BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//NextFlex - ECPv6.15.15//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://www.nextflex.us
X-WR-CALDESC:Events for NextFlex
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:UTC
BEGIN:STANDARD
TZOFFSETFROM:+0000
TZOFFSETTO:+0000
TZNAME:UTC
DTSTART:20240101T000000
END:STANDARD
END:VTIMEZONE
BEGIN:VTIMEZONE
TZID:America/Los_Angeles
BEGIN:DAYLIGHT
TZOFFSETFROM:-0800
TZOFFSETTO:-0700
TZNAME:PDT
DTSTART:20240310T100000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0700
TZOFFSETTO:-0800
TZNAME:PST
DTSTART:20241103T090000
END:STANDARD
BEGIN:DAYLIGHT
TZOFFSETFROM:-0800
TZOFFSETTO:-0700
TZNAME:PDT
DTSTART:20250309T100000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0700
TZOFFSETTO:-0800
TZNAME:PST
DTSTART:20251102T090000
END:STANDARD
BEGIN:DAYLIGHT
TZOFFSETFROM:-0800
TZOFFSETTO:-0700
TZNAME:PDT
DTSTART:20260308T100000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0700
TZOFFSETTO:-0800
TZNAME:PST
DTSTART:20261101T090000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART;TZID=UTC:20250430T093000
DTEND;TZID=UTC:20250430T140000
DTSTAMP:20260409T032537
CREATED:20250221T032953Z
LAST-MODIFIED:20250424T032204Z
UID:15439-1746005400-1746021600@www.nextflex.us
SUMMARY:Innovating\, Investing\, Leading for the Defense Industrial Base
DESCRIPTION:OverviewJoin us in celebrating 10 years of collaboration and innovation between the Ohio Technical Skills Innovation Network (Ohio TechNet)\, NextFlex\, and Lorain County Community College.At this milestone event\, industry leaders\, workforce experts\, and education partners will highlight high-impact practices that address the evolving talent needs of manufacturing\, with a particular focus on the defense industrial base.Keynote SpeakerBrynt ParmeterChief Talent Management Officer\, Office of the Under Secretary of Defense for Personnel and ReadinessU.S. Department of Defense Mr. Brynt Parmeter was appointed as the inaugural Chief Talent Management Officer (CTMO) for the U.S. Department of Defense on April 10\, 2023. In this role\, which resides in the Office of the Under Secretary of Defense for Personnel and Readiness\, he works across the Military Departments\, Joint Staff\, Office of the Secretary of Defense\, and with interagency partners to lead the development and implementation of the DoD Total Force talent acquisition\, workforce development\, and talent management strategy. View the Full Agenda\, Learn More\, and Register to Attend
URL:https://www.nextflex.us/event/innovating-investing-leading-for-the-defense-industrial-base/
LOCATION:Spitzer Conference Center\, 1005 Abbe Road N\, Elyria\, Ohio\, 44035\, United States
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DTSTART;TZID=UTC:20250610T130000
DTEND;TZID=UTC:20250610T170000
DTSTAMP:20260409T032537
CREATED:20250111T034741Z
LAST-MODIFIED:20250603T043810Z
UID:15296-1749560400-1749574800@www.nextflex.us
SUMMARY:NextFlex Workshop: AI for Hybrid Electronics
DESCRIPTION:Join us for a half-day workshop to be held at UMass Boston on June 10 in conjunction with the TechBlick Conference\, “The Future of Electronics Reshaped.” The NextFlex Workshop will be followed by a reception. Everyone is welcome to join.Artificial intelligence and machine learning (AI/ML) are reshaping the landscape of hybrid electronics manufacturing and enabling the development of smarter edge devices through enhanced design\, process control\, and system intelligence. This meeting will explore how AI/ML tools accelerate circuit layout generation—particularly for complex 3D and conformal designs—optimize material selection and process parameters and enable real-time in situ monitoring with closed-loop control to improve yield and consistency. In addition\, the integration of AI/ML into devices allows for local decision-making\, predictive maintenance\, dynamic system calibration\, empowering responsive\, autonomous operation at the point of use and supply chain logistics optimization.Emphasis will be placed on the practical implementation of existing AI/ML technologies\, not the development of novel algorithms\, to improve both the manufacturability of hybrid electronics and the functionality of smart edge systems. Join us for interactive presentations and breakout sessions about the impacts of AI/ML models on hybrid electronics manufacturing and how the industrial base is utilizing these tools to enable faster technology adoption and commercialization.The workshop will feature breakout sessions on the following topics:Breakout 1: Design to Deployment– Design– Supply Chain– Edge DevicesBreakout 2: Materials\, Process\, and Manufacturing– Manufacturing Tool Control– Material Development\, Optimization\, Process– Automated Test & Qualification \n\n\n\n\n\n\n\n\n\n\n\n\n\n		\n				\n			\n\n\n\n \n			\n\nLoading… \n\n \n\n\n\n\nPowered By Whova\nEvent registration system
