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DTSTART;TZID=America/Los_Angeles:20260714T080000
DTEND;TZID=America/Los_Angeles:20260714T170000
DTSTAMP:20260824T124728
CREATED:20260522T183600Z
LAST-MODIFIED:20260710T210901Z
UID:16408-1784016000-1784048400@www.nextflex.us
SUMMARY:Defense Patent Holiday Industry Day
DESCRIPTION:Defense Patent Holiday Industry Day\nJuly 14\, 2026 \nIn Person and Virtual \nHosted by \n \n  \n\nRealizing the ROI: Turning Government Patents into Commercial Opportunities\nJoin a microelectronics industry-focused session on the Defense Patent Holiday initiative and learn how no-fee Commercial Evaluation Licenses can help companies assess\, validate\, and commercialize select technologies from defense laboratories. \n\nLearn about the other Department resources being aligned to support licensees\, such as special topic SBIRs\, Venture Studios\, and Office of Strategic Capital Loan Programs\nTour the NextFlex Advanced Manufacturing Facility to see how Department of War manufacturing innovation institutes can support product prototyping and manufacturing scale-up.\n\n  \nAbout\nThe Office of the Under Secretary of War for Research and Engineering (OUSW(R&E)) has launched the Defense Patent Holiday\, a new pilot program designed to accelerate the commercialization of breakthrough defense technologies from the lab to the warfighter. Learn more about the patents here: https://info.techlinkcenter.org/defense-patent-holiday \nThis first-of-its-kind initiative offers qualified companies no-fee Commercial Evaluation Licenses (CELs) for a limited time\, providing industry partners unprecedented access to government intellectual property. CELs give companies the unique opportunity to assess the defense patent\, market\, and consider the commercial potential of defense R&D. \n  \nReserve Your Spot by July 13\, 2026 @ 5:00 pm Pacific\nRegistration is required for all participants\, both virtual and in-person. Due to venue capacity\, in-person registration is limited to the first 100 registrants \n  \nEvent Snapshot\nDate: July 14\, 2026\nLocation: NextFlex\, 2244 Blach Place\, San Jose\, CA 95131. Virtual attendees will be hosted on Zoom Webinar\nAudience: Senior leaders from DoW\, industry\, investors\, technologists\, researchers\, commercialization partners and capital partners\nFormat: Briefings\, patent overview\, partner pathway\, and Q&A \n  \nA faster\, lower-friction path from lab discovery to market impact.\nThe Defense Patent Holiday initiative is designed to lower early barriers for companies to evaluate government-developed intellectual property and speed promising technologies toward commercial and operational use. \n\nNo-fee evaluation access — Assess selected patents through Commercial Evaluation Licenses without the usual upfront costs during the evaluation window.\n“Try before you buy” — Use the evaluation period to understand technical fit\, market potential\, business case\, and scale-up requirements.\nDirect innovation pathway — Connect with a clearer licensing route intended to transition breakthrough technologies from defense labs to industry and the warfighter.\n\n  \nHow the Opportunity Works\nUse this event to learn details on the process and advantages of leveraging U.S. government IP. \nStep 1: Access available patents — Browse the curated set of technologies included in the Defense Patent Holiday pilot. \nStep 2: Identify fit — Match patent opportunities to your product roadmap\, customer demand\, or investment thesis. \nStep 3: Evaluate commercially — Apply for a CEL to assess technical\, market\, business\, and scale-up potential. \nStep 4: Plan the transition — Engage licensing and partnership pathways to move high-potential technology toward deployment. \n  \n\n“A clear path to move technology from the lab into the hands of the American warfighter and the American consumer.”\n— Under Secretary of War for Research and Engineering Emil Michael \nRead an update from the Assistant Secretary of War for Research and Engineering. \n\n\n  \nAgenda\n \n  \nFAQs\nFAQ 1: \nQ: What is a Commercial Evaluation License?\nA: A CEL lets a licensee evaluate a patent’s technical\, market\, and business potential\, including potential scale-up challenges. \n  \nFAQ 2: \nQ: Why is this called a Patent Holiday?\nA: The pilot provides access to no-fee evaluation licenses during a defined period\, helping companies explore opportunities before committing to a longer-term license. \n  \nFAQ 3: \nQ: Who should attend?\nA: Companies\, investors\, entrepreneurs\, technology transition teams\, and commercialization partners interested in moving defense lab technologies toward market or operational use. \n  \nFAQ 4: \nQ: How do I start the patent application process?\nA: Visit https://info.techlinkcenter.org/defense-patent-holiday to see selected patents\, connect with TechLink\, and start your application. \n  \nReady to evaluate what’s possible?\nRegister for the microelectronics-focused Defense Patent Holiday Industry Day to learn about available patent opportunities\, no-fee CEL access\, and the pathway from lab technology to real-world impact. \n 
URL:https://www.nextflex.us/event/defense-patent-holiday-industry-day/
LOCATION:NextFlex\, 2244 BLACH PL STE 150\, San Jose\, California\, 95131-2060\, United States
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=UTC:20260609T080000
DTEND;TZID=UTC:20260609T190000
DTSTAMP:20260824T124728
CREATED:20250110T061239Z
LAST-MODIFIED:20260522T180650Z
UID:15254-1780992000-1781031600@www.nextflex.us
SUMMARY:Innovation Day 2026
DESCRIPTION:Innovation Day is NextFlex’s premier annual member event—bringing together leaders from industry\, academia\, and government to advance the future of hybrid electronics.Innovation Day 2026 will unite the nation’s hybrid electronics ecosystem to showcase member-driven innovation\, strengthen trusted networks\, and accelerate the transition of emerging technologies into fieldable\, manufacturable solutions that support both defense and commercial applications. \n\n\n\n\n\n\n\n\n\n	\n	\n		\n			\nAGENDA | REGISTRATION | SPONSORSHIP | HOTELS | TechBlick’s Future of Electronics Reshaped\n\n\n  \n\nWhy Attend Innovation Day?\n\n\nAdvance the Mission\nExplore NextFlex- and member-led innovations that accelerate readiness\, resilience\, and modernization. Gain insight into the strategic direction of hybrid electronics and its role in meeting commercial\, DoD\, and national security priorities. \nStrengthen the Ecosystem\nConnect with peers across industry\, academia\, government\, and the defense industrial base. Innovation Day is where relationships deepen and the hybrid electronics community drives the industry forward. \nCatalyze Collaboration\nDiscover opportunities for collaborative partnerships—from early-stage concepts to scalable\, deployable capabilities and workforce solutions. \nEngage Trusted Networks\nParticipate in meaningful dialogue with DoD stakeholders\, primes\, SMEs\, researchers\, and educators in a member-focused environment designed to foster collaboration and impact. \n  \nInnovation Day Session Descriptions\nSession 1: Innovation Built to Scale  \nHybrid electronics innovations are reshaping both commercial markets and defense capabilities. This session highlights breakthrough materials\, additive manufacturing approaches\, advanced packaging\, and system integration technologies designed for dual-use impact. Speakers will explore how innovations are being architected from the outset to meet commercial scalability requirements while satisfying the performance\, reliability\, and security demands of mission-critical defense applications. \n\n  \n\nSession 2: Delivering Impact Across Markets and Missions \nInnovation achieves impact only when it reaches production and deployment. This session explores how hybrid electronics technologies transition into commercially viable products and mission-ready systems—highlighting strategies that align manufacturing scalability with defense reliability\, security\, and performance requirements. \n\n  \n\nSession 3: AI/ML for Hybrid Electronics: From Design to Manufacturing Intelligence \nFrom materials discovery to system design and production optimization\, artificial intelligence (AI) and machine learning (ML) are reshaping the hybrid electronics development pipeline. This session will feature perspectives from AI/ML innovators\, electronics design companies\, and advanced manufacturing equipment providers on how these tools are enabling smarter design\, optimized manufacturing\, and more efficient process control. Speakers/panelists will highlight real-world applications\, data challenges\, and opportunities for collaboration across the industrial base to accelerate the transition of emerging hybrid electronics technologies. \n  \nRegister for Innovation Day now! Early bird rates apply until May 8. \n\n\n \nInnovation Day 2026 is co-located with TechBlick’s Future of Electronics RESHAPED\, offering additional opportunities for engagement while preserving a focused\, members-first experience. The TechBlick agenda features a variety of NextFlex member technical presentations\, as well as two member-only sessions just for NextFlex members\, so plan to attend both events.