In this Flexinar, Dr. Carey will describe dpiX’s manufacturing capability, the new technologies that allow dpiX to make products on flexible substrates, and how your company can work with dpiX to leverage its unique manufacturing capability. dpiX is the world’s leading manufacturer of digital X-Ray sensor backplanes for the medical and non-destructive testing markets and its backplanes are used in X-Ray detectors made by Varex, Siemens, Philips, and Thales. It is estimated that 50% of all X-Ray sensor backplanes installed in medical systems worldwide contain a dpiX active matrix sensor array. The dpiX production facility located in Colorado Springs, CO features the largest sized semiconductor glass substrate Fab (G4.5 or 730mm X 920mm) outside of Asia. The thin film transistor materials (TFTs) are made using a-Si and, more recently, higher mobility Indium Gallium Zinc Oxide (IGZO) as the semiconducting layer, and the company’s a-Si PIN photodiodes feature high sensitivity and low leakage currents. dpiX is now seeking to apply the technologies to make products such as solid-state batteries and sensor, such as: chemical-biological, biometric, environmental, and medical patient monitoring products. dpiX is actively looking for new partners interested in leveraging these new sensor technologies with a large area glass or flexible substrate technology to make products.
Who Should Attend
- Process and equipment engineers
- Sensor product designers
- Business development managers
- Supply chain managers
- Medical device product managers
Paul Carey, Ph.D.
Senior Director, Special Projects