URL:https://www.nextflex.us/event/nextflex-member-meeting-techblick/
LOCATION:UMass Boston\, 100 Morrissey Blvd\, Boston\, Massachusetts\, 02125\, United States
ATTACH;FMTTYPE=image/jpeg:https://www.nextflex.us/wp-content/uploads/2024/04/BU-Workshop.jpg
ORGANIZER;CN="NextFlex":MAILTO:info@nextflex.us
END:VEVENT
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DTSTART;TZID=UTC:20251015T080000
DTEND;TZID=UTC:20251016T170000
DTSTAMP:20260409T032537
CREATED:20250605T015635Z
LAST-MODIFIED:20250927T064922Z
UID:15726-1760515200-1760634000@www.nextflex.us
SUMMARY:NextFlex Workshop: Hybrid Electronics for Automotive and Aerospace Applications
DESCRIPTION:Skip to the Schedule | Skip to Registration | Skip to FAQ Description:Hybrid electronics are revolutionizing the automotive and aerospace industries by enabling sophisticated\, lightweight\, and highly efficient systems that enhance performance and safety. From touch control human machine interfaces\, advanced driver-assistance systems (ADAS) to state-of-the-art avionics\, hybrid electronics are at the forefront of technological innovation. These advancements have facilitated the electrification of both the automotive and aerospace platforms through the emergence of ground and airborne EVs that boast improved fuel efficiency and reduced emissions. The seamless integration of sensors\, processors\, and communication modules within these hybrid systems is paving the way for a new era of intelligent transportation solutions. Technical focus areas include manufacturing solutions for integration on automotive and aerospace platforms\, technology gaps for the integration of hybrid electronics\, product demonstrators\, and road mapping. The workshop will feature presentations from subject matter experts and networking with NextFlex members and stakeholders. Who Should Attend:Engineers and Managers interested in electronics manufacturing\, integration\, and reliability for defense and commercial applications should attend to learn about new manufacturing methods while meeting or exceeding reliability requirements. Event Chairs:– Dr. Pradeep Lall\, Director\, Electronics Packaging Research Institute & MacFarlane Distinguished Professor and Alumni Professor\, Auburn University– Dr. John Williams\, Boeing Technical Fellow\, Boeing Activities Include:  Dinner and Topgolf at Topgolf HuntsvilleEnjoy Topgolf’s all-weather hitting bays and take aim at the giant outfield targets. Topgolf’s high-tech balls will score themselves! You’ll have the opportunity to network during the catered dinner and will have plenty of time to play\, as well. \n\n\n\n\n\n\n\n\n\n	\n	\n		\n			\nLoading… \n\n \nPowered By Whova\n\nPowered By Whova\nConference registration software\n \n  \nFAQ:\nQ: What airport is closest to the workshop location?\nA: Huntsville International Airport (HSV)\n\n\n14min drive (10.3mi) to Auburn University Research & Innovation Campus\n\n\n \nQ: What hotels are nearby the workshop location?\nA:\n\nThe Westin Huntsville \n6800 Governors W\, Huntsville\, AL 35806\n$194/night\n5min drive (1.2mi) to university\nHyatt Place Huntsville/ Research Park/ Redstone\n6860 Governors W NW\, Huntsville\, AL 35806\n$115/night\n2min drive (0.6mi) to university\nElement Huntsville \n6810 Governors W\, Huntsville\, AL 35806\n$156/night\n5min drive (1.2mi) to university\nHuntsville Marriott at the Space & Rocket Center\n5 Tranquility Base\, Huntsville\, AL 35805\n$151/night\n8min drive (2.8mi) to university\n\n  \nQ: Where is the workshop located?\nA: Auburn University Research & Innovation Campus\n345 Voyager Way\, Huntsville\, AL 35806 \n  \nQ: Where is the offsite dinner on 10.15.25 located?\nA: Topgolf – Huntsville\n6100 Topgolf Drive\, Huntsville\, Al\, 35806\n7min drive (2.8mi) from university
URL:https://www.nextflex.us/event/nextflex-workshop-hybrid-electronics-for-automotive-and-aerospace-applications/
LOCATION:Auburn University Research and Innovation Campus\, 345 Voyager Way NW\, Huntsville\, 35806\, United States
ATTACH;FMTTYPE=image/jpeg:https://www.nextflex.us/wp-content/uploads/2025/04/1309-scaled.jpg
ORGANIZER;CN="NextFlex":MAILTO:info@nextflex.us
END:VEVENT
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DTSTART;TZID=America/Los_Angeles:20251029T110000