\n  \nNextFlex Member Only Sessions at TechBlick:\nJune 10 @ 2:05 PM \nSession 4: Hybrid Electronics for Unmanned Systems: Enabling the Next Generation of Autonomous Platforms \nAs unmanned systems expand across air\, land\, sea\, and multi-domain operations\, advanced electronics are critical to enabling greater autonomy\, sensing\, communications\, and mission endurance. This session will feature perspectives from government industry stakeholders on evolving operational needs and the role of hybrid electronics in supporting next-generation unmanned platforms. Speakers/panelists will discuss design challenges\, manufacturing considerations\, and collaboration opportunities that can accelerate the transition of innovative technologies into scalable capabilities for autonomous applications. \n  \n\n\nSession Chair: Dr. Benjamin Leever\, AFRL \nConfirmed Speakers: \n\nDr. Nate Bode\, Impossible Objects\nRich Ormeno\, Lockheed Martin\n\n\n  \nJune 10 @ 4:10 PM \nSession 5: Resilient Electronics: Advancing Systems for Challenging Operational Environments \nOperating in contested\, harsh\, and constrained environments places unique demands on electronics systems\, from manufacturing and materials constraints in austere environments to storage\, platform integration\, and power requirements. This session will explore resilient hybrid electronics for both defense and commercial applications. Speakers will highlight technology advances\, integration challenges\, and opportunities to accelerate the transition of innovative solutions into fieldable\, manufacturable capabilities. \n\nSession Chair: Dr. Pradeep Lall\, Auburn University \nSpeakers: \n\nDr. Cadré Francis\, NASA\nDr. Kenneth Church\, Sciperio\nRyan Hill\, IS4S\nKevin Durkee\, Aptima\nEric Marksz\, Northrop Grumman \n\n  \n\nLoading… \n\n \n\n\nPowered By Whova\nEvent registration software\n \n		\n	\n\n\n\n\n\n\n\n\n\n\n\n		\n				\n			\n\n\n\n \n			Sponsorship Information\nWhy Sponsor Innovation Day?\nReach the Hybrid Electronics Ecosystem \nConnect with leaders from the defense industrial base\, advanced manufacturing companies\, startups\, research institutions\, and government agencies. \nPosition Your Organization as a Technology Leader \nHighlight your company’s capabilities and innovations to decision-makers shaping the future of hybrid electronics. \nStrengthen Strategic Partnerships \nInnovation Day is designed to foster collaboration and partnerships across the ecosystem—from early-stage research to scalable manufacturing solutions. \nEngage with Influencers and Decision-Makers \nParticipate in discussions with DoD stakeholders\, primes\, SMEs\, researchers\, and educators in a focused member community. \n  \nSponsorship Opportunities\nInnovation Day offers four sponsorship tiers\, each providing unique benefits and visibility throughout the event. \nOpportunities include: \n\nBrand visibility across event marketing and signage\n• Exhibit or demo presence\n• Recognition during event sessions\n• Networking access with attendees and speakers\n• Opportunity to showcase technology and capabilities\n\n  \n \nIf you are interested in learning more or are ready to commit to sponsorship\, please contact us. \n  \nHotels near Computer History Museum\n\nHampton Inn & Suites Mountain View\n\nDistance: ~1.4 miles\n\n\nHoliday Inn Express & Suites Mountain View\n\nDistance: ~1.6 miles\n\n\nRamada By Wyndham Mountain View\n\nDistance: ~1.6 miles\n\n\nHotel Avante\n\nDistance: ~3.2 miles
URL:https://www.nextflex.us/event/innovation-day-2026/
LOCATION:Computer History Museum\, 1401 N Shoreline Blvd\, Mountain View\, CA\, 94043\, United States
ATTACH;FMTTYPE=image/jpeg:https://www.nextflex.us/wp-content/uploads/2024/08/1930-scaled.jpg
ORGANIZER;CN="NextFlex":MAILTO:info@nextflex.us
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20251210T110000
DTEND;TZID=America/Los_Angeles:20251210T120000
DTSTAMP:20260824T124728
CREATED:20251202T000557Z
LAST-MODIFIED:20251205T002527Z
UID:16081-1765364400-1765368000@www.nextflex.us
SUMMARY:Webinar: Harnessing the Power of AI in FHE Design - Understanding Challenges and Unlocking Opportunities
DESCRIPTION:The role of artificial intelligence (AI) in electronics design has become increasingly important due to a combination of factors\, including a workforce crunch\, the explosion of complexity and cost\, and tighter delivery schedules. This session explores the significance of AI in design considering these factors and highlights the benefits it brings to address the challenges faced by the industry. This session will address risks to deploying AI technology in a design process. It will also cover practical ways that AI can be applied to design for assistive development\, design optimization through deep learning\, and generative processes that address highly complex problems.About the Speaker:David Wiens | Product Manager\, SiemensOver the past 40+ years\, David has held various engineering\, marketing and management positions within the EDA industry. His focus areas have included advanced packaging\, high-speed design\, routing technology\, integrated systems design and additively manufactured electronics. He is currently the product manager for the Xpedition portfolio of products for electronics systems design. He holds a B.S. in computer science degree from the University of Kansas.
URL:https://www.nextflex.us/event/webinar-harnessing-the-power-of-ai-in-fhe-design-understanding-challenges-and-unlocking-opportunities/
LOCATION:California
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20251203T110000
DTEND;TZID=America/Los_Angeles:20251203T120000
DTSTAMP:20260824T124728
CREATED:20251202T000310Z
LAST-MODIFIED:20251202T000348Z
UID:16077-1764759600-1764763200@www.nextflex.us
SUMMARY:Webinar: AI Opportunities in Electronics Manufacturing and Reliability
DESCRIPTION:Miniaturization and heterogeneous integration technologies are increasing the complexity of semiconductor packaging\, making AI essential for optimizing design\, manufacturing\, and reliability. Participants in this webinar will gain insights into core concepts and practical applications\, supported by packaging case studies that demonstrate how AI can address critical challenges. The presentation will include selected AI models and their application in analyzing process data for anomaly detection\, root cause analysis\, and real-time adjustment of process parameters. This webinar is particularly suited for packaging engineers\, process specialists\, reliability analysts\, and technical managers who are looking to leverage AI for faster time-to-market\, improved yield\, and enhanced product reliability.About the Speaker:Pradeep Lall is the MacFarlane Endowed Distinguished Professor and Alumni Professor with the Department of Mechanical Engineering and Director of the Auburn University Electronics Packaging Research Institute. He holds a Joint Courtesy Appointment in the Department of Electrical and Computer Engineering. He serves as the Director of the Alabama Node of the NextFlex Manufacturing Institute. Prior to joining Auburn University\, Dr. Lall worked for Motorola\, focusing on various aspects of wireless communications products. He is the author and co-author of 2 books\, 15 book chapters\, and over 1000 journal and conference papers in the field of electronics reliability\, manufacturing\, and survivability. He holds three U.S. Patents\, three Motorola Outstanding Innovation Awards\, and five Motorola Engineering Awards. His publications have garnered over 13\,000 citations\, an H-index of 53\, and an i10-index of 317. Dr. Lall is ranked in the highest quantile among the top 2 percent of scientific researchers worldwide\, based on data compiled by Stanford University. The ranking system includes scientists in 20 fields and 174 sub-fields.
URL:https://www.nextflex.us/event/webinar-ai-opportunities-in-electronics-manufacturing-and-reliability/
LOCATION:California
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20251112T110000
DTEND;TZID=America/Los_Angeles:20251112T120000
DTSTAMP:20260824T124728
CREATED:20251031T182216Z
LAST-MODIFIED:20251031T182418Z
UID:16044-1762945200-1762948800@www.nextflex.us
SUMMARY:Accelerating Hybrid Electronics R&D with AI Automation - Presented by Object Tech
DESCRIPTION:Hybrid Electronics development demands precision across materials\, printing\, and process control — yet traditional methods rely heavily on manual inspection and trial-and-error optimization. In this talk\, Dr. Jiaojiao Li\, Co-Founder & CPO of Object\, will introduce how Agentic AI tools can automate critical steps in R&D\, from defect inspection and classification to critical dimension (CD) metrology\, anomaly detection\, experiment optimization\, and property prediction. Drawing on Object’s recent pilot with flexible hybrid electronics program\, Jiaojiao will share how domain-specific AI tools\, models and agents can help scientists and engineers predict outcomes\, identify defects faster\, and optimize processes in real time. Attendees will gain insight into the next generation of AI-powered R&D workflows and how these tools can potentially transform productivity and reliability across the hybrid electronics ecosystem.About the Speaker:Dr. Jiaojiao Li is a Cofounder & CPO @ Object. She holds a Ph.D. in Materials Science (Mines) and an M.S. in Computer Science from the University of Pennsylvania\, where she focused on software engineering. With over 10 years of experience in thin-film solar cell R&D\, she possesses deep expertise in process optimization and yield improvement across the hard-tech development cycle. In addition\, she has five years of experience in software and database developments. At Object\, Dr. Li leads the software engineering team\, overseeing product design and development. \n\n\n\n\n\n\n\n\n\n\n\n\n\n		\n				\n			\n\n\n\n \n			At the first AI webinar on October 29\, we unpacked the key takeaways from the AI Workshop and shared how NextFlex is advancing AI adoption in hybrid electronics through upcoming initiatives and industry engagement. \nFrom smarter circuit layout and toolpath optimization to predictive maintenance and real-time closed-loop control\, the workshop highlighted both promising applications and the roadblocks we must overcome together—like data interoperability\, workforce readiness\, and IP protection. \nNextFlex is building on this momentum to engage the industrial base in a national conversation on AI’s role in electronics manufacturing. Through ongoing webinars\, workforce initiatives\, and roadmap development\, we’ll continue to surface best practices\, accelerate adoption\, and share actionable insights with our community. \nTo watch the recording of the previous webinar or view the slides\, visit this page.
