Tech Hub Equipment
Equipment and tools available at
the NextFlex Technology Hub
Print Lab Equipment
| Company Name | Description | Process Capability | Model # |
|---|---|---|---|
| Optomec | Digital Printing on 3D Surfaces | 5 Axes of Motion, Down to 5 μm Features | Aerosol Jet 5X |
| nScrypt | Multifunction FHE Tool | Printing, PnP, Micromachining, and 3D Printing | 3Dn-500 |
| Komori | Offset Gravure Press for Fine Feature Printing | Development of Alternate Process for Fineline (10 μm) Printing | PEPIO F6 |
| Meyer Burger | Automation / Integration | Connects the Meyer Burger Tools Below | CONx |
| Meyer Burger | Digital Print Dispensing Units 1 and 2 | Digital Printing with Wide Array of Print Heads for Fine Line | CONx: PiXDRO IP410 |
| Meyer Burger | PECVD Deposition of Thin Films | Deposit Insulating Films for Multilayer Applications | CONx: FLEx |
| Fujifilm – Dimatix | Tabletop Inkjet Printing | Printing Down to 100 μm, Developing Narrower Print Traces | DMP-2850 |
| HMI | Screen Print Conductor/ Solder (500mm × 500mm Frame) | Automatic Flood/Squeegee Bar, High Resolution Vision System | MSP-9156C |
| ESI | Laser Ablation, Via Drilling, Dicing | Laser Via Drilling and Precision Laser Micromachining | LodeStone |
Optomec Aerosol Jet 5X
- Digital Printing on 3D Surfaces
- 5 Axes of Motion, Down to 5 μm Features
nScrypt 3Dn-500
- Multifunction FHE Tool
- Printing, PnP, Micromachining, and 3D Printing
Komori PEPIO F6
- Offset Gravure Press for Fine Feature Printing
- Development of Alternate Process for Fineline (10 μm) Printing
Meyer Burger CONx
- Automation / Integration
- Connects the Meyer Burger Tools Below
Meyer Burger CONx: PiXDRO IP410
- Digital Print Dispensing Units 1 and 2
- Digital Printing with Wide Array of Print Heads for Fine Line
Meyer Burger CONx: FLEx
- PECVD Deposition of Thin Films
- Deposit Insulating Films for Multilayer Applications
Fujifilm – Dimatix DMP-2850
- Tabletop Inkjet Printing
- Printing Down to 100 μm, Developing Narrower Print Traces
HMI MSP-9156C
- Screen Print Conductor/ Solder (500mm × 500mm Frame)
- Automatic Flood/Squeegee Bar, High Resolution Vision System
ESI LodeStone
- Laser Ablation, Via Drilling, Dicing
- Laser Via Drilling and Precision Laser Micromachining
| Company Name | Description | Process Capability | Model # |
|---|---|---|---|
| BTU International | Thermal Cure Conveyor Oven (8 Zone) | Cure Film Substrates up to 350°C | PYRAMAX 100N |
| adphos | IR Cure Conveyor | 5.5kW Power on 10″ × 12″ Substrate | Mini Lab 230V/25A |
| Uvitron International | UV Flood Cure Lamp | 100MW/sq cm Power, (320–390 nm Wavelength) | Sunray 400 SM |
| Salvis Lab | Vacuum Oven | Vacuum, Nitrogen Purge, Maximum Temperature of 200°C | VC-20 |
| TestEquity | Forced Air Oven | Maximum Temperature of 250°C | FS4-1 |
| Blue-M | Convection Oven for Thermal Cure | Maximum Temperature of 300°C | DCC-256-C |
| Northfield Automation | Unwind and Rewind Stands | 21″ Wide Web, Tension Feedback Control, Variable speed | 4270 |
| Teknek | Contact Cleaner for Substrate Cleaning | Tacky Roll Cleaning of Both Sides of 12″ Wide Substrate | DeskTop12″N |
| Olympus | Optical Microscope | Optical Inspection with Image Recording/ Display | BH-2 |
| Heraeus | UV Cure Conveyor | 2 I300M UV Lamp and Conveyor, Speed 1–21 fpm | DRS6-210 |
BTU International PYRAMAX 100A
- Thermal Cure Conveyor Oven (8 Zone)
- Cure Film Substrates up to 350°C
adphos Mini Lab 230V/25A
- IR Cure Conveyor
- 5.5kW Power on 10″ × 12″ Substrate
Uvitron International Sunray 400 SM
- UV Flood Cure Lamp
- 100MW/sq cm Power, (320–390 nm Wavelength)
Salvis Lab VC-20
- Vacuum Oven
- Vacuum, Nitrogen Purge, Maximum Temperature of 200°C
TestEquity FS4-1
- Forced Air Oven
- Maximum Temperature of 250°C
Blue-M DCC-256-C
- Convection Oven for Thermal Cure
- Maximum Temperature of 300°C
Northfield Automation 4270
- Unwind and Rewind Stands
- 21″ Wide Web, Tension Feedback Control, Variable speed
Teknek DeskTop12″N
- Contact Cleaner for Substrate Cleaning
