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Tech Hub Services

NextFlex Development
and Advanced Manufacturing Capabilities

Today’s leading consumer, medical, communications, industrial and automotive products are increasing demand for all kinds of devices: MEMS sensors and actuators, power, microfluidic and photonic devices, technologies for ADAS (Advanced Driver Awareness and Safety), and more. Now, with the addition of flexible hybrid electronics, an entirely new generation of devices are emerging—devices and platforms that will deliver on the promise of the Internet of Things (IoT).

In support of our mission to advance Flexible Hybrid Electronics (FHE) manufacturing in the U.S., our facility has two cleanrooms and lab space for electronics printing, device integration and testing and measurement, that are fully compliant with ITAR’s (International Traffic in Arms Regulations) quality standard requirements for military electronics, materials, and guidance equipment manufacturing as well as the Food and Drug Administration’s (FDA) medical device manufacturing Quality Systems Regulations (QSR) for good manufacturing practices.

Working with NextFlex, a robust community of innovators including start-up companies and established manufacturers alike, are benefiting from a collaborative approach to electronics design, development and problem-solving via our state of the art Flexible Hybrid Electronics Technology Hub. Offering a full complement of flexible hybrid electronics design, development and manufacturing services, the NextFlex Technology Hub provides the following capabilities:

Design and Prototyping

  • Mechanical Design
  • Electrical Design
  • Design for Manufacturing (DFM)
  • Simulation

 

Assembly

  • Die Attach Methods
    • Flip Chip
    • Pads Up
    • Packaged (WLCSP)
  • Encapsulation

 

Print

  • Print Methods
    • Screen, Inkjet, Aerosol Jet, Gravure Offset, Jet and Extrusion
  • Materials
    • Ag inks (Silver)
    • Cu inks (Copper)
    • Semi-additive
  • Substrates up to 200 x 300 mm (8 x 12”)
    • PET
    • PI
    • TPU

 

Laser Processing

  • Via Drilling
  • Laser Ablation
  • Substrate Singulation

 

RF and Antennas

  • Design
  • Simulation
  • Print

 

Device Programming

 

Test and Characterization

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