URL:https://www.nextflex.us/event/accelerating-hybrid-electronics-rd-with-ai-automation-presented-by-object-tech/
LOCATION:California
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20251029T110000
DTEND;TZID=America/Los_Angeles:20251029T120000
DTSTAMP:20260824T124728
CREATED:20251001T045321Z
LAST-MODIFIED:20251031T181015Z
UID:16003-1761735600-1761739200@www.nextflex.us
SUMMARY:Webinar: AI for Hybrid Electronics - Workshop Outcomes & What’s Next
DESCRIPTION:At the recent NextFlex AI for Hybrid Electronics Workshop in Boston\, leaders from across the industrial base came together to explore how artificial intelligence (AI) and machine learning (ML) are transforming design\, materials\, process control\, and system intelligence in hybrid electronics and how they will continue to revolutionize the value chain.From smarter circuit layout and toolpath optimization to predictive maintenance and real-time closed-loop control\, the workshop highlighted both promising applications and the roadblocks we must overcome together—like data interoperability\, workforce readiness\, and IP protection.NextFlex is building on this momentum to engage the industrial base in a national conversation on AI’s role in electronics manufacturing. Through ongoing webinars\, workforce initiatives\, and roadmap development\, we’ll continue to surface best practices\, accelerate adoption\, and share actionable insights with our community.At the webinar on October 29\, we unpacked the key takeaways from the AI Workshop and shared how NextFlex is advancing AI adoption in hybrid electronics through upcoming initiatives and industry engagement. \n\n\n\n\n\n\n\n\n\n\n\n		\n				\n			\n\n\n\n \n			Watch the Recording: \n \nView the Slides: \nAI for Hybrid Electronics – Workshop Outcomes & What’s Next
URL:https://www.nextflex.us/event/webinar-ai-for-hybrid-electronics-workshop-outcomes-whats-next/
LOCATION:California
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=UTC:20251015T080000
DTEND;TZID=UTC:20251016T170000
DTSTAMP:20260824T124728
CREATED:20250605T015635Z
LAST-MODIFIED:20250927T064922Z
UID:15726-1760515200-1760634000@www.nextflex.us
SUMMARY:NextFlex Workshop: Hybrid Electronics for Automotive and Aerospace Applications
DESCRIPTION:Skip to the Schedule | Skip to Registration | Skip to FAQ Description:Hybrid electronics are revolutionizing the automotive and aerospace industries by enabling sophisticated\, lightweight\, and highly efficient systems that enhance performance and safety. From touch control human machine interfaces\, advanced driver-assistance systems (ADAS) to state-of-the-art avionics\, hybrid electronics are at the forefront of technological innovation. These advancements have facilitated the electrification of both the automotive and aerospace platforms through the emergence of ground and airborne EVs that boast improved fuel efficiency and reduced emissions. The seamless integration of sensors\, processors\, and communication modules within these hybrid systems is paving the way for a new era of intelligent transportation solutions. Technical focus areas include manufacturing solutions for integration on automotive and aerospace platforms\, technology gaps for the integration of hybrid electronics\, product demonstrators\, and road mapping. The workshop will feature presentations from subject matter experts and networking with NextFlex members and stakeholders. Who Should Attend:Engineers and Managers interested in electronics manufacturing\, integration\, and reliability for defense and commercial applications should attend to learn about new manufacturing methods while meeting or exceeding reliability requirements. Event Chairs:– Dr. Pradeep Lall\, Director\, Electronics Packaging Research Institute & MacFarlane Distinguished Professor and Alumni Professor\, Auburn University– Dr. John Williams\, Boeing Technical Fellow\, Boeing Activities Include:  Dinner and Topgolf at Topgolf HuntsvilleEnjoy Topgolf’s all-weather hitting bays and take aim at the giant outfield targets. Topgolf’s high-tech balls will score themselves! You’ll have the opportunity to network during the catered dinner and will have plenty of time to play\, as well. \n\n\n\n\n\n\n\n\n\n	\n	\n		\n			\nLoading… \n\n \nPowered By Whova\n\nPowered By Whova\nConference registration software\n \n  \nFAQ:\nQ: What airport is closest to the workshop location?\nA: Huntsville International Airport (HSV)\n\n\n14min drive (10.3mi) to Auburn University Research & Innovation Campus\n\n\n \nQ: What hotels are nearby the workshop location?\nA:\n\nThe Westin Huntsville \n6800 Governors W\, Huntsville\, AL 35806\n$194/night\n5min drive (1.2mi) to university\nHyatt Place Huntsville/ Research Park/ Redstone\n6860 Governors W NW\, Huntsville\, AL 35806\n$115/night\n2min drive (0.6mi) to university\nElement Huntsville \n6810 Governors W\, Huntsville\, AL 35806\n$156/night\n5min drive (1.2mi) to university\nHuntsville Marriott at the Space & Rocket Center\n5 Tranquility Base\, Huntsville\, AL 35805\n$151/night\n8min drive (2.8mi) to university\n\n  \nQ: Where is the workshop located?\nA: Auburn University Research & Innovation Campus\n345 Voyager Way\, Huntsville\, AL 35806 \n  \nQ: Where is the offsite dinner on 10.15.25 located?\nA: Topgolf – Huntsville\n6100 Topgolf Drive\, Huntsville\, Al\, 35806\n7min drive (2.8mi) from university
URL:https://www.nextflex.us/event/nextflex-workshop-hybrid-electronics-for-automotive-and-aerospace-applications/
LOCATION:Auburn University Research and Innovation Campus\, 345 Voyager Way NW\, Huntsville\, 35806\, United States
ATTACH;FMTTYPE=image/jpeg:https://www.nextflex.us/wp-content/uploads/2025/04/1309-scaled.jpg
ORGANIZER;CN="NextFlex":MAILTO:info@nextflex.us
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=UTC:20250610T130000
DTEND;TZID=UTC:20250610T170000
DTSTAMP:20260824T124728
CREATED:20250111T034741Z
LAST-MODIFIED:20250603T043810Z
UID:15296-1749560400-1749574800@www.nextflex.us
SUMMARY:NextFlex Workshop: AI for Hybrid Electronics
DESCRIPTION:Join us for a half-day workshop to be held at UMass Boston on June 10 in conjunction with the TechBlick Conference\, “The Future of Electronics Reshaped.” The NextFlex Workshop will be followed by a reception. Everyone is welcome to join.Artificial intelligence and machine learning (AI/ML) are reshaping the landscape of hybrid electronics manufacturing and enabling the development of smarter edge devices through enhanced design\, process control\, and system intelligence. This meeting will explore how AI/ML tools accelerate circuit layout generation—particularly for complex 3D and conformal designs—optimize material selection and process parameters and enable real-time in situ monitoring with closed-loop control to improve yield and consistency. In addition\, the integration of AI/ML into devices allows for local decision-making\, predictive maintenance\, dynamic system calibration\, empowering responsive\, autonomous operation at the point of use and supply chain logistics optimization.Emphasis will be placed on the practical implementation of existing AI/ML technologies\, not the development of novel algorithms\, to improve both the manufacturability of hybrid electronics and the functionality of smart edge systems. Join us for interactive presentations and breakout sessions about the impacts of AI/ML models on hybrid electronics manufacturing and how the industrial base is utilizing these tools to enable faster technology adoption and commercialization.The workshop will feature breakout sessions on the following topics:Breakout 1: Design to Deployment– Design– Supply Chain– Edge DevicesBreakout 2: Materials\, Process\, and Manufacturing– Manufacturing Tool Control– Material Development\, Optimization\, Process– Automated Test & Qualification \n\n\n\n\n\n\n\n\n\n\n\n\n\n		\n				\n			\n\n\n\n \n			\n\nLoading… \n\n \n\n\n\n\nPowered By Whova\nEvent registration system
URL:https://www.nextflex.us/event/nextflex-member-meeting-techblick/
LOCATION:UMass Boston\, 100 Morrissey Blvd\, Boston\, Massachusetts\, 02125\, United States
ATTACH;FMTTYPE=image/jpeg:https://www.nextflex.us/wp-content/uploads/2024/04/BU-Workshop.jpg
ORGANIZER;CN="NextFlex":MAILTO:info@nextflex.us
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=UTC:20250430T093000
DTEND;TZID=UTC:20250430T140000
DTSTAMP:20260824T124728
CREATED:20250221T032953Z
LAST-MODIFIED:20250424T032204Z
UID:15439-1746005400-1746021600@www.nextflex.us
SUMMARY:Innovating\, Investing\, Leading for the Defense Industrial Base
DESCRIPTION:OverviewJoin us in celebrating 10 years of collaboration and innovation between the Ohio Technical Skills Innovation Network (Ohio TechNet)\, NextFlex\, and Lorain County Community College.At this milestone event\, industry leaders\, workforce experts\, and education partners will highlight high-impact practices that address the evolving talent needs of manufacturing\, with a particular focus on the defense industrial base.Keynote SpeakerBrynt ParmeterChief Talent Management Officer\, Office of the Under Secretary of Defense for Personnel and ReadinessU.S. Department of Defense Mr. Brynt Parmeter was appointed as the inaugural Chief Talent Management Officer (CTMO) for the U.S. Department of Defense on April 10\, 2023. In this role\, which resides in the Office of the Under Secretary of Defense for Personnel and Readiness\, he works across the Military Departments\, Joint Staff\, Office of the Secretary of Defense\, and with interagency partners to lead the development and implementation of the DoD Total Force talent acquisition\, workforce development\, and talent management strategy. View the Full Agenda\, Learn More\, and Register to Attend
URL:https://www.nextflex.us/event/innovating-investing-leading-for-the-defense-industrial-base/
LOCATION:Spitzer Conference Center\, 1005 Abbe Road N\, Elyria\, Ohio\, 44035\, United States
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=UTC:20241001T000000
DTEND;TZID=UTC:20241002T235959
DTSTAMP:20260824T124728
CREATED:20240709T043017Z
LAST-MODIFIED:20240828T044751Z
UID:14508-1727740800-1727913599@www.nextflex.us
SUMMARY:Hybrid Electronics for Defense Applications