- Tacky Roll Cleaning of Both Sides of 12″ Wide Substrate
Olympus BH-2
- Optical Microscope
- Optical Inspection with Image Recording/ Display
Heraeus DRS6-210
- UV Cure Conveyor
- 2 I300M UV Lamp and Conveyor, Speed 1–21 fpm
| Company Name | Description | Process Capability | Model # |
|---|---|---|---|
| Anton Paar | Rheometer | Characterization of Printable Materials | MCR302 |
| Flacktek | Speed Mixer | Laboratory Mixing System | DAC 800.2 VAC LR |
| Labconco | 6 ft Face for Chemical Processing | Safe Environment Handling of Various Chemical Processes | Custom |
| DualDraw | Laminar Flow Processing | Laminar Flow Processing and Solvent Scrubbing | CleanAir |
| Thermo Fisher Scientific | Water Bath (Dual Basin) | 1.5 gal Capacity, 100°C Max Temperature | 2853 |
| TovaTech | Tabletop Ultransonic Cleaning Bath | 5 L Capacity, 37 kHz Frequency | S-70H |
| Sartorius | Analytical Balance | Weight Range of 0.0001–100 gm | BA-110S |
| EchoTherm | Hot Plate | Maximum Temperature of 400°C | HP-30 |
Anton Paar MCR302
- Rheometer
- Characterization of Printable Materials
Flacktek DAC 800.2 VAC LR
- Speed Mixer
- Laboratory Mixing System
Labconco Custom
- 6 ft Face for Chemical Processing
- Safe Environment Handling of Various Chemical Processes
DualDraw CleanAir
- Laminar Flow Processing
- Laminar Flow Processing and Solvent Scrubbing
Thermo Fisher Scientific 2853
- Water Bath (Dual Basin)
- 1.5 gal Capacity, 100°C Max Temperature
TovaTech S-70H
- Tabletop Ultransonic Cleaning Bath
- 5 L Capacity, 37 kHz Frequency
Sartorius BA-110S
- Analytical Balance
- Weight Range of 0.0001–100 gm
EchoTherm HP-30
- Hot Plate
- Maximum Temperature of 400°C
Assembly Lab Equipment
| Company Name | Description | Process Capability | Model # |
|---|---|---|---|
| Besi Datacon | Die Bonder and PnP with Flipchip | Die Bonding to Substrates (from Wafer/ Gelpak or Tray), +/- 5 μm Accuracy | 2200 evo |
| ConnecTec | Low Temp Flipchip Die Bonding System | Print, Dispense, and Low Temp Die Bonding Tool Group | CB-1810 |
| Universal Instrument Corp. | SMT PnP | SMT PnP Tool from Tape/Tray | Fuzion 1-30 |
| systeMECH | Precision Transfer Print System | Development of FHE Assembly Using Novel Transfer Print Methodology | PBDT |
| Sensor Films (2019) | Multi-Depositon/Cure/ Assembly Tool | Integrated Additive Manufacturing System with Photonic Cure | Starlight / UFlex / Pulse Forge |
| Nordson – ASYMTEK | Precision Dispense on X-Y Table | Interchangeable Dispense Heads for Adhesive/Inks/Encapsulation | D-585 Dispensemate |
| Terra Universal | Dry Cart | Storage of sensitive materials including wafers and WIP | Custom |
| TPS – Blue M | Convection Oven for Thermal Cure | Maximum Temperature of 250°C, Nitrogen Blanketing Available | DC-256-B- ST350 |
| Burton | Heated Press for Molding/ Encapsulation | 13 Ton Heated Press with Adjustable Speed, Pressure, and Temperature | HP-800 |
| Elmarco | Conductive Fiber Spinning | Electrostatic Spinning of Doped Conductive Fibers for Textile Embedding | NS LAB 500 |
| Mbraun Glove Box | Inert Processing/Storage | Nitrogen Atmosphere with Oxygen/Moisture Sensing | Custom |
| UVP (Ultra-Violet Products Ltd) | High Intensity UV Lamp (365 nm) for Inspection | Flouresces Contamination/Particles During Manual Inspection of Substrates | B-100AP |
| ProLam | Heated Roll Laminator – 12″ Wide | Adjustable Temperature, Speed and Nip Pressure | PL-1200 |
| Vermes | Micro Dispensing | Very Small Dot Dispense for Fine Pitch Assembly and Flip Chip | MDS-3280 |
Besi Datacon 2200 evo
- Die Bonder and PnP with Flipchip
- Die Bonding to Substrates (from Wafer/ Gelpak or Tray), +/- 5 μm Accuracy
ConnecTec CB-1810
- Low Temp Flipchip Die Bonding System
- Print, Dispense, and Low Temp Die Bonding Tool Group
Universal Instrument Corp. Fuzion 1-30
- SMT PnP
- SMT PnP Tool from Tape/Tray
systeMECH PBDT
- Precision Transfer Print System
- Development of FHE Assembly Using Novel Transfer Print Methodology
