SCHEDULE
Wed, Sep 20
Attendance restrictions
- 1:00 – 3:00 Government personnel and NextFlex members from Tiers 1, 2, and 3 only (multiple delegates welcome)
- 3:00 – 6:30 Government personnel and all NextFlex members, including Observer-level (multiple delegates welcome)
1:00 PM – 5:00 PM NextFlex Technical Council Meeting
1:00 Welcome & NextFlex Updates
Roadmap 3.0, Database Project Update; FHE Arduino
1:30 Project Update Reports
- “Mechanical and Electrical Test Methods for FHE Devices” UMass Lowell
- “Conformal Printing onto Complex 3-D Surfaces” Lockheed Martin
- “FHE Prototype and Production Equipment” Sensor Films
- “Flexible Antenna Array Technology” The Boeing Company
3:00 Breakouts
Breakout A. Project Call 3.0 Final Proposal Voting (Voting Members)
Breakout B. FHE Manufacturing Equipment Briefing
- ConnecTec – Low-temperature die-bonding system
- Yuasa System – Mechanical test systems
- adphos – Near-IR curing table
- BTU International – 8-zone conveyor oven
- Nanotronics – Optical inspection system
- Nordson ASYMTEK – Dispensing system on X-Y stage
- FUJIFILM Dimatix – Desktop inkjet printer
- Universal Instruments – NextFlex Project: Fuzion assembly tool
- Meyer Burger – NextFlex Project: ConX print and assembly system
- Optomec – NextFlex Project: Aerosol jet system
5:00 PM – 6:30 PM Networking Reception
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Thu, Sep 21
9:00am – 4:00pm NextFlex Innovation Day
Fri, Sep 22
9:00am – 12:00pm FHE Manufacturing Equipment and Process Demonstrations
- Equipment vendor technical staff will conduct hands-on demonstrations in the cleanroom;
- NextFlex technical staff will also conduct demonstrations of the flexible Arduino manufacturing process
Thursday and Friday attendance: Government partners and all NextFlex members are welcome, including Observer-level members.
HOTEL
Book ASAP; rooms fill quickly in Silicon Valley.
Hotels near NextFlex:
Sonesta
Residence Inn
Courtyard Milpitas
Sheraton Hotel
Staybridge Suites San Jose near San Jose Airport (SJC) offers government rates.
REGISTER
This link will enable you to register for both the Technical Council Meeting and Innovation Day.