There is a surge in development of flexible hybrid electronics (FHE) in recent years due to the significant potential for foldable, rollable, and conformable high-functioning electronics to become integrated into nearly every facet of our lives. Advances in manufacturing and assembly technologies are crucial for enabling ubiquitous, high-performance flexible hybrid electronics; however, conventional manufacturing equipment and processes cannot handle the thin and ultra-thin die that are required to realize fully flexible ICs. Overcoming this manufacturing limitation will enable the high-volume manufacturing and widespread deployment of next-generation devices, with applications that span domains including medical devices (e.g., wearable health sensors, implantable devices), consumer electronics (wearable computing, performance monitoring), and military/defense hardware (compact/foldable communication and energy generation), all of which require flexible devices with high performance.
In this 60 minute Flexinar, systeMECH, Inc will introduce a new manufacturing approach – direct transfer printing – that enables the placement of thin and ultra-thin dies and components directly onto flexible or rigid substrates. We will present strategies in which direct transfer printing tools and accompanying processes can be integrated into a range of device fabrication process flows, and we will show results in which thin silicon dies and components – ranging in thickness from 10s of micrometers down to 300 nm – have been transferred directly onto flexible PET substrates. In addition, we will discuss the tailorability of the approach to accommodate carrier and destination substrates with dimensions and mechanical properties that are of particular importance to the FHE industry.
The main goal of this Flexinar is to introduce the NextFlex community to direct transfer printing, and to open up a conversation about how the tools and techniques that systeMECH is developing can benefit the FHE industry.
Who Should Attend?
University and industry researchers and engineers that are interested in advanced tools and processes for integrating thin and ultra-thin high-performance components into their FHE device architectures.
Presenters
Dr. David Grierson, co-founder and CTO, systeMECH, Inc.
David S. Grierson completed his Ph.D. in Engineering Mechanics in 2008 at the University of Wisconsin-Madison (UW-Madison) and was a postdoctoral associate at the University of Wisconsin-Madison from 2008-2011 investigating the reliability, mechanics, and scale-up of nanomembrane-based fabrication processes and scanning-probe based nanomanufacturing processes. David co-founded systeMECH in 2010, along with Prof. Kevin Turner, in order to commercialize technology developed in the Turner Lab at UW-Madison. David is chief technology officer and also manages the day-to-day operations at systeMECH.
Prof. Kevin Turner, co-founder and chief advisor, systeMECH, Inc.
Kevin T. Turner is a Professor and the Associate Chair for Graduate Affairs in the Department of Mechanical Engineering and Applied Mechanics at the University of Pennsylvania. Professor Turner also holds a secondary appointment in Material Science and Engineering. All his degrees are in Mechanical Engineering, a BS from the Johns Hopkins University in 1999 and MS and PhD from MIT in 2001 and 2004, respectively. Prior to joining the University of Pennsylvania in 2011, he was on the faculty in the Department of Mechanical Engineering at the University Wisconsin-Madison. His primary research interests are related to mechanics and materials issues in micro- and nanoscale systems. His research spans multiple topics, including: fundamental of adhesion mechanics, wafer bonding, tip-based nanomanufacturing, surfaces with tunable adhesion, and transfer printing processes for the integration of semiconductor nanomembranes. Kevin has more than 140 publications, including 70+ peer-reviewed journal publications and 70+ conference papers. Kevin is an inventor of systeMECH’s core technology and provides technical guidance.
When
Wednesday, September 12, 2018
11:00 AM PDT / 2:00 PM EDT