DTEND;TZID=America/Los_Angeles:20251029T120000
DTSTAMP:20260409T032537
CREATED:20251001T045321Z
LAST-MODIFIED:20251031T181015Z
UID:16003-1761735600-1761739200@www.nextflex.us
SUMMARY:Webinar: AI for Hybrid Electronics - Workshop Outcomes & What’s Next
DESCRIPTION:At the recent NextFlex AI for Hybrid Electronics Workshop in Boston\, leaders from across the industrial base came together to explore how artificial intelligence (AI) and machine learning (ML) are transforming design\, materials\, process control\, and system intelligence in hybrid electronics and how they will continue to revolutionize the value chain.From smarter circuit layout and toolpath optimization to predictive maintenance and real-time closed-loop control\, the workshop highlighted both promising applications and the roadblocks we must overcome together—like data interoperability\, workforce readiness\, and IP protection.NextFlex is building on this momentum to engage the industrial base in a national conversation on AI’s role in electronics manufacturing. Through ongoing webinars\, workforce initiatives\, and roadmap development\, we’ll continue to surface best practices\, accelerate adoption\, and share actionable insights with our community.At the webinar on October 29\, we unpacked the key takeaways from the AI Workshop and shared how NextFlex is advancing AI adoption in hybrid electronics through upcoming initiatives and industry engagement. \n\n\n\n\n\n\n\n\n\n\n\n		\n				\n			\n\n\n\n \n			Watch the Recording: \n \nView the Slides: \nAI for Hybrid Electronics – Workshop Outcomes & What’s Next
URL:https://www.nextflex.us/event/webinar-ai-for-hybrid-electronics-workshop-outcomes-whats-next/
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DTSTART;TZID=America/Los_Angeles:20251112T110000
DTEND;TZID=America/Los_Angeles:20251112T120000
DTSTAMP:20260409T032537
CREATED:20251031T182216Z
LAST-MODIFIED:20251031T182418Z
UID:16044-1762945200-1762948800@www.nextflex.us
SUMMARY:Accelerating Hybrid Electronics R&D with AI Automation - Presented by Object Tech
DESCRIPTION:Hybrid Electronics development demands precision across materials\, printing\, and process control — yet traditional methods rely heavily on manual inspection and trial-and-error optimization. In this talk\, Dr. Jiaojiao Li\, Co-Founder & CPO of Object\, will introduce how Agentic AI tools can automate critical steps in R&D\, from defect inspection and classification to critical dimension (CD) metrology\, anomaly detection\, experiment optimization\, and property prediction. Drawing on Object’s recent pilot with flexible hybrid electronics program\, Jiaojiao will share how domain-specific AI tools\, models and agents can help scientists and engineers predict outcomes\, identify defects faster\, and optimize processes in real time. Attendees will gain insight into the next generation of AI-powered R&D workflows and how these tools can potentially transform productivity and reliability across the hybrid electronics ecosystem.About the Speaker:Dr. Jiaojiao Li is a Cofounder & CPO @ Object. She holds a Ph.D. in Materials Science (Mines) and an M.S. in Computer Science from the University of Pennsylvania\, where she focused on software engineering. With over 10 years of experience in thin-film solar cell R&D\, she possesses deep expertise in process optimization and yield improvement across the hard-tech development cycle. In addition\, she has five years of experience in software and database developments. At Object\, Dr. Li leads the software engineering team\, overseeing product design and development. \n\n\n\n\n\n\n\n\n\n\n\n\n\n		\n				\n			\n\n\n\n \n			At the first AI webinar on October 29\, we unpacked the key takeaways from the AI Workshop and shared how NextFlex is advancing AI adoption in hybrid electronics through upcoming initiatives and industry engagement. \nFrom smarter circuit layout and toolpath optimization to predictive maintenance and real-time closed-loop control\, the workshop highlighted both promising applications and the roadblocks we must overcome together—like data interoperability\, workforce readiness\, and IP protection. \nNextFlex is building on this momentum to engage the industrial base in a national conversation on AI’s role in electronics manufacturing. Through ongoing webinars\, workforce initiatives\, and roadmap development\, we’ll continue to surface best practices\, accelerate adoption\, and share actionable insights with our community. \nTo watch the recording of the previous webinar or view the slides\, visit this page.
