NextFlex members convene for Technical Council, Governing Council, Member Reception, and Technical Working Groups meetings once again at the annual Flexible Electronics Conference (2018FLEX) at Monterey, California, to advance U.S. manufacturing of flexible hybrid electronics.
SCHEDULE
MON, FEB 12 at Windjammer Room
12:00-4:00 PM: NextFlex Technical Council Meeting
Topics covered include:
- Project Call 3.0 Launch Presentations
- Flex Arduino Project
- NextFlex Technical Hub
- Materials and Process Database
- Innovation Day
- Project Updates
- Upcoming technical events
Attendance is limited to government personnel and NextFlex members from Tiers 1, 2, and 3 only (multiple delegates welcome).
(The FlexTech-NBMC (FT-NBMC) Joint Tech Council meeting will end with lunch around noon. Those who are members of both FlexTech and NextFlex, or NBMC and NextFlex, should depart the FT-NBMC meeting at that time and join the working lunch served at the NextFlex Tech Council meeting.)
TUE, FEB 13 at TusCA Ristorante
6:00-8:00 PM: NextFlex Member Reception
Network with fellow NextFlex members.
Government partners and all NextFlex members are welcome, including Observer-level members.
THU, FEB 15 Locations Vary
12:00-2:00 PM: NextFlex Governing Council Meeting
At Windjammer Room. RSVP to Taylor Gallagher.
Governing Council members only.
3:00-6:00 PM: Technical Working Groups (TWG) Breakouts
At Regency Ballroom 1
Participation is welcome and encouraged in TWGs that are beyond those that they are currently supporting. The following topics will convene:
- Device Integration and Packaging
- Materials
- Printed Flexible Components and Microfluidics
- Modeling and Design
- Power and Energy
Attendance is limited to government personnel and NextFlex members from Tiers 1, 2, and 3 only (multiple delegates welcome).
FRI, FEB 16 at Spyglass Room
8:00-11:00 AM: Special Session: High Performance Flexible Systems Roadmapping and Strategy
This Special Session is currently FILLED. However, if you are a TWG co-lead, please contact NextFlex immediately to discuss accommodations to attend by email or please call 1-408-797-2244.
Significant progress has been made in making simple circuits flexible with FHE. However, work remains to increase the flexibility of highly complex circuits. This special session will draw interdisciplinary input to help chart the course for high performance applications.
These will include thin silicon for more advanced devices than 8-bit microcontrollers (such as FPGAs and advanced node devices), interconnects for the high layer count and high routing density structures, and integration techniques for these devices, and, time permitting, flexible batteries.
Objective: Generate a needs and recommendations document to support designs that can benefit from FHE form factors, but require impedance matching, SI, PI, or thermal management.
Attendance is limited to government personnel and NextFlex members from Tiers 1, 2, and 3 only.
11 AM: End
REGISTER
DEADLINE: Monday, February 5, 2018
Unable to view the registration form? Contact us.
QUESTIONS?
Email or call 408-797-2218.