DESCRIPTION:  \n  \n  \nLearn. Network. Make Connections. \n  \nAbout the Workshop \nPlease join us at Lockheed Martin’s Global Vision Center in Arlington\, VA for a two-day workshop focused on transitioning hybrid electronics manufacturing technologies into critical defense applications. Technical focus areas include extreme environment electronics\, additive manufacturing for advanced packaging\, and supporting development of hybrid electronics-related standards. The workshop will offer a variety of opportunities for you to network with NextFlex members\, staff\, and prominent DoD stakeholders. The event will conclude with engaging breakout sessions that will align the community and seek to broaden near-term adoption of hybrid electronics. \nIncluded in the registration fee is breakfasts\, lunches\, a welcome reception on September 30\, a networking reception on October 1\, and more. \n  \n\n\nLoading… \n\n \n\n\n \n		\n	\n\n\n\n\n\n\n\n\n\n\n\n	\n	\n		\n			Recommended Hotels\n\nCrystal City\, VA\, Hotel | Courtyard Arlington Crystal City/Reagan National (marriott.com)\n(0.5 mi to GVC and Ronald Reagan Washington National Airport)\n2899 Richmond Hwy\, Arlington\, VA 22202\n\nArlington\, VA Hotel near DCA | Crowne Plaza Crystal City – Washington DC\n(0.5 mi to GVC and Ronald Reagan Washington National Airport)\n1480 Crystal Dr\, Arlington\, VA 22202\n\nHyatt Regency Crystal City Arlington\, Virginia\, US – Reservations.com\n(0.5 mi to GVC and Ronald Reagan Washington National Airport)\n2799 Richmond Hwy\, Arlington\, VA 22202
URL:https://www.nextflex.us/event/hybrid-electronics-for-defense-applications/
LOCATION:Lockheed Martin Global Vision Center\, 2121 Crystal Dr\, Arlington\, Virginia\, 22202\, United States
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=UTC:20240418T000000
DTEND;TZID=UTC:20240418T000000
DTSTAMP:20260824T124728
CREATED:20240221T101025Z
LAST-MODIFIED:20240411T045422Z
UID:12200-1713398400-1713398400@www.nextflex.us
SUMMARY:Workshop: Advancing Electronics Packaging of Hybrid Electronics for Industrial and Medical Applications
DESCRIPTION:  \nNextFlex will convene the hybrid electronics community for a one-day workshop at Binghamton University in New York on April 18 to focus on advancing hybrid electronics for industrial and medical applications. Visionary speakers will guide participants toward opportunities in both technology advancement and education and workforce development. The workshop will build on NextFlex’s ongoing efforts to advance additive electronics packaging technologies and will include a review of the hybrid electronics manufacturing roadmaps\, the state-of-the-art achieved through funded development projects\, manufacturing capabilities across the US\, and the strategy behind the NextFlex education and workforce development programs. Finally\, this workshop will provide opportunities to provide in-person feedback on PC 9.0 topics during member-only breakout sessions. \nWorkshop attendees are invited to bring posters to display and will have the opportunity to discuss their posters with other attendees at the workshop reception. \nThis workshop will be co-located with SEMI’s roadmapping and gap analysis events on April 16 and 17 and includes a tour of Binghamton’s research centers. SEMI members can receive the NextFlex member rate by registering for a non-member ticket and using the code SEMI20. \n\n\nLoading… \n\n \n\n \nPowered By WhovaEvent registration\n \nIn addition: \nSEMI NBMC Technical Gap Analysis Workshop – Tues. 4/16 – 8 am-6 pm During this workshop\, attendees will address the technical topics / gaps in the Nano-Bio Materials space to explore topics and technology development required to meet development objectives. Breakfast\, and lunch will be included and reception at the end of the day will be included. \nSEMI FlexTech FHE Technical Gap Analysis Workshop – Wed. 4/17 – 8 am-4 pm\, followed by tours of Binghamton University labsAttendees will then turn their sights to completing a Technical Gap Analysis in preparation for FlexTech’s next Request for Proposals (RFP)\, including exploring topics and technology development required to meet development objectives. Breakfast\, lunch and tours of Binghamton University lab tours will conclude the day. \nBinghamton University Tours – Wed. 4/17 – 4:00pm – 5:30pmThe tour will include facilities that are part of the S3IP (Small Scale Systems Integration & Packaging) a New York State Center of Excellence\, CAMM (Center for Advanced Microelectronics Manufacturing) a New York State Center of Advanced Technology and home to the New York Node of NextFlex\, the Analytical & Diagnostics Laboratory\, the IEEC (Integrated Electronics Engineering Center) a New York State Center of Advanced Technology and NECCES (the Northeast Center for Chemical Energy Storage).  \nRegister for Tour \nBinghamton University 2024 Art of Science Exhibit – Wed. 4/17 – 4:00pm – 5:30pmBinghamton University holds an annual contest that celebrates the beauty of science through photographs and images that describe some aspect of research and captured visually. The advances in imaging technology and tools mean that scientists have an increased ability to generate exciting data as well as to create compelling works of art and workshop attendees are invited to the opening reception for the 2024 Art of Science Exhibit in the atrium of the Center of Excellence Building. Contest winners will be announced\, and refreshments will be served.  \n \nWorkshop Location\nBinghamton University\, Innovative Technologies Complex (ITC)85 Murray Hill RdVestal\, NY 13850United States \n \n  \nRecommended Hotels\nResidence Inn Binghamton (Marriott) — a short walk to campus and the event4610 Vestal Parkway East\, Vestal\, New York 13850 \n\nHampton Inn3708 Vestal Pkwy E\, Vestal\, NY 13850 \n\n\nHoliday Inn Express & Suites: Binghamton University-Vestal3615 Vestal Parkway East\, Vestal\, New York 13850 \n\n\n\nCandlewood Suites: Vestal – Binghamton3605 Vestal Parkway East\, Vestal\, New York 13850 \n\n\n\nTru by Hilton3512 Vestal Pkwy E\, Vestal\, NY 13850 \n\n\nCourtyard Binghamton (Marriott)3801 Vestal Parkway East Vestal\, New York \n\n\nHomewood Suites by Hilton3603 Vestal Pkwy E\, Vestal\, NY 13850 \n\n\nOther hotels in downtown Binghamton \n\n\nHilton DoubleTree (downtown Binghamton)225 Water St\, Binghamton\, NY 13901 \n\n\nHoliday Inn (downtown Binghamton)2-8 Hawley Street\, Binghamton\, New York 13901
URL:https://www.nextflex.us/event/workshop-advancing-electronics-packaging-of-hybrid-electronics-for-industrial-and-medical-applications/
LOCATION:California
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=UTC:20240326T083000
DTEND;TZID=UTC:20240327T180000
DTSTAMP:20260824T124728
CREATED:20240221T101025Z
LAST-MODIFIED:20240309T070922Z
UID:12199-1711441800-1711562400@www.nextflex.us
SUMMARY:Innovation Days 2024
DESCRIPTION:During Innovation Days\, we gather our members and government partners together to celebrate our latest collective achievements and plans for future collaboration in the field of hybrid electronics. \nThis year’s event\, hosted at the Santa Clara Marriott on March 26 & 27\, will feature technical talks from key thought leaders\, an exhibit hall where members can bring demonstrators to show\, and more networking than ever. \nYour ticket price includes a special member dinner on Wednesday\, March 27 to celebrate another great year. Network with other attendees\, enjoy great food and beverages\, and attend our annual Fellows Award ceremony. \nBook a room by March 12\, 2024 to take advantage of our discounted room block pricing! \n\n\nLoading… \n\n \nPowered By  Whova   Event App \n\n \nPowered By WhovaOnline conference registration
URL:https://www.nextflex.us/event/innovation-days-2024/
LOCATION:Santa Clara Marriott\, 2700 Mission College Blvd\, Santa Clara\, California\, 95054\, United States
CATEGORIES:Innovation Days
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=UTC:20231013T100000
DTEND;TZID=UTC:20231013T120000
DTSTAMP:20260824T124728
CREATED:20231013T091024Z
LAST-MODIFIED:20240518T034335Z
UID:12198-1697191200-1697198400@www.nextflex.us
SUMMARY:Manufacturing Day 2023
DESCRIPTION:Each year\, Manufacturing Day (MFG Day) is held in October in order to show students\, parents\, and the public what modern manufacturing is all about. The fourth industrial revolution is rapidly changing our world. New advanced manufacturing technologies bring about whole new careers\, requiring a skilled workforce interested in pursuing them. From bioengineers\, to data analysts to robotics technicians\, and all of the operations in between\, there is a place for everyone in manufacturing! \nHaving long been the cornerstone of the American economy\, manufacturing continues to provide highly skilled and highly paid jobs that create thriving communities. Still\, the diversity of existing opportunities and the corresponding career potential that accompanies those opportunities is too often overlooked or misunderstood which is why each year\, Manufacturing Day celebrates and showcases both the work\, and many of the individuals\, that comprise the US manufacturing sector. \nAt this year’s Manufacturing Day\, NextFlex will be hosting local high school students at our San Jose headquarters where participants can meet with technologists\, tour the facility\, and learn about how 21st century manufacturing is transforming lives in aerospace\, automotive\, healthcare\, energy\, digital home\, and wearables. \nWelcome to Manufacturing Day!\nManufacturing Day Message by USD(A&S) LaPlante\n360-degree Tour of the NextFlex Fab \nLearn about the machines for printing\, assembling\, and testing in our Technology Hub! \nAbout NextFlex\nNextFlex is one of nine Manufacturing Innovation Institutes established by the DoD Manufacturing Technology Program\, is a consortium of 100 members with the shared goal of advancing the manufacture of flexible hybrid electronics (FHE) in the U.S. Since its formation in 2015\, the NextFlex community of technologists\, educators\, problem solvers and manufacturers have come together to collectively facilitate innovation\, narrow the manufacturing workforce gap and promote sustainable manufacturing ecosystems to further advance U.S. manufacturing across a range of technology areas. \nIn addition to the innovation work NextFlex leads with its members\, it also operates a pilot-scale manufacturing line at its headquarters in San Jose\, California. Known as the Technology Hub\, this state-of-the-art manufacturing facility designs\, prototypes\, assembles and tests flexible hybrid electronics devices and systems that are transforming electronics by taking them “out of the box.” FHEs are lighter weight\, thinner and smaller\, faster and less expensive to make\, and can bend\, stretch or conform to any shape thereby revolutionizing electronics for both military and commercial applications in medical wearables\, structural health monitoring\, RF and communications\, aerospace and more.
