About
For more information about the workshop, including overview, schedule, location, and more, please click here.
Register Now
Unable to view the registration form? Contact Laura Castellano by email or call 408-797-2247.
Workshop Registration
NextFlex Events
Bringing The FHE Community Together
Latest Tweets
Dr. Tom Rucker, VP, Technology Development and Dir-Assembly and Test Technology at Intel, gave an amazing keynote presentation at our event today, reminding us that “packaging is no longer an afterthought; it is an extension of the backend of the fab.” 1/2
#FHE #AdvancedPackaging
Learn the top 3 reasons why prioritizing R&D during the chip shortage is so important!
http://smt.iconnect007.com/index.php/article/134378/rd-takes-back-seat-amidst-chip-shortagebut-it-shouldnt/134381/
#chipshortage #fhe #flexiblehybridelectronics #researchanddevelopment #innovation
Project Call 7.0 awardees have been announced! Learn more about the projects from organizations like @LockheedMartin, @GEResearch, @binghamtonu, @RaytheonDefense, @GDMS, @AuburnU, @UESIncDayton, and @SafetySentinel.
https://www.printedelectronicsnow.com/contents/view_breaking-news/2022-12-05/nextflex-announces-more-than-8-million-in-funding-for-fhe/
For the better part of two years, the supply chain has wrestled with a semiconductor shortage that has impacted numerous sectors of the electronics industry. Learn how to avoid the next chip shortage here!
https://electronics360.globalspec.com/article/18997/q-a-how-to-avoid-the-next-chip-shortage