Join us for a follow-on discussion on plans for a NextFlex response to an anticipated RFP on Advanced Packaging manufacturing capability development in the US as part of the CHIPS Act. The momentum behind this topic continues in the microelectronics community so we will be prepared to put forth a proposal on behalf of the FHE community. In particular, we will make the argument that the additive processes that have been developed for FHE make sense in application toward advanced packaging.