URL:https://www.nextflex.us/event/manufacturing-day-2023/
LOCATION:California
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=UTC:20230928T100000
DTEND;TZID=UTC:20230928T110000
DTSTAMP:20260824T124728
CREATED:20230928T091024Z
LAST-MODIFIED:20240222T083337Z
UID:12197-1695895200-1695898800@www.nextflex.us
SUMMARY:Webinar - Supporting Critical Defense Microelectronics with PRISM
DESCRIPTION:Register Below\n[gotowebinar-reg key=”7160158691438621271″]
URL:https://www.nextflex.us/event/webinar-supporting-critical-defense-microelectronics-with-prism/
LOCATION:California
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=UTC:20230626T000000
DTEND;TZID=UTC:20230628T000000
DTSTAMP:20260824T124728
CREATED:20230628T091011Z
LAST-MODIFIED:20240222T083711Z
UID:12193-1687737600-1687910400@www.nextflex.us
SUMMARY:The Hybrid Electronics Commercialization Path for Aerospace Applications
DESCRIPTION:Hosted by The Boeing Company \nLearn. Network. Make Connections. \nJoin us for a technical workshop and professional program focused on hybrid electronic technologies\, enjoy the Museum of Flight\, take in technical sessions with expert speakers\, and network with fellow attendees. \nAbout Workshop \nThe Hybrid Electronics Commercialization Path for Aerospace Applications workshop will explore applications\, opportunities\, and challenges for hybrid electronics in Aerospace and Aviation\, including commercial and military aircraft\, UAVs\, and space. The workshop will feature technical presentations on the state of the art\, R&D and manufacturing activities\, and application needs and requirements. Panel discussions and sidebars will focus on commercialization\, licensing\, and the path to market. Presentations will include goals and objectives identified by the commercial manufacturers\, Department of Defense\, Boeing\, and NASA. \nIncluded in the registration fee is breakfasts\, lunches\, a networking reception\, some transportation during the workshop*\, and a special dinner at a local restaurant. \nRegistration closes at noon PT on June 12th as Boeing needs visitor registration information two weeks before the event. \n  \n*We will have buses for transportation from these hotels\, so we advise that you stay at one of the following. If you choose to stay at a different hotel\, you will need to arrange transportation to these hotels to ensure that you are on the bus. \nHyatt Regency Lake Washington at Seattle’s Southport (recommended) \n\n0.7 miles away\nReg $259/night\nGov $232/night\nReservation Link: https://www.hyatt.com/en-US/group-booking/SEARL/G-NXFX\n\nHampton Inn & Suites Seattle/Renton \n\n0.5 miles away\nReg $299/night\nGov $232/night\n\nResidence Inn Seattle South/Renton \n\n0.5 miles away\nReg $399/night\nGov rate not available\n\n  \n\n\nLoading…
URL:https://www.nextflex.us/event/the-hybrid-electronics-commercialization-path-for-aerospace-applications/
LOCATION:California
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=UTC:20230620T130000
DTEND;TZID=UTC:20230620T150000
DTSTAMP:20260824T124728
CREATED:20230620T091011Z
LAST-MODIFIED:20240518T045943Z
UID:12194-1687266000-1687273200@www.nextflex.us
SUMMARY:North San Jose Manufacturer's Roundtable
DESCRIPTION:Please join your fellow North San Jose manufacturers for a networking event and roundtable discussion\, brought to you by Manufacture: San Jose. Coffee and snacks provided by San Jose’s own Chromatic Coffee and R&J Toffees. \nThis event is free for manufacturing business owners located in San Jose. \nAgenda: \n1) Welcome and introductions from Manufacture: San Jose\, the City of San Jose\, and NextFlex. \n2) Roundtable questions and discussion time. \n3) Open networking time.
URL:https://www.nextflex.us/event/north-san-jose-manufacturers-roundtable/
LOCATION:California
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=UTC:20230328T000000
DTEND;TZID=UTC:20230329T000000
DTSTAMP:20260824T124728
CREATED:20230328T091006Z
LAST-MODIFIED:20240518T064120Z
UID:12190-1679961600-1680048000@www.nextflex.us
SUMMARY:NextFlex Winter FHE Symposium 2023
DESCRIPTION:Join us March 28 & 29\, 2023 for our second annual Winter FHE Symposium. The event will be both virtual and in-person\, with the in-person component held at NextFlex headquarters in San Jose\, CA. \nWe look forward to seeing you there! \n\n\nLoading… \n\nPowered ByWhova
URL:https://www.nextflex.us/event/nextflex-winter-fhe-symposium-2023/
LOCATION:California
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=UTC:20230322T093000
DTEND;TZID=UTC:20230322T143000
DTSTAMP:20260824T124728
CREATED:20230322T091010Z
LAST-MODIFIED:20240222T083755Z
UID:12191-1679477400-1679495400@www.nextflex.us
SUMMARY:Cross-MII Workshop: Multidisciplinary Tool Usage and Development
DESCRIPTION:The objective of this workshop is to bring together stakeholders in digital tool usage and development across the memberships of AFFOA\, ARM\, and NextFlex. The workshop will focus on addressing key challenges soft systems and electronic textile production development. \nParticipation in this workshop will help guide future investment in multidisciplinary digital tools\, methodologies\, and supporting infrastructure for e-textiles. \nThe first 30 interested members have an opportunity to brief AFFOA\, ARM\, and NextFlex members on contributions and solution in digital development.
URL:https://www.nextflex.us/event/cross-mii-workshop-multidisciplinary-tool-usage-and-development/
LOCATION:California
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=UTC:20230215T100000
DTEND;TZID=UTC:20230215T110000
DTSTAMP:20260824T124728
CREATED:20230215T101010Z
LAST-MODIFIED:20240222T083806Z
UID:12192-1676455200-1676458800@www.nextflex.us
SUMMARY:Advanced Packaging Workshop Report Discussion
DESCRIPTION:Members and subject matter experts convened at NextFlex on January 18 and 19 to explore and align opportunities for flexible and additive hybrid electronics for semiconductor packaging. Attendees broke into four groups for solutions gathering and prioritization to identify ways for how the industry can shape the future of U.S. packaging capabilities. Four key themes were addressed by the attendees: Direct Write Interconnects; Substrates and Build-up Layers; Interposers\, Bridges & Architectures\, and Circuitization. Solutions that were identified will inform not only potential NextFlex Project Call topics\, but also proposals for opportunities that may arise from the CHIPS and Science Act or other programs. \nA report of the findings from the workshop will be delivered during this webinar. \nAgenda:\n\nIntroduction\nBreakout Session Reports\n\nBreakout Topic: Direct Write Interconnects\n\nKey Technical gaps identified\nProposed solution\n\n\nTopic: Substrates and Buildup\n\nKey Technical gaps identified\nProposed solutions\n\n\nBreakout Topic: Interposers\, Bridges & Architectures\n\nKey Technical gaps identified\nProposed solutions\n\n\nBreakout Topic: Circuitization\n\nKey Technical gaps identified\nProposed solutions\n\n\n\n\nConclusion/Next Steps
URL:https://www.nextflex.us/event/advanced-packaging-workshop-report-discussion/
LOCATION:California
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=UTC:20230118T140000
DTEND;TZID=UTC:20230119T170000
DTSTAMP:20260824T124728
CREATED:20230118T101005Z
LAST-MODIFIED:20240222T083817Z
UID:12189-1674050400-1674147600@www.nextflex.us
SUMMARY:NextFlex Workshop: Applications of Hybrid Electronics for Advanced Packaging
DESCRIPTION:Registration Information\nNextFlex members can attend the full three days for a discounted price of $199. If you are also a SEMI member\, you do not need to use a code; the SEMI system will recognize you as a member if you log in with your SEMI credentials. \nWorkshop Description\nThis day and a half workshop will convene NextFlex members\, industry experts\, academic and government leaders\, and others from the FHE manufacturing community to explore opportunities for flexible hybrid electronics manufacturing technologies in new and emerging areas of advanced semiconductor packaging. As the community awaits the release of request for proposals (RFPs) for programs within the CHIPS and Science Act\, NextFlex seeks to align the ecosystem’s vision on how additive and flexible hybrid electronics manufacturing can shape the future of domestic packaging capabilities. Join us for presentations from visionary speakers on how their organizations plan to participate in the CHIPS and Science Act programs and participate in breakout sessions focused on information sharing\, proposal concept refinement\, and formation of proposal teams. \nAgenda\nWednesday\, January 18 \n1:00 pm – 2:00 pm – Arrival at NextFlex  \n1:15 pm – 2:00 pm – Informal Tours at NextFlex Headquarters  \n2:00 pm – 2:05 pm – Welcome to NextFlex – Dr. Malcolm Thompson\, Executive Director\, NextFlex \n2:05 pm – 2:15 pm – Workshop Introduction – Dr. Scott