URL:https://www.nextflex.us/event/accelerating-hybrid-electronics-rd-with-ai-automation-presented-by-object-tech/
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DTSTART;TZID=America/Los_Angeles:20251203T110000
DTEND;TZID=America/Los_Angeles:20251203T120000
DTSTAMP:20260409T032537
CREATED:20251202T000310Z
LAST-MODIFIED:20251202T000348Z
UID:16077-1764759600-1764763200@www.nextflex.us
SUMMARY:Webinar: AI Opportunities in Electronics Manufacturing and Reliability
DESCRIPTION:Miniaturization and heterogeneous integration technologies are increasing the complexity of semiconductor packaging\, making AI essential for optimizing design\, manufacturing\, and reliability. Participants in this webinar will gain insights into core concepts and practical applications\, supported by packaging case studies that demonstrate how AI can address critical challenges. The presentation will include selected AI models and their application in analyzing process data for anomaly detection\, root cause analysis\, and real-time adjustment of process parameters. This webinar is particularly suited for packaging engineers\, process specialists\, reliability analysts\, and technical managers who are looking to leverage AI for faster time-to-market\, improved yield\, and enhanced product reliability.About the Speaker:Pradeep Lall is the MacFarlane Endowed Distinguished Professor and Alumni Professor with the Department of Mechanical Engineering and Director of the Auburn University Electronics Packaging Research Institute. He holds a Joint Courtesy Appointment in the Department of Electrical and Computer Engineering. He serves as the Director of the Alabama Node of the NextFlex Manufacturing Institute. Prior to joining Auburn University\, Dr. Lall worked for Motorola\, focusing on various aspects of wireless communications products. He is the author and co-author of 2 books\, 15 book chapters\, and over 1000 journal and conference papers in the field of electronics reliability\, manufacturing\, and survivability. He holds three U.S. Patents\, three Motorola Outstanding Innovation Awards\, and five Motorola Engineering Awards. His publications have garnered over 13\,000 citations\, an H-index of 53\, and an i10-index of 317. Dr. Lall is ranked in the highest quantile among the top 2 percent of scientific researchers worldwide\, based on data compiled by Stanford University. The ranking system includes scientists in 20 fields and 174 sub-fields.
URL:https://www.nextflex.us/event/webinar-ai-opportunities-in-electronics-manufacturing-and-reliability/
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DTSTART;TZID=America/Los_Angeles:20251210T110000
DTEND;TZID=America/Los_Angeles:20251210T120000
DTSTAMP:20260409T032537
CREATED:20251202T000557Z
LAST-MODIFIED:20251205T002527Z
UID:16081-1765364400-1765368000@www.nextflex.us
SUMMARY:Webinar: Harnessing the Power of AI in FHE Design - Understanding Challenges and Unlocking Opportunities
DESCRIPTION:The role of artificial intelligence (AI) in electronics design has become increasingly important due to a combination of factors\, including a workforce crunch\, the explosion of complexity and cost\, and tighter delivery schedules. This session explores the significance of AI in design considering these factors and highlights the benefits it brings to address the challenges faced by the industry. This session will address risks to deploying AI technology in a design process. It will also cover practical ways that AI can be applied to design for assistive development\, design optimization through deep learning\, and generative processes that address highly complex problems.About the Speaker:David Wiens | Product Manager\, SiemensOver the past 40+ years\, David has held various engineering\, marketing and management positions within the EDA industry. His focus areas have included advanced packaging\, high-speed design\, routing technology\, integrated systems design and additively manufactured electronics. He is currently the product manager for the Xpedition portfolio of products for electronics systems design. He holds a B.S. in computer science degree from the University of Kansas.
