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Bringing The FHE Community Together

Webinar: Flexible Hybrid Electronics Roadmap


Online (WebEx)
Cost: $0
Must be a NextFlex member or government partner.

Flexible hybrid electronics (FHE) integrate ultra-thin, flexible semiconductor devices and printed components with functions such as power, communications, fluidics, and sensing in flexible systems that can bend, fold, stretch, and conform to create products that fit the natural, curved form of our world while preserving the full operational integrity of traditional electronic architectures.

NextFlex FHE

The FHE market has been strengthened by the integration of evolutionary technologies (e.g., thin and ultra-thin die) with revolutionary technologies (e.g., additive solution processes), and this integration has resulted in an increase of new application opportunities.

The 2017 Flexible Hybrid Electronics Roadmap Chapter attempts to capture these advancement and disruptions. The chapter provides an overview of the most critical technology platforms required for commercial launch and market diffusion. The value of this roadmap is its attempt to provide scientists and engineers with a deep appreciation for the state-of-the-art of the field and to highlight key areas that require additional efforts to be undertaken (e.g., strategic new development projects) to accelerate the growth and establishment of the FHE components, modules & systems enabled market.

In addition, the 2017 Roadmap FHE Chapter introduces the use of Technology Readiness Level (TRL) and Manufacturing Readiness Level (MRL) methods for assessing technology and manufacturing maturity levels. The use of TRL and MRL will provide guidance to engineers and designers as they develop strategies and long-term plans for advanced technology introduction for launch of new products.

This webinar will review highlights from iNEMI’s 2017 Roadmap chapter and will introduce the use of MRL and TRL.

Presenter

Dan Gamota NextFlexDaniel Gamota is Chair of the Flexible Hybrid Electronics chapter for the iNEMI Roadmap. As Vice President of the Hardware Innovation Group at Jabil, he is leading several international sites that are developing and deploying hardware innovations in medical, industrial, energy, consumer, aerospace, automotive and defense products.

Prior to joining Jabil, Gamota was director and fellow of the technical staff at Motorola. He was elevated to IEEE Fellow and was named a Dan Noble Fellow at Motorola (top 0.1% of engineers) for his contributions to the fields of manufacturing, microelectronics, nanotechnologies, and printed and flexible electronics.

Gamota earned a Ph.D. in Engineering from the University of Michigan and an M.B.A. from the Kellogg School of Management, Northwestern University.

When

Tuesday, October 24
9:00-10:00 AM PDT (12:00-1:00 PM EDT)

Who

Must be a NextFlex member or government partner.

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