Miller\, Director of Technology\, NextFlex \n2:15 pm – 3:00 pm – Keynote – Dr. Tom Rucker\, VP\, Technology Development and Dir-Assembly and Test Technology\, Intel \n3:00 pm – 3:15 pm – Break \n3:15 pm – 3:35 pm – Direct Write Interconnects – Dave Ramahi\, Optomec \n3:35 pm – 3:55 pm – Substrates and Build-up Layers – David Bolognia\, Analog Devices \n3:55 pm – 4:15 pm – Interposers\, Bridges\, & Architectures – Dr. Harvey Tsang\, ARL \n4:15 pm – 4:35 pm – Circuitization – Dr. Daniel Slep\, ChemCubed \n4:35 pm – 5:05 pm – CHIPS Act Opportunities for NextFlex – Dr. Art Wall\, Director of Fab Operations\, NextFlex \n5:05 pm – 5:25 pm – Wrap Up & Instructions for Day 2 – Dr. Scott Miller\, NextFlex \n5:25 pm – 6:30 pm – Networking Reception  \n  \nThursday\, January 19 \n8:00 am – 8:30 am – Arrival and Continental Breakfast \n8:30 am – 8:40 am – Program Start: Welcome – Dr. Scott Miller\, NextFlex \n8:40 am – 9:00 am – Direct Write Interconnects – Dr. Dan Hines\, Raytheon \n9:00 am – 9:20 am – Substrates and Buildup Layers – Matt Neely\, TTM Technologies \n9:20 am – 9:30 am – Breakout Instructions – Dr. Scott Miller\, NextFlex \n9:30 am – 10:30 am – Breakout Session 1 – Give overview\, introduce participants\, and define topic  \nObjective: Form breakout team; clarify topic; clarify scope (packaging problems to solve)​ \n\nDirect Write Interconnects\n\nWire bond replacement\, flip chip\, high density interconnects\, wafer-level bump printing\, post-processing techniques (curing/sintering)\, conductive adhesives\, low temperature solders\n\n\nSubstrates and Buildup\n\nSubstrates (organic and additive)\, printed buildup layers\, embedded die\, encapsulation\, thermal management)\n\n\nInterposers\, Bridges & Architectures\n\nInterposers (flexible\, high density printed\, non-silicon materials)\, flexible bridges in additive package\, system in package\, package on a package\, antenna in package\, sensor integration\n\n\n Circuitization\n\nMulti-material printing for multilayer\, masked / seed layer print & plate\, vias (boring\, filling\, plating)\n\n\n\n10:30 am – 11:00 am – Coffee Break \n11:00 am – 12:15 pm – Breakout Session 2 – Identify solutions  \nObjective: Identify solutions to problems identified in breakout 1 (collect ideas from participants).​ \n\nDirect Write Interconnects\nSubstrates and Buildup\nInterposers\, Bridges & Architectures\nCircuitization\n\n12:15 pm – 1:15 pm – Lunch \n1:15 pm – 2:30 pm – Breakout Session 3 – Develop approaches/proposal topics  \nObjective: Prioritize solutions; group solutions into candidate proposals with high-level tasks\, participants\, outcomes​ \n\nDirect Write Interconnects\nSubstrates and Buildup\nInterposers\, Bridges & Architectures\nCircuitization\n\n2:30 pm – 3:00 pm – Break  \n3:00 pm – 4:00 pm – Breakout Session 4 – Summarize\, wrap up\, and build slides \nObjective: Develop report-out material; identify next steps \n\nDirect Write Interconnects\nSubstrates and Buildup\nInterposers\, Bridges & Architectures\nCircuitization\n\n4:00 pm – 5:00 pm – Breakout Reports & Definition of Next Steps by Breakout Leaders – Dr. Scott Miller\, NextFlex \n5:00 pm – Program Ends  \nAdditional Event & Registration Information\nThis workshop is being held in conjunction with events sponsored by SEMI who will be processing all of the registration for the event. \nNextFlex members can use code TW199NF for a discounted price of $199. \nGovernment partners can use code TW100NF for a complimentary pass. \nSEMI events include: \nSEMI FlexTech FHE Technical Gap Analysis Workshop  – Tues. 1/17 – 8 am-12 noon\n@ SEMI – 673 S. Milpitas Blvd – Milpitas\, CA \nDuring this workshop the attendees will complete a Technical Gap Analysis in preparation for FlexTech’s next Request for Proposals (RFP)\, including exploring topics and technology development required to meet development objectives. Lunch will be served following the workshop. \nSEMI NBMC Technical Gap Analysis Workshop – Tues. 1/17 – 1:00-5:00 pm\n@ SEMI – 673 S. Milpitas Blvd – Milpitas\, CA \nAttendees will turn their sights to preparing the technical topics / gaps in the Nano-Bio Materials space to explore topics and technology development required to meet development objectives.  A networking reception will follow the workshop. \nSEMI Standards – FHE Standards Workshop – Wed 1/18 – 8:00am – 1:00pm\n@ SEMI – 673 S. Milpitas Blvd – Milpitas\, CA \nMany topics and paths were identified at the previous\, very successful workshop in July 2022. This workshop will take the work a step further and create scopes of work for this very important foundation required to propel the design in of FHE-based components. This workshop includes a continental breakfast and lunch.
URL:https://www.nextflex.us/event/nextflex-workshop-applications-of-hybrid-electronics-for-advanced-packaging/
LOCATION:California
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=UTC:20221007T100000
DTEND;TZID=UTC:20221007T120000
DTSTAMP:20260824T124728
CREATED:20221007T091005Z
LAST-MODIFIED:20260819T230746Z
UID:12188-1665136800-1665144000@www.nextflex.us
SUMMARY:Manufacturing Day 2022
DESCRIPTION: \n\n \n\n \n\n \n\nEach year\, Manufacturing Day (MFG Day) is held on the first Friday in October in order to show students\, parents\, and the public what modern manufacturing is all about.  The fourth industrial revolution is rapidly changing our world. New advanced manufacturing technologies bring about whole new careers\, requiring a skilled workforce interested in pursuing them. From bioengineers\, to data analysts to robotics technicians\, and all of the operations in between\, there is a place for everyone in manufacturing!\n\nHaving long been the cornerstone of the American economy\, manufacturing continues to provide highly skilled and highly paid jobs that create thriving communities. Still\, the diversity of existing opportunities and the corresponding career potential that accompanies those opportunities is too often overlooked or misunderstood which is why each year\, Manufacturing Day celebrates and showcases both the work\, and many of the individuals\, that comprise the US manufacturing sector.\n\nAt this year’s Manufacturing Day\, NextFlex will be hosting local high school students at our San Jose headquarters where participants can meet with technologists\, tour the facility\, and learn about how 21st century manufacturing is transforming lives in aerospace\, automotive\, healthcare\, energy\, digital home\, and wearables.\nWelcome to Manufacturing Day 2022!\n\nManufacturing Day Message by USD(A&S) LaPlante\n\n360-degree Tour of the NextFlex Fab \nLearn about the machines for printing\, assembling\, and testing in our Technology Hub!\n\n\nAbout NextFlex\nNextFlex is one of nine Manufacturing Innovation Institutes established by the DoD Manufacturing Technology Program\, is a consortium of 100 members with the shared goal of advancing the manufacture of flexible hybrid electronics (FHE) in the U.S. Since its formation in 2015\, the NextFlex community of technologists\, educators\, problem solvers and manufacturers have come together to collectively facilitate innovation\, narrow the manufacturing workforce gap and promote sustainable manufacturing ecosystems to further advance U.S. manufacturing across a range of technology areas.\n\nIn addition to the innovation work NextFlex leads with its members\, it also operates a pilot-scale manufacturing line at its headquarters in San Jose\, California. Known as the Technology Hub\, this state-of-the-art manufacturing facility designs\, prototypes\, assembles and tests flexible hybrid electronics devices and systems that are transforming electronics by taking them “out of the box.” FHEs are lighter weight\, thinner and smaller\, faster and less expensive to make\, and can bend\, stretch or conform to any shape thereby revolutionizing electronics for both military and commercial applications in medical wearables\, structural health monitoring\, RF and communications\, aerospace and more.
URL:https://www.nextflex.us/event/manufacturing-day-2022/
LOCATION:California
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=UTC:20220831T100000
DTEND;TZID=UTC:20220831T110000
DTSTAMP:20260824T124728
CREATED:20220831T091005Z
LAST-MODIFIED:20240222T083838Z
UID:12187-1661940000-1661943600@www.nextflex.us
SUMMARY:Advanced Packaging Roundtable for NextFlex Members
DESCRIPTION:Join us for a follow-on discussion on plans for a NextFlex response to an anticipated RFP on Advanced Packaging manufacturing capability development in the US as part of the CHIPS Act. The momentum behind this topic continues in the microelectronics community so we will be prepared to put forth a proposal on behalf of the FHE community. In particular\, we will make the argument that the additive processes that have been developed for FHE make sense in application toward advanced packaging.
