FLEXINAR: Presented by University at Buffalo – High-Temperature Cu Ink Materials for Printable Hybrid Conformal Electronics
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Printable copper has attracted immense interest in advanced electronics attributed to its abundance, high electrical and thermal characteristics. However, copper is easily oxidized limiting reliability under extreme environments, which requires constant operation at elevated temperatures and reactive atmospheres. During this Flexinar, Dr. Shenqiang Ren, Professor of Mechanical and Aerospace Engineering, …
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