Come see us talk about next generation electronics, the next generation workforce, and the next generation of manufacturing.Learn More
dpiX is a world leader in the manufacture of digital X-Ray sensor backplanes for medical and non-destructive testing markets. It is estimated that 50% of all X-Ray sensor backplanes installed in medical systems contain a dpiX active matrix sensor array. dpiX’s current production facility located in Colorado Springs, CO features …Learn More
New form factors in components and products are continuously being introduced today. Some examples of products for personal use are foldable smartphones, wearable sensors, and smart IoT speakers with AI. Examples of components are curved screens, metal ink compounds, bendable batteries, and bendable antennas. New material components will be needed …Learn More
The 18th Annual Flexible Electronics Conference and Exhibition – FLEX 2019 – will be returning to the Monterey, California, February 19-21, 2019.
FLEX 2019 – Building Outside the Box.
Flexible Hybrid Electronics (FHE) are high-performance, integrated devices. Curved and variable in form factor, they augment day-to-day life with diverse applications, enabling us to interact with our surroundings like no personal computing devices have ever before.
As new methods for creating them emerge, business and supply chain paradigms are increasingly challenged. That’s what Building Outside the Box is all about. Thought-leaders will highlight the latest technology breakthroughs and business strategies, and provide informative demonstrations of flexible hybrid and printed electronics products, equipment, and materials, as well as the unique electronics applications they enable.Learn More
NextFlex members convene for Technical Council, Governing Council, Member Reception, and Technical Working Groups meetings once again at the annual Flexible Electronics Conference (2019 FLEX) at Monterey, California, to advance U.S. manufacturing of flexible hybrid electronics.Learn More
In this 60-minute webinar FocalSpec’s introduces patented Line Confocal Imaging (LCI) technology that was developed to characterize 3D features of various surface and material types at sub-micron resolution. LCI enables quick automatic imaging of challenging objects that are difficult or impossible to measure with traditional methods. Examples of such products …Learn More