URL:https://www.nextflex.us/event/advanced-packaging-roundtable-for-nextflex-members/
LOCATION:California
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=UTC:20220802T083000
DTEND;TZID=UTC:20220803T180000
DTSTAMP:20260824T124728
CREATED:20220802T091004Z
LAST-MODIFIED:20240222T083855Z
UID:12186-1659429000-1659549600@www.nextflex.us
SUMMARY:Innovation Days 2022
DESCRIPTION:During Innovation Days we gather FHE subject matter experts from NextFlex\, members\, and government partners to celebrate our latest collective achievements and plans for future collaboration. Our theme this year is Navigating the Future with Hybrid Electronics. \nInnovation Days will include many in-person only activities such as a tabletop demo exhibition hall. In addition\, there will be some livestream options for those of you who cannot travel. \nWe look forward to seeing you then! \n\n\nLoading… \n\n \n  \n\nPowered By Whova\nConference registration software\n\n\nLoading…
URL:https://www.nextflex.us/event/innovation-days-2022/
LOCATION:California
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=UTC:20220429T110000
DTEND;TZID=UTC:20220429T150000
DTSTAMP:20260824T124728
CREATED:20220429T090948Z
LAST-MODIFIED:20240222T083908Z
UID:12185-1651230000-1651244400@www.nextflex.us
SUMMARY:The Future of the Workforce: Meet the Change-makers III
DESCRIPTION:NextFlex Roundtable: Creating a Skilled Talent Pipeline to Strengthen US Manufacturing\n \nAbout this Event\n\n\nNextFlex staff and special guests provide encouragement to students during a virtual FlexFactor Final Pitch earlier this year.  \nAs part of a larger commitment to support NextFlex workforce development partners\, NextFlex is providing public platforms for thought leaders to share their visions for and successes in training the workforce of the future. For the second installment of our new online roundtable series\, The Workforce of the Future: Meet the Changemakers\, we will explore how academic-industry partnerships can bolster innovation in the workforce through applied learning and other practices to increase students’ preparation for employment in the advanced manufacturing sector. \nTechnology and innovation drive growth in the manufacturing sector and\, in turn\, require a highly skilled workforce that can adapt rapidly to technology changes. However\, a manufacturing skills gap exacerbated by the COVID-19 pandemic could possibly lead to 2.1 million jobs unfilled by 2030[1]. To effectively close this gap and prepare students for careers in advanced manufacturing\, community colleges and industry increasingly see the need to work more closely to provide students with a range of hands-on experiences and practical learning essential to become competitive and competent candidates. \nRecognizing the need to blend technical education and professional experience\, NextFlex and Evergreen Valley College have partnered with local industry to launch a new Advanced Manufacturing Technology (AMT) program. The AMT pathway is a two-year certificate program that focuses on both the theoretical and applied learning essential for a technician in the advanced manufacturing sector. Prior to graduation\, students are exposed to concepts like troubleshooting unexpected problems\, manufacturing best practices\, industry standards and high-volume production – all difficult topics to cover in a classroom and crucial for success in today’s technology-driven manufacturing sector. \nThe program was launched in AY 2020-2021 with a small group of 24 students led by three industry-based adjuncts. The pilot demonstrated impressive results – of the inaugural class\, 11 students participated in work-based learning experiences\, and all were placed in full time industry positions. \n[1] Deloitte and The Manufacturing Institute study\, May 4\, 2021 \nAgenda\n2:00PM – 6:00PM EST \n\nEmcee Opening – Terri Burgess Sandu\, Director of Talent and Business Innovation\, LCCC\nLCCC Welcome – Dr. Marcia Ballinger\, President\, LCCC\nFlexFactor Student Demonstration Showcase – Facilitated by Ron Jantz\, Digital Media Coordinator\, LCCC\nNextFlex Welcome and Introductions\n\nDr. Malcolm J. Thompson\, Executive Director\, NextFlex\nLeanne Caret\, EVP and Senior Advisor\, The Boeing Company\nThe Honorable Martin J. Walsh\, US Secretary of Labor\nJagadeesh Pamulapati\, Deputy Director\, Research\, Technology and Laboratories (Acting)\, Department of Defense\n\n\nRoundtable Discussion – Facilitated by Ms. Courtney Power\, Deputy Director\, Workforce Development\, NextFlex\n\nThe Honorable Martin J. Walsh\, US Secretary of Labor\nLeanne Caret\, EVP and Senior Advisor\, The Boeing Company\nZachary Kiehl\, CEO and Cofounder\, Sentinel\nHenry Cialone\, President & CEO\, EWI\nMarcia Ballinger\, President\, LCCC\nTracy Albers\, President and CEO\, rapid prototype + manufacturing LLC (rp+m)\n\n\nConcluding Remarks – Ms. Terri Burgess Sandu\, Director of Talent and Business Innovation\, LCCC
URL:https://www.nextflex.us/event/the-future-of-the-workforce-meet-the-change-makers-iii/
LOCATION:California
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=UTC:20220301T080000
DTEND;TZID=UTC:20220303T080000
DTSTAMP:20260824T124728
CREATED:20220301T100948Z
LAST-MODIFIED:20240222T083926Z
UID:12182-1646121600-1646294400@www.nextflex.us
SUMMARY:NextFlex Winter FHE Symposium
DESCRIPTION:About this Event\n\n\nJoin us for the NextFlex Winter FHE Symposium on March 1-3\, 2022\, on-site at NextFlex or virtually. This three-day event will connect the entire FHE ecosystem through project call opportunities\, collaborations\, and technology success stories. \nThe agenda will include events for both NextFlex members and non-members. \n\n  \n\nAgenda\n\n\nLoading… \n\n\nPowered By Whova \n\n \n\n\nIf you want to attend the Technical Workshop on March 1 and 2\, select the corresponding Add-In option in the registration below.\n\n\nPowered By Whova\nOnline conference registration
URL:https://www.nextflex.us/event/nextflex-winter-fhe-symposium/
LOCATION:California
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=UTC:20220223T103000
DTEND;TZID=UTC:20220223T120000
DTSTAMP:20260824T124728
CREATED:20220223T100948Z
LAST-MODIFIED:20240222T084143Z
UID:12184-1645612200-1645617600@www.nextflex.us
SUMMARY:CADENCE Program Webinar: Sierra Turbines
DESCRIPTION:Using additive manufacturing\, Sierra Turbines has developed a turbine engine which excels in reliability due to several design innovations such as a proprietary electronic control system\, Engine Health Monitoring\, and precision thermodynamic flows in both compression and combustion. Sierra Turbines’ initial market focus is on the Unmanned Aerial Vehicles (UAVs) and ground-based\, hybrid electrical systems. Flexible Hybrid Electronics technology shows great promise and benefit to microturbine applications given the inherent nature of FHE structures with applications to structural health\, and asset and system performance monitoring. \nAgenda:\n\nIntroduction – Ed Hendricks\, NextFlex\nNextFlex Support to Sierra Turbines – Alex Cook\, NextFlex\nSierra Turbines Presentation – Roger Smith\n\nHow the CADENCE Grant / NextFlex Support has benefitted Sierra Turbines\nSierra Turbines and SansEC and the ST micro-Turbine\nNext steps for Sierra Turbines\n\n\nQ&A Opportunities for audience\n\nRegister\n
URL:https://www.nextflex.us/event/cadence-program-webinar-sierra-turbines/
LOCATION:California
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=UTC:20220216T103000
DTEND;TZID=UTC:20220216T120000
DTSTAMP:20260824T124728
CREATED:20220216T100948Z
LAST-MODIFIED:20240222T084154Z
UID:12183-1645007400-1645012800@www.nextflex.us
SUMMARY:CADENCE Program Webinar: Space Foundry
DESCRIPTION:Space Foundry has developed atmospheric pressure plasma jet technology to print electronic materials on both flexible and non-planar substrates. Aerosolized ink travels through the print head\, where the plasma is generated. The plasma helps in tailoring the material properties in-situ\, directs the materials to the substrate\, and primes the substrate for better adhesion. This unique technology has potential to reduce on high quality inks\, reduce process steps (curing of inks)\, and expand the portfolio of materials able to be printed and printed on. \nAgenda:\n\nIntroduction – Ed Hendricks\, NextFlex\nNextFlex Support to Space Foundry – Amy Mueller\, NextFlex\n Space Foundry Presentation – Ram Gandhiraman\n\nHow has the CADENCE Grant / NextFlex Support has benefitted Space Foundry?\nSpace Foundry and the plasma printer\nNext steps for Space Foundry\n\n\nQ&A Opportunities for audience\n\nRegister\n
URL:https://www.nextflex.us/event/cadence-program-webinar-space-foundry/
LOCATION:California
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=UTC:20211214T100000
DTEND;TZID=UTC:20211214T110000
DTSTAMP:20260824T124728
CREATED:20211214T100947Z
LAST-MODIFIED:20240222T084206Z
UID:12181-1639476000-1639479600@www.nextflex.us
SUMMARY:The Future of the Workforce: Meet the Change-makers II