Sensor Films (2019) Starlight / UFlex / Pulse Forge
- Multi-Depositon/Cure/ Assembly Tool
- Integrated Additive Manufacturing System with Photonic Cure
Nordson – ASYMTEK
- Precision Dispense on X-Y Table
- Interchangeable Dispense Heads for Adhesive/Inks/Encapsulation
- D-585 Dispensemate
Terra Universal Custom
- Dry Cart
- Storage of sensitive materials including wafers and WIP
TPS – Blue M DC-256-B-ST350
- Convection Oven for Thermal Cure
- Maximum Temperature of 250°C, Nitrogen Blanketing Available
Burton HP-800
- Heated Press for Molding/ Encapsulation
- 13 Ton Heated Press with Adjustable Speed, Pressure, and Temperature
Elmarco NS LAB 500
- Conductive Fiber Spinning
- Electrostatic Spinning of Doped Conductive Fibers for Textile Embedding
Mbraun Glove Box Custom
- Inert Processing/Storage
- Nitrogen Atmosphere with Oxygen/Moisture Sensing
UVP (Ultra-Violet Products Ltd) B-100AP
- High Intensity UV Lamp (365 nm) for Inspection
- Flouresces Contamination/Particles During Manual Inspection of Substrates
ProLamPL-1200
- Heated Roll Laminator – 12″ Wide
- Adjustable Temperature, Speed and Nip Pressure
Vermes MDS-3280
- Micro Dispensing
- Very Small Dot Dispense for Fine Pitch Assembly and Flip Chip
Test Lab Equipment
| Company Name | Description | Process Capability | Model # |
|---|---|---|---|
| TestEquity | Temperature Chamber (Environment Testing) | Temperature Range from 23°C to 175°C | 115 |
| TestEquity | Temperature Humidity Chamber (Environment Testing) Units 1 and 2 | Temperature Range from -73°C to +175°C, RH 10% to 98% | 1007H |
| Cincinnati Sub-Zero | Temperature Humidity Chamber (Environment Testing) | Rapid Cycling, Temperature Range -73°C to +190°C, RH 10% to 98% | ZPHS-8 |
| Q-Labs | Xenon Test Chamber for Sunlight Exposure | Multiple Irradiance Ranges, Various Filters Available | Xe-3-B |
| Imada, Inc | Tensile Testing (Ds2-44R Digital Force Gauge) | Maximum 2 kg Force, Variable Speed Settings for Stress/Strain Determination | MV-500-SA |
| Jovil Manufacturing Co. | Fatigue-Ductility Flex Testing | Flexural Fatigue Life at Various Bend Radii | 3FDF |
| Nikon | Optical Microscope | Manual Inspection 10X–50X | SMZ1000 |
| Keyence | Confocal Laser Scanning Microscope for Nano-Scale Inspection | 3D Confocal Microscope for Surface Inspection, Display Resolution 1 nm | VK-200K |
| FocalSpec | Confocal White Light Scanning Microscope for Large Areas | 3D Confocal Microscope for Surface Inspection, Display Resolution 0.5 μm | UULA |
| Yuasa | Endurance Tester | Tension-free Folding | ET254M002 |
| Yuasa | Cycling Stretch Tester Units 1 and 2 | Mechanical Cyclic Testing of FHE Circuits | DX-ST ST1500100-ST |
TestEquity 115
- Temperature Chamber (Environment Testing)
- Temperature Range from 23°C to 175°C
TestEquity 1007H
- Temperature Humidity Chamber (Environment Testing) Units 1 and 2
- Temperature Range from -73°C to +175°C, RH 10% to 98%
Cincinnati Sub-Zero ZPHS-8
- Temperature Humidity Chamber (Environment Testing)
- Rapid Cycling, Temperature Range -73°C to +190°C, RH 10% to 98%
Q-Labs Xe-3-B
- Xenon Test Chamber for Sunlight Exposure
- Multiple Irradiance Ranges, Various Filters Available
Imada, Inc MV-500-SA
- Tensile Testing (Ds2-44R Digital Force Gauge)
- Maximum 2 kg Force, Variable Speed Settings for Stress/Strain Determination
Jovil Manufacturing Co. 3FDF
- Fatigue-Ductility Flex Testing
- Flexural Fatigue Life at Various Bend Radii
Nikon SMZ1000
- Optical Microscope
- Manual Inspection 10X–50X
Keyence VK-200K
- Confocal Laser Scanning Microscope for Nano-Scale Inspection
- 3D Confocal Microscope for Surface Inspection Display Resolution 1 nm
FocalSpec UULA
- Confocal White Light Scanning Microscope for Large Areas
- 3D Confocal Microscope for Surface Inspection, Diplay Resolution 0.5 μm
Yuasa ET254M002
- Endurance Tester
- Tension-free Folding
Yuasa DX-ST ST1500100-ST
- Cycling Stretch Tester Units 1 and 2
- Mechanical Cyclic Testing of FHE Circuits
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