Mark Your Calendar: September 21st is the 2nd Annual NextFlex Members’ Innovation Day.

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We are Manufacturers

Bringing big ideas to life in advanced electronics

Manufacturers large and small alike are joining the NextFlex community to amortize planned equipment investments, anticipate future standards and practices, and extend the reach of their current network.

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By placing equipment in NextFlex’s state of the art Technology Hub, existing NextFlex members are realizing a number of immediate benefits.

  • Donated equipment is considered an in-kind contribution that offsets dues, giving a company access to full member benefits at a reduced out of pocket expense
  • Early visibility into new materials, new processes and new products that will become industry standard
  • Access to technologists from across the country and beyond that will gain access to, and familiarity and technical competency with, your equipment
  • The NextFlex Technology Hub serves a showplace for manufacturing equipment that is constantly on display for tours of visitors from all over the world
  • The NextFlex production line is regularly and prominently featured in all Member and general audience presentations, thereby increasing the awareness, understanding and visibility of every Technology Hub participant

Meet some of NextFlex's MVPs

These power players boast stellar stats with backgrounds in manufacturing, government and education.

Janos Veres, Ph.D.

Program Manager

Palo Alto Research Center (PARC)

Janos Veres joined PARC to manage its Printed Electronics team. Janos has experience in components such as novel printed circuits, organic transistors, and printable semiconductors; applications such as OLEDs, displays, and RFID; as well as printing/coating technologies including electrophotography, flexography, and offset printing. Before joining PARC, Janos was the CTO at PolyPhotonix, worked at Eastman Kodak as their Program Manager of Printed Electronics, was a Business Research Associate at Merck Chemicals (formerly Avecia), and was responsible for Organic Photoreceptor development at Gestetner Byfleet.

Erick Seltmann

Manager, Advanced Electromechanical Technologies

Boeing Research & Technology

Erick Seltmann is the Manager of the Advanced Electromechanical Technologies (AET) organization at Boeing Research & Technology (BR&T) in Huntsville Alabama.  He joined Boeing in June of 2014 to establish a BR&T Communications & Sensing research team in the emerging technology domain area of Additive Manufacturing for electronics.  Technologies being garnered include the introduction of Flexible Hybrid Electronics (FHE) to provide novel flexible antenna solutions, sensing capabilities that provide real time health diagnostics, and fully integrated hybrid electronic structures.

Prior to this assignment, Erick worked in industry and government agencies providing life-cycle solutions to the Department of Defense (DoD) on platforms such as  Launch Vehicles, Satellites, Unmanned Arial Vehicles (UAV), and various sensor and radar technologies.  While in leadership positions in industry, he managed engineering teams through several DoD development programs from concept to launch.  His technical and leadership expertise resulted in several successfully executed programs.  He was a Systems Engineering and Technical Assistance (SETA) contractor for the Missile Defense Agency (MDA) where he provided technical expertise to government teams and led system engineering and test execution teams.

Erick holds bachelors and masters degrees in electrical engineering, and a master’s degree in engineering management.

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