print Dispensing Units 1 and 2
  • Digital Printing with Wide Array of Print Heads for Fine Line
Meyer Burger CONx: FLEx
  • PECVD Deposition of Thin Films
  • Deposit Insulating Films for Multilayer Applications
Fujifilm – Dimatix DMP-2850
  • Tabletop Inkjet Printing
  • Printing Down to 100 μm, Developing Narrower Print Traces
HMI MSP-9156C
  • Screen Print Conductor/ Solder (500mm × 500mm Frame)
  • Automatic Flood/Squeegee Bar, High Resolution Vision System
ESI LodeStone
  • Laser Ablation, Via Drilling, Dicing
  • Laser Via Drilling and Precision Laser Micromachining

Company Name Description Process Capability Model #
BTU International Thermal Cure Conveyor Oven (8 Zone) Cure Film Substrates up to 350°C PYRAMAX 100N
adphos IR Cure Conveyor 5.5kW Power on 10″ × 12″ Substrate Mini Lab 230V/25A
Uvitron International UV Flood Cure Lamp 100MW/sq cm Power, (320–390 nm Wavelength) Sunray 400 SM
Salvis Lab Vacuum Oven Vacuum, Nitrogen Purge, Maximum Temperature of 200°C VC-20
TestEquity Forced Air Oven Maximum Temperature of 250°C FS4-1
Blue-M Convection Oven for Thermal Cure Maximum Temperature of 300°C DCC-256-C
Northfield Automation Unwind and Rewind Stands 21″ Wide Web, Tension Feedback Control, Variable speed 4270
Teknek Contact Cleaner for Substrate Cleaning Tacky Roll Cleaning of Both Sides of 12″ Wide Substrate DeskTop12″N
Olympus Optical Microscope Optical Inspection with Image Recording/ Display BH-2
Heraeus UV Cure Conveyor 2 I300M UV Lamp and Conveyor, Speed 1–21 fpm DRS6-210
BTU International PYRAMAX 100A
  • Thermal Cure Conveyor Oven (8 Zone)
  • Cure Film Substrates up to 350°C
adphos Mini Lab 230V/25A
  • IR Cure Conveyor
  • 5.5kW Power on 10″ × 12″ Substrate
Uvitron International Sunray 400 SM
  • UV Flood Cure Lamp
  • 100MW/sq cm Power, (320–390 nm Wavelength)
Salvis Lab VC-20
  • Vacuum Oven
  • Vacuum, Nitrogen Purge, Maximum Temperature of 200°C
TestEquity FS4-1
  • Forced Air Oven
  • Maximum Temperature of 250°C
Blue-M DCC-256-C
  • Convection Oven for Thermal Cure
  • Maximum Temperature of 300°C
Northfield Automation 4270
  • Unwind and Rewind Stands
  • 21″ Wide Web, Tension Feedback Control, Variable speed
Teknek DeskTop12″N
  • Contact Cleaner for Substrate Cleaning
  • Tacky Roll Cleaning of Both Sides of 12″ Wide Substrate
Olympus BH-2
  • Optical Microscope
  • Optical Inspection with Image Recording/ Display
Heraeus DRS6-210
  • UV Cure Conveyor
  • 2 I300M UV Lamp and Conveyor, Speed 1–21 fpm

Company Name Description Process Capability Model #
Anton Paar Rheometer Characterization of Printable Materials MCR302
Flacktek Speed Mixer Laboratory Mixing System DAC 800.2 VAC LR
Labconco 6 ft Face for Chemical Processing Safe Environment Handling of Various Chemical Processes Custom
DualDraw Laminar Flow Processing Laminar Flow Processing and Solvent Scrubbing CleanAir
Thermo Fisher Scientific Water Bath (Dual Basin) 1.5 gal Capacity, 100°C Max Temperature 2853
TovaTech Tabletop Ultransonic Cleaning Bath 5 L Capacity, 37 kHz Frequency S-70H
Sartorius Analytical Balance Weight Range of 0.0001–100 gm BA-110S
EchoTherm Hot Plate Maximum Temperature of 400°C HP-30
Anton Paar MCR302
  • Rheometer
  • Characterization of Printable Materials
Flacktek DAC 800.2 VAC LR
  • Speed Mixer
  • Laboratory Mixing System
Labconco Custom
  • 6 ft Face for Chemical Processing
  • Safe Environment Handling of Various Chemical Processes
DualDraw CleanAir
  • Laminar Flow Processing
  • Laminar Flow Processing and Solvent Scrubbing
Thermo Fisher Scientific 2853
  • Water Bath (Dual Basin)
  • 1.5 gal Capacity, 100°C Max Temperature
TovaTech S-70H
  • Tabletop Ultransonic Cleaning Bath
  • 5 L Capacity, 37 kHz Frequency
Sartorius BA-110S
  • Analytical Balance
  • Weight Range of 0.0001–100 gm
EchoTherm HP-30
  • Hot Plate
  • Maximum Temperature of 400°C

