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Tech Hub Services

NextFlex Development
and Advanced Manufacturing Capabilities

Today’s leading consumer, medical, communications, industrial and automotive products are increasing demand for all kinds of devices: MEMS sensors and actuators, power, microfluidic and photonic devices, technologies for ADAS (Advanced Driver Awareness and Safety), and more. Now, with the addition of flexible hybrid electronics, an entirely new generation of devices are emerging—devices and platforms that will deliver on the promise of the Internet of Things (IoT).

In support of our mission to advance Flexible Hybrid Electronics (FHE) manufacturing in the U.S., our facility has two cleanrooms and lab space for electronics printing, device integration and testing and measurement, that are fully compliant with ITAR’s (International Traffic in Arms Regulations) quality standard requirements for military electronics, materials, and guidance equipment manufacturing as well as the Food and Drug Administration’s (FDA) medical device manufacturing Quality Systems Regulations (QSR) for good manufacturing practices.

Working with NextFlex, a robust community of innovators including start-up companies and established manufacturers alike, are benefiting from a collaborative approach to electronics design, development and problem-solving via our state of the art Flexible Hybrid Electronics Technology Hub. Offering a full complement of flexible hybrid electronics design, development and manufacturing services, the NextFlex Technology Hub provides the following capabilities:

Design and Prototyping

  • Mechanical Design
  • Electrical Design
  • Design for Manufacturing (DFM)
  • Simulation



  • Die Attach Methods
    • Flip Chip
    • Pads Up
    • Packaged (WLCSP)
  • Encapsulation
  • Surface Mount Technology (SMT)
    • Multiple Dispense Processes
    • Tape and Reel Pick and Place



  • Print Methods
    • Screen, Inkjet, Aerosol Jet, Gravure Offset, and Extrusion
  • Materials
    • Ag inks (Silver)
    • Cu inks (Copper)
    • Multiple Types of Adhesives
  • Substrates up to 200 x 300 mm (8 x 12”)
    • PET
    • PI
    • TPU


Laser Processing

  • Via Drilling
  • Laser Ablation
  • Substrate Singulation


RF and Antennas

  • Design
  • Simulation
  • Print


Device Programming


Test and Characterization

  • Electrical
  • Mechanical
  • Environmental

Explore the NextFlex Technology Hub with this interactive virtual tour:

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