DESCRIPTION:NextFlex Roundtable: Evergreen Valley College and STEM Learning & Industry Partnerships\n\n \n  \n  \nAbout this Event\n\n\nNextFlex staff and special guests provide encouragement to students during a virtual FlexFactor Final Pitch earlier this year.  \nAs part of a larger commitment to support NextFlex workforce development partners\, NextFlex is providing public platforms for thought leaders to share their visions for and successes in training the workforce of the future. For the second installment of our new online roundtable series\, The Workforce of the Future: Meet the Changemakers\, we will explore how academic-industry partnerships can bolster innovation in the workforce through applied learning and other practices to increase students’ preparation for employment in the advanced manufacturing sector. \nTechnology and innovation drive growth in the manufacturing sector and\, in turn\, require a highly skilled workforce that can adapt rapidly to technology changes. However\, a manufacturing skills gap exacerbated by the COVID-19 pandemic could possibly lead to 2.1 million jobs unfilled by 2030[1]. To effectively close this gap and prepare students for careers in advanced manufacturing\, community colleges and industry increasingly see the need to work more closely to provide students with a range of hands-on experiences and practical learning essential to become competitive and competent candidates. \nRecognizing the need to blend technical education and professional experience\, NextFlex and Evergreen Valley College have partnered with local industry to launch a new Advanced Manufacturing Technology (AMT) program. The AMT pathway is a two-year certificate program that focuses on both the theoretical and applied learning essential for a technician in the advanced manufacturing sector. Prior to graduation\, students are exposed to concepts like troubleshooting unexpected problems\, manufacturing best practices\, industry standards and high-volume production – all difficult topics to cover in a classroom and crucial for success in today’s technology-driven manufacturing sector. \nThe program was launched in AY 2020-2021 with a small group of 24 students led by three industry-based adjuncts. The pilot demonstrated impressive results – of the inaugural class\, 11 students participated in work-based learning experiences\, and all were placed in full time industry positions. \n[1] Deloitte and The Manufacturing Institute study\, May 4\, 2021 \nAgenda\n10:00AM – 11:00AM PST \n1. Welcome and Overview: [popup_anything id=”8131″] (2 min) \n2. Introduction: [popup_anything id=”8448″] (3 min) \n3. Remarks by The Honorable [popup_anything id=”8453″] (7 min) \n4. Panel Q & A (4 min each)\, moderated by [popup_anything id=”8131″] \n\nIndustry Perspective: Ms. Kelli Dutra\, Manufacturing Director\, CAES\nPerspectives on STEM Learning and Industry Partnerships: [popup_anything id=”8451″]\nStudent Perspective: Mr. Michael Rizo\nPolicy Perspective: [popup_anything id=”8453″]\n\n5.Roundtable discussion of STEM\, Industry Partnerships and the Future Workforce (15 min) \n\nOnline participants Q&A\, moderated by [popup_anything id=”8131″]\n\n6. Conclusion: [popup_anything id=”8131″] \nTargeted Audience\n\nHigher education administrators\nHigh School administrators and teachers\nNextFlex manufacturing industry members
URL:https://www.nextflex.us/event/the-future-of-the-workforce-meet-the-change-makers-ii/
LOCATION:California
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=UTC:20211020T070000
DTEND;TZID=UTC:20211020T080000
DTSTAMP:20260824T124728
CREATED:20211020T090934Z
LAST-MODIFIED:20240222T084231Z
UID:12180-1634713200-1634716800@www.nextflex.us
SUMMARY:Tech Council Meeting
DESCRIPTION:Join NextFlex members and government partners to discuss the latest in technology trends and funded project updates. This virtual event will include interactive live polling throughout as well as several opportunities for attendees to ask questions. The day will conclude with a panel discussion focusing on funding fundamental research. \nAgenda (All Times in Pacific Time)\n8:00AM – 8:15AM – Agenda Overview\, Polling Set-Up\, & Technology Update \nDr. Scott Miller will lay out the agenda for the day and explain how attendees can participate in polling. A brief technology update will be outlined. \n\nDr. Scott Miller\, Director of Technology\, NextFlex\n\n8:15AM – 8:45AM – Flexible Microcontroller Project at NextFlex \nJeff Bergman will give an overview of the work completed at NextFlex for the flexible microcontroller (A21) project. It will include Q&A and a live poll where attendees can vote on functionality they would like to see in the future. \n\nJeffrey Bergman\, Engineering Manager\, Systems Design & Simulation\, Advanced Technologies Group\, NextFlex\n\n8:45AM – 9:15AM – Technology Roadmap Updates and Technical Working Group Survey Results \nDr. Nick Morris will give technology roadmap updates and focus on the gaps across all technical working groups. It will include Q&A. He will also conduct a live poll where attendees can vote on various aspects of the roadmaps. \n\nDr. Nick Morris\, FHE Technology Manager\, NextFlex\n\n9:15AM – 9:30AM – Break \n9:30AM – 10:00AM – PC 5.2B Adhesives for Surface Mount and Die Attach \nDr. David Grierson\, Principal Investigator on this project\, will discuss this funded project’s plan and outcome in depth. This will include Q&A. \n\nDr. David Grierson\, Co-Founder and CTO\, systemech\n\n10:00AM – 10:30AM – Robotic Fab Platform Development at NextFlex \nBen Plattner will discuss the robotic platform that was developed at NextFlex’s Fab that enables flexible manufacturing paths at a lower cost. This will include Q&A. \n\nBen Plattner\, Engineering Manager\, Robotics & Automation\, NextFlex\n\n10:30AM – 11:00AM – PC 6.6: Design Tool Development for Printing Conformal Circuits. \nDavid Keicher\, Principal Investigator on this project\, will discuss the funded project’s update and plan. This will include Q&A. \n\nDavid Keicher\, Vice President\, IDS\, Inc \n\n11:00AM – 11:15AM – Break \n11:15AM – 12:15PM – Panel Discussion: Bridging Fundamental and Applied Research for FHE Manufacturing \nThe panel will bring together government agencies focusing on funding fundamental (low TRL) research and NextFlex members who use those funds for FHE manufacturing. This panel will include Q&A. \n\nModerator: Dr. Ben Leever\, Acting Chief\, Manufacturing & Industrial Technology\, Air Force Research Laboratory\nPanelists:\n\nDr. Regina Shia\, Research Biological Scientist\, Air Force Research Laboratory\nDr. Nancy Stoffel\, Platform Leader for Flexible Hybrid Electronics\, GE Global Research\nDr. Ali Shakouri\, Director of the Birck Nanotechnology Center and Professor of Electrical and Computer Engineering\, Purdue University\nBrian Farrell\, President and CEO\, Human Systems Integration\, Inc.\nBruce Kramer\, Senior Advisor\, Manufacturing in the Division of Civil\, Mechanical and Manufacturing Innovation\, National Science Foundation\nDr. Antti Makinen\, Acting Director\, Naval Materials Division\, Office of Naval Research\n\n\n\n12:15PM – 12:30PM – Closing Remarks and Final Poll \nDr. Scott Miller will wrap up the day’s agenda and conduct an audience poll about PC 7.0 topics and topics for the next Tech Council Meeting. \n\nDr. Scott Miller\, Director of Technology\, NextFlex
URL:https://www.nextflex.us/event/tech-council-meeting/
LOCATION:California
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=UTC:20211001T000000
DTEND;TZID=UTC:20211001T010000
DTSTAMP:20260824T124728
CREATED:20211001T090933Z
LAST-MODIFIED:20240222T084454Z
UID:12179-1633046400-1633050000@www.nextflex.us
SUMMARY:Manufacturing Day 2021
DESCRIPTION:  \n \nEach year\, Manufacturing Day (MFG Day) is held on the first Friday in October in order to show students\, parents\, and the public what modern manufacturing is all about.  The fourth industrial revolution is rapidly changing our world. New advanced manufacturing technologies bring about whole new careers\, requiring a skilled workforce interested in pursuing them. From bioengineers\, to data analysts to robotics technicians\, and all of the operations in between\, there is a place for everyone in manufacturing! \nHaving long been the cornerstone of the American economy\, manufacturing continues to provide highly skilled and highly paid jobs that create thriving communities. Still\, the diversity of existing opportunities and the corresponding career potential that accompanies those opportunities is too often overlooked or misunderstood which is why each year\, Manufacturing Day celebrates and showcases both the work\, and many of the individuals\, that comprise the US manufacturing sector. \nAt this year’s Manufacturing Day\, NextFlex aired a new video showing how manufacturing solves real-world problems. NextFlex engineers will identify a problem and design a solution using Flexible Hybrid Electronics! After the video\, students and teachers were able to ask the engineers questions about advanced manufacturing and the benefits of working in the manufacturing sector. \n    \n\n\n  \n  \nAbout NextFlex \nNextFlex is one of eight Manufacturing Innovation Institutes established by the DoD Manufacturing Technology Program\, is a consortium of 100 members with the shared goal of advancing the manufacture of flexible hybrid electronics (FHE) in the U.S. Since its formation in 2015\, the NextFlex community of technologists\, educators\, problem solvers and manufacturers have come together to collectively facilitate innovation\, narrow the manufacturing workforce gap and promote sustainable manufacturing ecosystems to further advance U.S. manufacturing across a range of technology areas. \nIn addition to the innovation work NextFlex leads with its members\, it also operates a pilot-scale manufacturing line at its headquarters in San Jose\, California. Known as the Technology Hub\, this state-of-the-art manufacturing facility designs\, prototypes\, assembles and tests flexible hybrid electronics devices and systems that are transforming electronics by taking them “out of the box.” FHEs are lighter weight\, thinner and smaller\, faster and less expensive to make\, and can bend\, stretch or conform to any shape thereby revolutionizing electronics for both military and commercial applications in medical wearables\, structural health monitoring\, RF and communications\, aerospace and more.
URL:https://www.nextflex.us/event/manufacturing-day-2021/
LOCATION:California
END:VEVENT
END:VCALENDAR