Assembly Lab Equipment

Company Name Description Process Capability Model #
Besi Datacon Die Bonder and PnP with Flipchip Die Bonding to Substrates (from Wafer/ Gelpak or Tray), +/- 5 μm Accuracy 2200 evo
ConnecTec Low Temp Flipchip Die Bonding System Print, Dispense, and Low Temp Die Bonding Tool Group CB-1810
Universal Instrument Corp. SMT PnP SMT PnP Tool from Tape/Tray Fuzion 1-30
systeMECH Precision Transfer Print System Development of FHE Assembly Using Novel Transfer Print Methodology PBDT
Sensor Films (2019) Multi-Depositon/Cure/ Assembly Tool Integrated Additive Manufacturing System with Photonic Cure Starlight / UFlex / Pulse Forge
Nordson – ASYMTEK Precision Dispense on X-Y Table Interchangeable Dispense Heads for Adhesive/Inks/Encapsulation D-585 Dispensemate
Terra Universal Dry Cart Storage of sensitive materials including wafers and WIP Custom
TPS – Blue M Convection Oven for Thermal Cure Maximum Temperature of 250°C, Nitrogen Blanketing Available DC-256-B- ST350
Burton Heated Press for Molding/ Encapsulation 13 Ton Heated Press with Adjustable Speed, Pressure, and Temperature HP-800
Elmarco Conductive Fiber Spinning Electrostatic Spinning of Doped Conductive Fibers for Textile Embedding NS LAB 500
Mbraun Glove Box Inert Processing/Storage Nitrogen Atmosphere with Oxygen/Moisture Sensing Custom
UVP (Ultra-Violet Products Ltd) High Intensity UV Lamp (365 nm) for Inspection Flouresces Contamination/Particles During Manual Inspection of Substrates B-100AP
ProLam Heated Roll Laminator – 12″ Wide Adjustable Temperature, Speed and Nip Pressure PL-1200
Vermes Micro Dispensing Very Small Dot Dispense for Fine Pitch Assembly and Flip Chip MDS-3280
Besi Datacon 2200 evo
  • Die Bonder and PnP with Flipchip
  • Die Bonding to Substrates (from Wafer/ Gelpak or Tray), +/- 5 μm Accuracy
ConnecTec CB-1810
  • Low Temp Flipchip Die Bonding System
  • Print, Dispense, and Low Temp Die Bonding Tool Group
Universal Instrument Corp. Fuzion 1-30
  • SMT PnP
  • SMT PnP Tool from Tape/Tray
systeMECH PBDT
  • Precision Transfer Print System
  • Development of FHE Assembly Using Novel Transfer Print Methodology
Sensor Films (2019) Starlight / UFlex / Pulse Forge
  • Multi-Depositon/Cure/ Assembly Tool
  • Integrated Additive Manufacturing System with Photonic Cure
Nordson – ASYMTEK
  • Precision Dispense on X-Y Table
  • Interchangeable Dispense Heads for Adhesive/Inks/Encapsulation
  • D-585 Dispensemate
Terra Universal Custom
  • Dry Cart
  • Storage of sensitive materials including wafers and WIP
TPS – Blue M DC-256-B-ST350
  • Convection Oven for Thermal Cure
  • Maximum Temperature of 250°C, Nitrogen Blanketing Available
Burton HP-800
  • Heated Press for Molding/ Encapsulation
  • 13 Ton Heated Press with Adjustable Speed, Pressure, and Temperature
Elmarco NS LAB 500
  • Conductive Fiber Spinning
  • Electrostatic Spinning of Doped Conductive Fibers for Textile Embedding
Mbraun Glove Box Custom
  • Inert Processing/Storage
  • Nitrogen Atmosphere with Oxygen/Moisture Sensing
UVP (Ultra-Violet Products Ltd) B-100AP
  • High Intensity UV Lamp (365 nm) for Inspection
  • Flouresces Contamination/Particles During Manual Inspection of Substrates
ProLamPL-1200
  • Heated Roll Laminator – 12″ Wide
  • Adjustable Temperature, Speed and Nip Pressure
Vermes MDS-3280
  • Micro Dispensing
  • Very Small Dot Dispense for Fine Pitch Assembly and Flip Chip

