Tim Frech, Senior Engineer, EWI, will discuss improved joining to FHE and printed flexible electronics. The rapid rise of flexible and 3D-printed electronic components challenges long-held assumptions about product joining and assembly. Prototype products are often made using soldering, which is less than ideal due to limitations of speed, joint size, and joint strength/durability.
Alternative joining processes such as parallel gap welding and ultrasonic welding offer advantages including speed, less heat input, and the elimination of solder altogether. This presentation will demonstrate successful joining for FHEs accomplished using alternative methods, resulting in stronger, more reliable, more resilient welds.