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X-WR-CALDESC:Events for NextFlex
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DTSTART;TZID=UTC:20260609T080000
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CREATED:20250110T061239Z
LAST-MODIFIED:20260522T180650Z
UID:15254-1780992000-1781031600@www.nextflex.us
SUMMARY:Innovation Day 2026
DESCRIPTION:Innovation Day is NextFlex’s premier annual member event—bringing together leaders from industry\, academia\, and government to advance the future of hybrid electronics.Innovation Day 2026 will unite the nation’s hybrid electronics ecosystem to showcase member-driven innovation\, strengthen trusted networks\, and accelerate the transition of emerging technologies into fieldable\, manufacturable solutions that support both defense and commercial applications. \n\n\n\n\n\n\n\n\n\n	\n	\n		\n			\nAGENDA | REGISTRATION | SPONSORSHIP | HOTELS | TechBlick’s Future of Electronics Reshaped\n\n\n  \n\nWhy Attend Innovation Day?\n\n\nAdvance the Mission\nExplore NextFlex- and member-led innovations that accelerate readiness\, resilience\, and modernization. Gain insight into the strategic direction of hybrid electronics and its role in meeting commercial\, DoD\, and national security priorities. \nStrengthen the Ecosystem\nConnect with peers across industry\, academia\, government\, and the defense industrial base. Innovation Day is where relationships deepen and the hybrid electronics community drives the industry forward. \nCatalyze Collaboration\nDiscover opportunities for collaborative partnerships—from early-stage concepts to scalable\, deployable capabilities and workforce solutions. \nEngage Trusted Networks\nParticipate in meaningful dialogue with DoD stakeholders\, primes\, SMEs\, researchers\, and educators in a member-focused environment designed to foster collaboration and impact. \n  \nInnovation Day Session Descriptions\nSession 1: Innovation Built to Scale  \nHybrid electronics innovations are reshaping both commercial markets and defense capabilities. This session highlights breakthrough materials\, additive manufacturing approaches\, advanced packaging\, and system integration technologies designed for dual-use impact. Speakers will explore how innovations are being architected from the outset to meet commercial scalability requirements while satisfying the performance\, reliability\, and security demands of mission-critical defense applications. \n\n  \n\nSession 2: Delivering Impact Across Markets and Missions \nInnovation achieves impact only when it reaches production and deployment. This session explores how hybrid electronics technologies transition into commercially viable products and mission-ready systems—highlighting strategies that align manufacturing scalability with defense reliability\, security\, and performance requirements. \n\n  \n\nSession 3: AI/ML for Hybrid Electronics: From Design to Manufacturing Intelligence \nFrom materials discovery to system design and production optimization\, artificial intelligence (AI) and machine learning (ML) are reshaping the hybrid electronics development pipeline. This session will feature perspectives from AI/ML innovators\, electronics design companies\, and advanced manufacturing equipment providers on how these tools are enabling smarter design\, optimized manufacturing\, and more efficient process control. Speakers/panelists will highlight real-world applications\, data challenges\, and opportunities for collaboration across the industrial base to accelerate the transition of emerging hybrid electronics technologies. \n  \nRegister for Innovation Day now! Early bird rates apply until May 8. \n\n\n \nInnovation Day 2026 is co-located with TechBlick’s Future of Electronics RESHAPED\, offering additional opportunities for engagement while preserving a focused\, members-first experience. The TechBlick agenda features a variety of NextFlex member technical presentations\, as well as two member-only sessions just for NextFlex members\, so plan to attend both events.\n  \nNextFlex Member Only Sessions at TechBlick:\nJune 10 @ 2:05 PM \nSession 4: Hybrid Electronics for Unmanned Systems: Enabling the Next Generation of Autonomous Platforms \nAs unmanned systems expand across air\, land\, sea\, and multi-domain operations\, advanced electronics are critical to enabling greater autonomy\, sensing\, communications\, and mission endurance. This session will feature perspectives from government industry stakeholders on evolving operational needs and the role of hybrid electronics in supporting next-generation unmanned platforms. Speakers/panelists will discuss design challenges\, manufacturing considerations\, and collaboration opportunities that can accelerate the transition of innovative technologies into scalable capabilities for autonomous applications. \n  \n\n\nSession Chair: Dr. Benjamin Leever\, AFRL \nConfirmed Speakers: \n\nDr. Nate Bode\, Impossible Objects\nRich Ormeno\, Lockheed Martin\n\n\n  \nJune 10 @ 4:10 PM \nSession 5: Resilient Electronics: Advancing Systems for Challenging Operational Environments \nOperating in contested\, harsh\, and constrained environments places unique demands on electronics systems\, from manufacturing and materials constraints in austere environments to storage\, platform integration\, and power requirements. This session will explore resilient hybrid electronics for both defense and commercial applications. Speakers will highlight technology advances\, integration challenges\, and opportunities to accelerate the transition of innovative solutions into fieldable\, manufacturable capabilities. \n\nSession Chair: Dr. Pradeep Lall\, Auburn University \nSpeakers: \n\nDr. Cadré Francis\, NASA\nDr. Kenneth Church\, Sciperio\nRyan Hill\, IS4S\nKevin Durkee\, Aptima\nEric Marksz\, Northrop Grumman \n\n  \n\nLoading… \n\n \n\n\nPowered By Whova\nEvent registration software\n \n		\n	\n\n\n\n\n\n\n\n\n\n\n\n		\n				\n			\n\n\n\n \n			Sponsorship Information\nWhy Sponsor Innovation Day?\nReach the Hybrid Electronics Ecosystem \nConnect with leaders from the defense industrial base\, advanced manufacturing companies\, startups\, research institutions\, and government agencies. \nPosition Your Organization as a Technology Leader \nHighlight your company’s capabilities and innovations to decision-makers shaping the future of hybrid electronics. \nStrengthen Strategic Partnerships \nInnovation Day is designed to foster collaboration and partnerships across the ecosystem—from early-stage research to scalable manufacturing solutions. \nEngage with Influencers and Decision-Makers \nParticipate in discussions with DoD stakeholders\, primes\, SMEs\, researchers\, and educators in a focused member community. \n  \nSponsorship Opportunities\nInnovation Day offers four sponsorship tiers\, each providing unique benefits and visibility throughout the event. \nOpportunities include: \n\nBrand visibility across event marketing and signage\n• Exhibit or demo presence\n• Recognition during event sessions\n• Networking access with attendees and speakers\n• Opportunity to showcase technology and capabilities\n\n  \n \nIf you are interested in learning more or are ready to commit to sponsorship\, please contact us. \n  \nHotels near Computer History Museum\n\nHampton Inn & Suites Mountain View\n\nDistance: ~1.4 miles\n\n\nHoliday Inn Express & Suites Mountain View\n\nDistance: ~1.6 miles\n\n\nRamada By Wyndham Mountain View\n\nDistance: ~1.6 miles\n\n\nHotel Avante\n\nDistance: ~3.2 miles
URL:https://www.nextflex.us/event/innovation-day-2026/
LOCATION:Computer History Museum\, 1401 N Shoreline Blvd\, Mountain View\, CA\, 94043\, United States
ATTACH;FMTTYPE=image/jpeg:https://www.nextflex.us/wp-content/uploads/2024/08/1930-scaled.jpg
ORGANIZER;CN="NextFlex":MAILTO:info@nextflex.us
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