MEPTEC in association with IMAPS
NextFlex Headquarters, 2244 Blach Pl, Ste 150, San Jose, CA 95131
Wednesday, June 7, 2017, 11:30 AM-1:30 PM
$45, includes box lunch and NextFlex Technology Hub Tour
MEPTEC is pleased to offer an exclusive presentation on Flexible Hybrid Electronics and the Opportunities for Advanced Packaging, to be presented by Jason Marsh, Director of Technology at NextFlex.
This will provide an introduction to NextFlex, Flexible Hybrid Electronics (FHE), and its applications. Mr. Marsh will then outline specific benefits FHE brings to microelectronics manufacturing and how these attributes will enable the much anticipated growth of wearables, medical, and IoT categories. Collaborative developments currently underway in the 20+ funded NextFlex projects will be highlighted. Finally, key developments being driven by FHE that may be useful to advance packaging manufacturing will be covered.
In addition, Paul Semenza, NextFlex’s Director of Commercialization, will discuss how companies are getting involved and possible participation opportunities with NextFlex.
A tour of the NextFlex Technology Hub will round out the session. The cleanroom is designed to be a Class 10,000 manufacturing pilot line for FHE, with dedicated areas for printing and additive processing, assembly and integration, and test and measurement, supported by labs. The purpose of the Technology Hub is for NextFlex member company use, primarily to support ongoing collaborative project work, but also for prototyping products, development of manufacturing process, and training. Technical staff will be on hand to talk with attendees about the cleanroom, the status of the equipment on site, and development plans.
11:00 AM Registration Opens / Lunch
11:30 AM Welcome – Dr. Malcolm J. Thompson, Executive Director, NextFlex
11:45 AM Jason Marsh, Director of Technology, NextFlex
12:15 PM Paul Semenza, Director of Commercialization, NextFlex
12:30 PM Technology Hub Tour
1:30 PM End