URL:https://www.nextflex.us/event/webinar-harnessing-the-power-of-ai-in-fhe-design-understanding-challenges-and-unlocking-opportunities/
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DTSTART;TZID=UTC:20260609T080000
DTEND;TZID=UTC:20260609T190000
DTSTAMP:20260409T032537
CREATED:20250110T061239Z
LAST-MODIFIED:20260325T220955Z
UID:15254-1780992000-1781031600@www.nextflex.us
SUMMARY:Innovation Day 2026
DESCRIPTION:Innovation Day is NextFlex’s premier annual member event—bringing together leaders from industry\, academia\, and government to advance the future of hybrid electronics.Innovation Day 2026 will unite the nation’s hybrid electronics ecosystem to showcase member-driven innovation\, strengthen trusted networks\, and accelerate the transition of emerging technologies into fieldable\, manufacturable solutions that support both defense and commercial applications. \n\n\n\n\n\n\n\n\n\n	\n	\n		\n			\nAGENDA | REGISTRATION | SPONSORSHIP | HOTELS | TechBlick’s Future of Electronics Reshaped\n\n\n  \n\nWhy Attend Innovation Day?\n\n\nAdvance the Mission\nExplore NextFlex- and member-led innovations that accelerate readiness\, resilience\, and modernization. Gain insight into the strategic direction of hybrid electronics and its role in meeting commercial\, DoD\, and national security priorities. \nStrengthen the Ecosystem\nConnect with peers across industry\, academia\, government\, and the defense industrial base. Innovation Day is where relationships deepen and the hybrid electronics community drives the industry forward. \nCatalyze Collaboration\nDiscover opportunities for collaborative partnerships—from early-stage concepts to scalable\, deployable capabilities and workforce solutions. \nEngage Trusted Networks\nParticipate in meaningful dialogue with DoD stakeholders\, primes\, SMEs\, researchers\, and educators in a member-focused environment designed to foster collaboration and impact. \n  \nSession Descriptions\nSession 1: Innovation Built to Scale  \nHybrid electronics innovations are reshaping both commercial markets and defense capabilities. This session highlights breakthrough materials\, additive manufacturing approaches\, advanced packaging\, and system integration technologies designed for dual-use impact. Speakers will explore how innovations are being architected from the outset to meet commercial scalability requirements while satisfying the performance\, reliability\, and security demands of mission-critical defense applications. \nSession 2: Delivering Impact Across Markets and Missions \nInnovation achieves impact only when it reaches production and deployment. This session explores how hybrid electronics technologies transition into commercially viable products and mission-ready systems—highlighting strategies that align manufacturing scalability with defense reliability\, security\, and performance requirements. \nSession 3: AI/ML for Hybrid Electronics: From Design to Manufacturing Intelligence \nFrom materials discovery to system design and production optimization\, artificial intelligence (AI) and machine learning (ML) are reshaping the hybrid electronics development pipeline. This session will feature perspectives from AI/ML innovators\, electronics design companies\, and advanced manufacturing equipment providers on how these tools are enabling smarter design\, optimized manufacturing\, and more efficient process control. Speakers/panelists will highlight real-world applications\, data challenges\, and opportunities for collaboration across the industrial base to accelerate the transition of emerging hybrid electronics technologies. \nSession 4: Hybrid Electronics for Unmanned Systems: Enabling the Next Generation of Autonomous Platforms \nAs unmanned systems expand across air\, land\, sea\, and multi-domain operations\, advanced electronics are critical to enabling greater autonomy\, sensing\, communications\, and mission endurance. This session will feature perspectives from government industry stakeholders on evolving