Tech Hub Equipment
Equipment and tools available at
the NextFlex Technology Hub
Print Lab Equipment
| COMPANY NAME | DESCRIPTION | PROCESS CAPABILITY | MODEL # |
| Optomec | Aerosol Jet 5X | Digital Printing on 3D Surfaces | 5 Axes of Motion, down to 5 µm Features |
| nScrypt | 3Dn-500 | Multifunction FHE Tool | Printing, PnP, Micromachining, and 3D Printing |
| Komori | PEPIO F6 | Offset Gravure Press for Fine Feature Printing | Development of Alternate Process for Fine Line (10 µm) Printing |
| Space Foundry | Printer: 74.3.3 Printhead: #135.3 |
Plasma-jet deposition system | Dry Print Process Tailors Ink Material Properties In-situ, Improved Adhesion |
| SUSS | PiXDRO IP410 | Digital Print Dispensing Units 1 and 2 | Digital Printing with Wide Array of Print Heads for Fine Line |
| SMIT | FLEx | PECVD Deposition of Thin Films | Deposit Insulating Films for Multilayer Applications |
| Fujifilm – Dimatix | DMP-2850 | Tabletop Inkjet Printing | Printing Down to 100 µm, Developing Narrower Print Traces |
| HMI | MSP-9156C | Screen Print Conductor/Solder (500mm × 500mm Frame) | Automatic Flood/Squeegee Bar, High Resolution Vision System |
| IDS | Nanojet | Aerosol Printer | High Resolution Aerosol Printing <<35µm Resolution on 3 Motion Axes |
| ChemCubed | ElectroUV3D | UV LED Flatbed Inkjet Printer | Fine Detail Deposition of Conductive Liquids |
| ESI | LodeStone | Laser Ablation, Via Drilling, Dicing | Laser Via Drilling and Precision Laser Micromachining |
| LPKF | R4 | Laser Ablation, Via Drilling, Dicing | Laser Via Drilling and Precision Laser Micromachining |
| Keyence | VK-X200K | Confocal Laser Scanning Microscope for Nano-Scale Inspection | 3D Confocal Microscope for Surface Inspection Display Resolution 1 nm |
| ScanCAD International | ScanINSPECT | High Precision Flat Bed Scanner | Screen/Stencil/Image Inspection |
| Anton Paar | MCR302 | Rheometer | Characterization of Printable Materials |
| ramé-hart | 250-U4 | Goniometer/Tensiometer | Contact Angle Measurement |
| Flacktek | DAC 800.2 VAC LR | Speed Mixer | Laboratory Mixing System |
| Print Head Doctor | PHD11 | Automated Ink Jet Head Cleaner | Recovery of Solvent, UV and Water-Based Print Heads |
| Rhinotech | HP2536 | High Pressure Print Screen Washer | Automated Washer with Traveling, Two-Headed Rotating Spray Wand |
| Voltera | Nova | Extrusion Print Tool | Print & Drill Rapid Prototyping Tool |
| COMPANY NAME | DESCRIPTION | PROCESS CAPABILITY | MODEL # |
| BTU International | PYRAMAX 100N | Thermal Cure Conveyor Oven (8 Zone) | Cure Film Substrates up to 350ºC with Nitrogen |
| TestEquity | FS4-1 | Forced Air Oven | Maximum Temperature of 250ºC |
| TPS – Blue-M | DCC-256-C | Convection Oven for Thermal Cure | Maximum Temperature of 200ºC, Nitrogen Blanketing Available |
| Yamato | DX602C | Forced Air Oven | Curing of Medical Device Components |
| PulseForge | Invent 30 | Photonic Curing and Soldering | Sintering, Soldering, Drying of Inks, Solder Pastes, Plastics, Crystals on PET, Polyimide, Paper or Textiles |
| Heraeus | DRS6-210 | UV Cure Conveyor | 2 1300M UV Lamp and Conveyor, Speed 1-21 fpm |
| Uvitron International | Sunray 400 SM | UV Flood Cure Lamp | 100MW/sq cm Power, 320–390 nm Wavelength |
| adphos | Mini Lab 230V/25A | IR Cure Conveyor | 5.5kW Power on 10″ × 12″ Substrate |
| Teknek | DeskTop12″N | Contact Cleaner for Substrate Cleaning | Tacky Roll Cleaning of Both Sides of 12″ Wide Substrate |
