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Tech Hub Equipment

Equipment and tools available at
the NextFlex Technology Hub

Print Lab Equipment

Optomec Digital Printing on 3D Surfaces 5 Axes of Motion, Down to 5 µm Features Aerosol Jet 5X
nScrypt Multifunction FHE Tool Printing, PnP, Micromachining, and 3D Printing 3Dn-500
Komori Offset Gravure Press for Fine Feature Printing Development of Alternate Process for Fine Line  (10 µm) Printing PEPIO F6
Space Foundry Plasma-jet deposition system Dry print process tailors ink material properties in-situ, improved adhesion Printer: 74.3.3
Printhead: #135.3
SUSS Digital Print Dispensing Units 1 and 2 Digital Printing with Wide Array of Print Heads for Fine Line PiXDRO IP410
SMIT PECVD Deposition of Thin Films  Deposit Insulating Films for Multilayer Applications FLEx
Fujifilm – Dimatix Tabletop Inkjet Printing Printing Down to 100 µm, Developing Narrower Print Traces DMP-2850
HMI Screen Print Conductor/Solder (500mm × 500mm Frame) Automatic Flood/Squeegee Bar, High Resolution Vision System MSP-9156C
ESI Laser Ablation, Via Drilling, Dicing  Laser Via Drilling and Precision Laser Micromachining LodeStone
Keyence Confocal Laser Scanning Microscope for Nano-Scale Inspection 3D Confocal Microscope for Surface Inspection Display Resolution 1 nm VK-X200K
ScanCAD International High Precision Flat Bed Scanner  Screen/Stencil/Image Inspection ScanINSPECT
IDS Aerosol Printer High resolution aerosol printing <<35µm resolution on 3 motion axes Nanojet

BTU International Thermal Cure Conveyor Oven (8 Zone) Cure Film Substrates up to 350ºC with Nitrogen PYRAMAX 100N
adphos IR Cure Conveyor 5.5kW Power on 10″ × 12″ Substrate Mini Lab 230V/25A
Uvitron International UV Flood Cure Lamp 100MW/sq cm Power, 320–390 nm Wavelength Sunray 400 SM
TestEquity Forced Air Oven Maximum Temperature of 250ºC FS4-1
Blue-M Convection Oven for Thermal Cure Maximum Temperature of 300ºC DCC-256-C
Teknek Contact Cleaner for Substrate Cleaning Tacky Roll Cleaning of Both Sides of 12″ Wide Substrate DeskTop12″N
Olympus Optical Microscope Optical Inspection with Image Recording/Display BH-2
Heraeus UV Cure Conveyor 2 1300M UV Lamp and Conveyor, Speed 1-21 fpm DRS6-210
Yamato Forced Air Oven Curing of Medical Device Components DX602C

Anton Paar Rheometer Characterization of Printable Materials MCR302
Flacktek Speed Mixer Laboratory Mixing System DAC 800.2 VAC LR
Print Head Doctor Automated Ink Jet Head Cleaner Recovery of solvent, UV and water-based print heads PHD11
Rhinotech High Pressure Print Screen Washer Automated washer with traveling, two-headed rotating spray wand HP2536

Yield Engineering Systems Plasma Asher Multi-gas plasma wafer cleaning YES-R1
DISCO Wafer Dicer Dicing of wafers as part of dice-before-grind (DBG) process DFD6360
DISCO Wafer Plasma Treatment  Plasma stress relief after DBG FRFH-01
K&S Stud Bumper Wafer level stud bumping and wire bonding. Low temperature gold bumping. Bond placement accuracy of 3.5µm @ 3 sigma ATPremier Plus

Assembly Lab Equipment

Besi Datacon Die Bonder and PnP with Flipchip Die Bonding to Substrates (from Wafer/Gelpak or Tray), +/- 10 µm Accuracy 2200 evo
Universal Instrument Corp. SMT PnP SMT PnP Tool from Tape/Tray Fuzion 1-30
systeMECH Precision Transfer Print System Development of FHE Assembly Using Novel Transfer Print Methodology PBDT
Nordson – ASYMTEK Precision Dispense on X-Y Table Interchangeable Dispense Heads for Adhesive/Inks/Encapsulation D-585 Dispensemate
TPS – Blue M Convection Oven for Thermal Cure Maximum Temperature of 250ºC, Nitrogen Blanketing Available DC-256-B-ST350
Burton Heated Press for Molding/Encapsulation 13 Ton Heated Press with Adjustable Speed, Pressure, and Temperature HP-800
Elmarco Conductive Fiber Spinning Electrostatic Spinning of Doped Conductive Fibers for Textile Embedding NS LAB 500
UVP (Ultra-Violet Products Ltd) High Intensity UV Lamp (365 nm) for Inspection Fluoresces Contamination/Particles During Manual Inspection of Substrates B-100AP
ProLam Heated Roll Laminator – 12″ Wide Adjustable Temperature, Speed and Nip Pressure PL-1200
Salvis Lab Vacuum Oven Vacuum, Nitrogen Purge, Maximum Temperature  of 200ºC VC-20
Fanuc Robotic Arm Precision Placement and Assembly SR-3iA
NSW Dual head jet dispense Jet dispense two adhesives simultaneously using two Vermes MDS-3280 jet dispensers S400M
FineTech Manual Die Bonder Manual multi-purpose bonder; heated stage and tool;  5um placement accuracy FINEPLACER pico ma
Digital Knight Laminator/Swing-away press 16 x 20” area, max. temperature 315ºC DK20SP
Leica Optical Microscope Optical Inspection up to 55X with image recording S9i

Test Lab Equipment

TestEquity Temperature Chamber (Environmental Testing) Temperature Range from 23ºC to 175ºC 115
TestEquity Temperature Humidity Chamber (Environmental Testing) 1 and 2 Temperature Range from -73ºC to +175ºC, RH 10% to 98% 1007H
Cincinnati Sub-Zero Temperature Humidity Chamber (Environmental Testing) Rapid Cycling, Temperature Range -73ºC to +190ºC, RH 10% to 98% ZPHS-8
Q-Lab Xenon Test Chamber for Sunlight Exposure Multiple Irradiance Ranges, Various Filters Available Xe-3-B
Jovil Manufacturing Co. Fatigue-Ductility Flex Testing Flexural Fatigue Life at Various Bend Radii 3FDF
Nikon Optical Microscope Manual Inspection 10X–50X SMZ1000
Yuasa Endurance Tester Tension-free Folding ET254M002
Yuasa Cycling Stretch Tester Units 1 and 2 Mechanical Cyclic Testing of FHE Circuits DX-ST ST1500100-ST
Micromanipulator Probe Station Probe Circuit/Component Test Points 450PM-A
Formlabs 3D Print, Clean and Cure Rapid Prototype and Build of 3-Dimensional Parts Form 2
Stäubli 6-axis Robotic Tool Multi-function robotic FHE tool incl. high resolution Keyence vision system, print heads and tool changer TX2-60
Space Foundry Plasma Jet Printer Print head capable of depositing a variety of materials sequentially. Installed on Stäubli tool PJP5050-D-L-O
Resource Engineering, Inc. Large 5-axis motion machine Precise multi-modal and conformal printing on large parts N/A

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