Test Lab Equipment

Company Name Description Process Capability Model #
TestEquity Temperature Chamber (Environment Testing) Temperature Range from 23°C to 175°C 115
TestEquity Temperature Humidity Chamber (Environment Testing) Units 1 and 2 Temperature Range from -73°C to +175°C, RH 10% to 98% 1007H
Cincinnati Sub-Zero Temperature Humidity Chamber (Environment Testing) Rapid Cycling, Temperature Range -73°C to +190°C, RH 10% to 98% ZPHS-8
Q-Labs Xenon Test Chamber for Sunlight Exposure Multiple Irradiance Ranges, Various Filters Available Xe-3-B
Imada, Inc Tensile Testing (Ds2-44R Digital Force Gauge) Maximum 2 kg Force, Variable Speed Settings for Stress/Strain Determination MV-500-SA
Jovil Manufacturing Co. Fatigue-Ductility Flex Testing Flexural Fatigue Life at Various Bend Radii 3FDF
Nikon Optical Microscope Manual Inspection 10X–50X SMZ1000
Keyence Confocal Laser Scanning Microscope for Nano-Scale Inspection 3D Confocal Microscope for Surface Inspection Display Resolution 1 nm VK-200K
FocalSpec Confocal White Light Scanning Microscope for Large Areas 3D Confocal Microscope for Surface Inspection, Diplay Resolution 1 μm UULA
Yuasa Endurance Tester Tension-free Folding ET254M002
Yuasa Cycling Stretch Tester Units 1 and 2 Mechanical Cyclic Testing of FHE Circuits DX-ST ST1500100-ST
TestEquity 115
  • Temperature Chamber (Environment Testing)
  • Temperature Range from 23°C to 175°C
TestEquity 1007H
  • Temperature Humidity Chamber (Environment Testing) Units 1 and 2
  • Temperature Range from -73°C to +175°C, RH 10% to 98%
Cincinnati Sub-Zero ZPHS-8
  • Temperature Humidity Chamber (Environment Testing)
  • Rapid Cycling, Temperature Range -73°C to +190°C, RH 10% to 98%
Q-Labs Xe-3-B
  • Xenon Test Chamber for Sunlight Exposure
  • Multiple Irradiance Ranges, Various Filters Available
Imada, Inc MV-500-SA
  • Tensile Testing (Ds2-44R Digital Force Gauge)
  • Maximum 2 kg Force, Variable Speed Settings for Stress/Strain Determination
Jovil Manufacturing Co. 3FDF
  • Fatigue-Ductility Flex Testing
  • Flexural Fatigue Life at Various Bend Radii
Nikon SMZ1000
  • Optical Microscope
  • Manual Inspection 10X–50X
Keyence VK-200K
  • Confocal Laser Scanning Microscope for Nano-Scale Inspection
  • 3D Confocal Microscope for Surface Inspection Display Resolution 1 nm
FocalSpec UULA
  • Confocal White Light Scanning Microscope for Large Areas
  • 3D Confocal Microscope for Surface Inspection, Diplay Resolution 0.5 μm
Yuasa ET254M002
  • Endurance Tester
  • Tension-free Folding
Yuasa DX-ST ST1500100-ST
  • Cycling Stretch Tester Units 1 and 2
  • Mechanical Cyclic Testing of FHE Circuits

Download Our Equipment List

Enter your email address below and we will send you our full equipment list as a PDF

Send me the list

Stay up to date with the latest from NextFlex

  • This field is for validation purposes and should be left unchanged.