| COMPANY NAME | DESCRIPTION | PROCESS CAPABILITY | MODEL # |
| Yield Engineering Systems | YES-R1 | Plasma Asher | Multi-Gas Plasma Wafer Cleaning |
| K&S | ATPremier Plus | Stud Bumper | Wafer Level Stud Bumping and Wire Bonding. Low Temperature Gold Bumping. Bond Placement Accuracy of 3.5µm @ 3 Sigma |
Assembly Lab Equipment
| COMPANY NAME | DESCRIPTION | PROCESS CAPABILITY | MODEL # |
| Besi Datacon | 2200 evo | Die Bonder and PnP with Flipchip | Die Bonding to Substrates (from Wafer/Gelpak or Tray),
+/- 10 µm Accuracy |
| Universal Instruments Corp. | Fuzion 1-30 | Pick and Place | PnP Tool from Tape/Tray/Wafer Feeder |
| Universal Instruments Corp. | HSWF | High-speed Wafer Feeder | 52 Thin Wafer Handling, Eject, Flip Processing |
| FineTech | FINEPLACER pico ma | Manual Die Bonder | Manual Multi-Purpose Bonder; Heated Stage and Tool; 5um Placement Accuracy |
| Elmarco | NS LAB 500 | Conductive Fiber Spinning | Electrostatic Spinning of Doped Conductive Fibers for Textile Embedding |
| UVP (Ultra-Violet Products Ltd) | B-100AP | High Intensity UV Lamp (365 nm) for Inspection | Fluoresces Contamination/Particles During Manual Inspection of Substrates |
| NSW | S400M | Dual Head Jet Dispenser | Jet-Dispense Two Adhesives Simultaneously Using Two Vermes MDS-3280 Jet Dispensers |
| ProLam | PL-1200 | Heated Roll Laminator – 12″ Wide | Adjustable Temperature, Speed and Nip Pressure |
| Digital Knight | DK20SP | Laminator/Swing-away press | 16 X 20” Area, Max. Temperature 315ºC |
| Leica | S9i | Optical Microscope | Optical Inspection Up to 55X with Image Recording |
Test Lab Equipment
| COMPANY NAME | DESCRIPTION | PROCESS CAPABILITY | MODEL # |
| TestEquity | 115 | Temperature Chamber (Environmental Testing) | Temperature Range from 23ºC to 175ºC |
| TestEquity | 1007H | Temperature Humidity Chamber (Environmental Testing) 1 and 2 | Temperature Range from -73ºC to +175ºC, RH 10% to 98% |
| Cincinnati Sub-Zero | ZPHS-8 | Temperature Humidity Chamber (Environmental Testing) | Rapid Cycling, Temperature Range -73ºC to +190ºC, RH 10% to 98% |
| Q-Lab | Xe-3-B | Xenon Test Chamber for Sunlight Exposure | Multiple Irradiance Ranges, Various Filters Available |
| Nordson Dage | 4000 PLUS | Bond Tester | Die/Component Shear, Wire Pull and Bump Shear Testing |
| Jovil Manufacturing Co. | 3FDF | Fatigue-Ductility Flex Testing | Flexural Fatigue Life at Various Bend Radii |
| Yuasa | ET254M002 | Endurance Tester | Tension-Free Folding |
| Yuasa | DX-ST ST1500100-ST | Cycling Stretch Tester Units 1 and 2 | Mechanical Cyclic Testing of FHE Circuits |
| Micromanipulator | 450PM-A | Probe Station | Probe Circuit/Component Test Points |
| Fanuc | SR-3iA | Robotic Arm | Precision Placement and Assembly |
| NextFlex/Stäubli | TX2-60 | 6-axis Robotic Tool and Tool Changer | Multi-Function Robotic FHE Tool Incl. High Resolution Keyence Vision System, Print Heads and More |
| Resource Engineering, Inc. | N/A | Large 5-axis motion machine | Precise Multi-Modal and Conformal Printing on Large Parts |
Post-Processing Lab Equipment
| COMPANY NAME | DESCRIPTION | PROCESS CAPABILITY | MODEL # |
| Salvis Lab | VC-20 | Vacuum Oven | Vacuum, Nitrogen Purge, Maximum Temperature of 200ºC |
| Formlabs | Form 2 | 3D Print, Clean and Cure | Rapid Prototype and Build of 3-Dimensional Parts |
| Nicomatic | 10025-MO | Connector Crimping Tool | Crimps up to 24 Connectors at 2.54mm Pitch |
Explore the NextFlex Technology Hub with this interactive virtual tour: