To accelerate the maturation and commercialization of flexible hybrid electronics (FHE) technology through building awareness, training, and education, NextFlex is creating two digital learning programs focused on FHE design and manufacturing. The first program, FlexPro, will be a curated series of technical courses designed for engineering professionals via self-paced, asynchronous delivery. A second program, FlexAhead, will cover the same topics but through smaller modules appropriate for university and other post-secondary audiences.
To ensure these programs represent the range of experience, knowledge, and capabilities available throughout the national ecosystem, NextFlex is holding a Call for Participation to allow members to propose content for courses and/or modules.
To learn more about how the Call for Participation works and what we’re looking for, please see below.
FlexPro and FlexAhead are planned to be created as custom, digital resources focused on FHE applications, design, and manufacturing processes. Both programs will include video lectures, presentation materials, lab demonstrations and other content designed to convey critical knowledge, skills, and abilities central to enabling current (and future!) engineers and product developers to transition from rigid to flexible form factors.
Programs will be divided into the following three sections:
- Introduction to FHE
- FHE Manufacturing In-Depth
- Hands-on Experience
Through this Call for Participation, we are soliciting course material contributions from the NextFlex member community that are aligned to example topic areas. The course material content should incorporate clear descriptions and demonstrations of FHE design and manufacturing processes. It is expected that the content contributions will showcase technologies and processes developed by member organizations; however, the intent is to provide educational content rather than to promote organizations or products. The scope of content contributions should be narrow, focusing on specific technologies, processes, or applications, and only include content required for students to gain an understanding of the topic. Content contributions will be integrated into other modules created by the NextFlex engineering staff to highlight the expertise and capabilities of our membership and provides a cohesive overview of state-of-the-art manufacturing processes.
We are soliciting two primary types of content:
- Recorded lectures and presentations that provide background information on materials, equipment, production processes, device performance, etc.
- Video demonstrations that showcase specific design and manufacturing processes.
While there are no limits on length of content, in most cases the goal will be for any one element to be 10 minutes or less (multiple elements may be provided, for example, a lecture combined with a video demonstration may be required to cover a given topic). The final FlexPro and FlexAhead programs may be available to NextFlex members, third-party licensees and/or the public at large. Therefore, submissions should not contain any confidential information. NextFlex will select which content will be included in the final FlexPro and FlexAhead programs, which may consist of all, part or none of a particular submission.
How to Participate
- Submit a content contribution abstract for NextFlex’s evaluation through the Abstract Submission form
- Deadline: November 1, 2021
Minimum Accepted Video Quality
Click the “Sample Video” tab below for an idea of the general level of quality we are seeking. Any costs incurred by the member in producing videos may be included as an in-kind contribution to NextFlex. See the In-Kind Contributions tab for more information.
|FHE Design||Process Design Kit; Systems Design, Simulation|
|FHE Materials||Substrates, Inks|
|Digital/Direct Write||Drop-on-demand/Ink Jet; Aerosol/Vapor Dispense; Microdispense/Extrusion|
|Master||Screen; Flexographic; Gravure; Gravure offset; Imprint lithography|
|Fluid Coating||Meyer rod; Slot die; Spray|
|Curing and Heat Treatment||Thermal; Ultraviolet; Infrared; Photonic/Laser|
|Post-Print Laser Processing||Ablation, Trimming, Panelization|
|Thinning Silicon ICs|
|Component Attach||Bare die, packaged components; Passive components; Adhesives|
|Encapsulation||Component/Board; Foam, Silicone, Adhesive-Melt/Thermoformed Lamination|
|Components/Structures||Microfluidic channels; Printed/flexible batteries; RF antennas; Chemical sensors|
|Multi-function Tools||Multi-axis control; Roll-to-Roll Processes|
To be considered for inclusion in FlexPro and FlexEd, an abstract of proposed content, structure, and quality must be submitted to NextFlex by November 1,2021.
Notice of Selection
NextFlex will notify members of their selection by December 1, 2021.
Final Content Contribution
Content contributions and signed content license agreements due to NextFlex by February 28, 2022. Agreement to be provided by NextFlex after abstract selection.