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Tech Hub Services

NextFlex Development
and Manufacturing Capabilities

Today’s leading consumer, medical, communications, industrial and automotive products are driving increasing demand for all kinds of devices: MEMS sensors and actuators, power, microfluidic and photonic devices, and technologies for ADAS (Advanced Driver Awareness and Safety), and more. Now, with the addition of flexible hybrid electronics, an entirely new generation of devices are also emerging—devices and platforms that will deliver on the promise of the Internet of Things.

Working with NextFlex, a robust community of innovators including start-up companies and established manufacturers alike, are benefiting from a collaborative approach to design, development and problem-solving via NextFlex’s state of the art Technology Hub. Offering a full complement of flexible hybrid electronics design, development and manufacturing services, the NextFlex Technology Hub provides the following capabilities:

Design and Prototyping

  • Mechanical Design
  • Electrical Design
  • Design for Manufacturing (DFM)
  • Simulation

Assembly

  • Die Attach Methods
    • Flip Chip
    • Pads Up
    • Packaged (WLCSP)
  • Encapsulation

Print

  • Print Methods
    • Screen, Inkjet, Aerosol Jet, Gravure Offset, Jet and Extrusion
  • Materials
    • Ag inks (Silver)
    • Cu inks (Copper)
    • Semi-additive
  • Substrates up to 200 x 300 mm (8 x 12”)
    • PET
    • PI
    • TPU

Laser Processing

  • Via Drilling
  • Laser Ablation
  • Substrate Singulation

RF and Antennas

  • Design
  • Simulation
  • Print

Device Programming

Test and Characterization

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