Current Members
Investing in the American Manufacturing Ecosystem
As NextFlex members, companies large and small are teaming up with academic institutions, nonprofits, and governments with one mission — to advance the flexible hybrid electronics manufacturing ecosystem in America.
* Founding Member
Corporate Members
Tier 1
Tier 2
Tier 3
- 3DFortify Inc.
- Acellent Technologies Inc.*
- ACI Materials
- ALine, Inc.
- Ames Goldsmith Corporation
- Analog Devices
- Anthro Energy
- Aptima-Sentinel
- Averatek
- Blueshift Materials
- Brewer Science, Inc*
- Caltronics
- Carpe Diem Technologies
- ChemCubed
- Croda
- DISCO
- DuPont
- E Ink Corporation*
- Electro Scientific Industries, Inc.
- Electroninks
- Epicore Biosystems, Inc.
- Flex
- FUJIFILM Dimatix
- General Dynamics Mission Systems
- Human Systems Integration
- Infinite Corridor Technology
- Integrated Deposition Solutions
- Integrity Industrial Ink Jet Integration
- Jabil*
- Komori America
- Kraetonics, LLC
- LAMAR IoT
- Liquid Wire
- Lithoz America
- Lux Semiconductors
- MesoScribe Technologies
- Molex, LLC*
- Momentive Performance Materials, Inc.
- Nano Dimension
- Nano OPS
- NexTex Ventures/NSM
- Northrop Grumman
- Novagard Solutions
- nScrypt
- Optomec
- PARC, a Xerox Company
- Plasmatreat
- Promex
- PulseForge/NovaCentrix
- Raytheon Technologies*
- SafeSense Technologies
- Shoei Electronic Materials, Inc.
- SI2 Technologies, Inc.*
- Space Foundry
- Sunray Scientific
- Tapecon
- Tekna, Inc.
- TTM Technologies
- UES
- Universal Instruments
- Vivonics
- W. L. Gore & Associates
Observer
Academic & Non-Profit Members
Tier 1
- Auburn University*
- Binghamton University*
- Georgia Institute of Technology*
- Northeastern University
- University of Massachusetts Lowell
Tier 2
Tier 3
- Boise State University
- Drexel University
- Evergreen Valley College
- EWI
- Lorain County Community College
- Missouri State University
- New Jersey Institute of Technology
- Ohio University
- Oregon State University
- Rochester Institute of Technology
- Stanford University
- University at Buffalo
- University of Colorado Boulder
- University of Delaware
- University of Maryland
- University of Massachusetts Amherst
- University of Texas Austin
- Washington State University
- Worcester Polytechnic Institute (WPI)
Government Members
Federal
- Biomedical Advanced Research and Development Authority (BARDA)
- Defense Advanced Research Projects Agency (DARPA)
- Defense Contract Management Agency (DCMA)
- Defense Innovation Unit Experimental (DIUX)
- Defense Microelectronics Activity (DMEA)
- Defense Threat Reduction Agency (DTRA)
- Laboratory for Physical Sciences (LPS)
- Manufacturing and Industrial Base Policy (MIBP)
- National Aeronautics and Space Administration (NASA)
- National Geospatial Intelligence Agency (NGA)
- National Institute of Standards and Technology (NIST)
- National Institutes of Health (NIH)
- National Science Foundation (NSF)
- U.S. Department of Defense
- U.S. Department of Defense Manufacturing Technology Program
- U.S. Department of Education
- U.S. Department of Energy
- U.S. Department of the Air Force
- U.S. Department of the Army
- U.S. Department of the Navy
- U.S. Food and Drug Administration (FDA)
- U.S. Forest Service