Join us on June 26 – 28 in Seattle for our workshop: The Hybrid Electronics Commercialization Path for Aerospace Applications

NextFlex Events

Bringing The FHE Community Together

FLEXINAR: EWI presents – Improved Product Joining for FHE and Printed Flexible Electronics


Online
Cost: $0
Members and government partners only

Tim Frech, Senior Engineer, EWI, will discuss improved joining to FHE and printed flexible electronics. The rapid rise of flexible and 3D-printed electronic components challenges long-held assumptions about product joining and assembly. Prototype products are often made using soldering, which is less than ideal due to limitations of speed, joint size, and joint strength/durability.

Alternative joining processes such as parallel gap welding and ultrasonic welding offer advantages including speed, less heat input, and the elimination of solder altogether. This presentation will demonstrate successful joining for FHEs accomplished using alternative methods, resulting in stronger, more reliable, more resilient welds.

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