operational needs and the role of hybrid electronics in supporting next-generation unmanned platforms. Speakers/panelists will discuss design challenges\, manufacturing considerations\, and collaboration opportunities that can accelerate the transition of innovative technologies into scalable capabilities for autonomous applications. \nSession 5: Resilient Electronics: Advancing Systems for Challenging Operational Environments \nOperating in contested\, harsh\, and constrained environments places unique demands on electronics systems\, from manufacturing and materials constraints in austere environments to storage\, platform integration\, and power requirements. This session will explore resilient hybrid electronics for both defense and commercial applications. Speakers will highlight technology advances\, integration challenges\, and opportunities to accelerate the transition of innovative solutions into fieldable\, manufacturable capabilities. \nRegister for Innovation Day now! Early bird rates apply until May 1. \nInnovation Day 2026 is co-located with TechBlick’s Future of Electronics RESHAPED\, offering additional opportunities for engagement while preserving a focused\, members-first experience. The TechBlick agenda features a variety of NextFlex member technical presentations\, as well as two member-only sessions just for NextFlex members\, so plan to attend both events.\n  \nNextFlex Member Only Sessions at TechBlick:\nJune 10 @ 2:05 PM \nSession 4\nHybrid Electronics for Unmanned Systems: Enabling the Next Generation of Autonomous Platforms \nSession Chair: Jim Zunino\, DEVCOM \nConfirmed Speakers: \n\nDr. Nate Bode\, Impossible Objects\nRich Ormeno\, X-Bow Systems\n\n\n  \nJune 10 @ 4:10 PM \nSession 5\nResiliant Electronics: Advancing Systems for Challenging Operational Environments \n\nSession Chair: Dr. Pradeep Lall\, Auburn University \nConfirmend Speakers: \n\nDr. Cadré Francis\, NASA\nDr. Kenneth Church\, Sciperio\nRyan Hill\, IS4S\nDr. Benjamin Leever\, AFRL\n\n  \n\nLoading… \n\n \n\n\nPowered By Whova\nEvent registration software\n \n		\n	\n\n\n\n\n\n\n\n\n\n\n\n		\n				\n			\n\n\n\n \n			Sponsorship Information\nWhy Sponsor Innovation Day?\nReach the Hybrid Electronics Ecosystem \nConnect with leaders from the defense industrial base\, advanced manufacturing companies\, startups\, research institutions\, and government agencies. \nPosition Your Organization as a Technology Leader \nHighlight your company’s capabilities and innovations to decision-makers shaping the future of hybrid electronics. \nStrengthen Strategic Partnerships \nInnovation Day is designed to foster collaboration and partnerships across the ecosystem—from early-stage research to scalable manufacturing solutions. \nEngage with Influencers and Decision-Makers \nParticipate in discussions with DoD stakeholders\, primes\, SMEs\, researchers\, and educators in a focused member community. \n  \nSponsorship Opportunities\nInnovation Day offers four sponsorship tiers\, each providing unique benefits and visibility throughout the event. \nOpportunities include: \n\nBrand visibility across event marketing and signage\n• Exhibit or demo presence\n• Recognition during event sessions\n• Networking access with attendees and speakers\n• Opportunity to showcase technology and capabilities\n\n  \n \nIf you are interested in learning more or are ready to commit to sponsorship\, please contact us. \n  \nHotels near Computer History Museum\n\nHampton Inn & Suites Mountain View\n\nDistance: ~1.4 miles\n\n\nHoliday Inn Express & Suites Mountain View\n\nDistance: ~1.6 miles\n\n\nRamada By Wyndham Mountain View\n\nDistance: ~1.6 miles\n\n\nHotel Avante\n\nDistance: ~3.2 miles
URL:https://www.nextflex.us/event/innovation-day-2026/
LOCATION:Computer History Museum\, 1401 N Shoreline Blvd\, Mountain View\, CA\, 94043\, United States
ATTACH;FMTTYPE=image/jpeg:https://www.nextflex.us/wp-content/uploads/2024/08/1930-scaled.jpg
ORGANIZER;CN="NextFlex":MAILTO:info@nextflex.us
END:VEVENT
END:VCALENDAR