Member Login

NextFlex Events

Bringing The FHE Community Together

Complete List of Exhibitors at Innovation Day 2019

 

  • Acellent Technologies Inc.
  • ACI Materials
  • Air Force Research Laboratory
  • Auburn University
  • Blueshift Materials. Inc.
  • The Boeing Company
  • Brewer Science, Inc.
  • Carpe Diem Technologies
  • Defense Microelectronics Activity
  • DuPont
  • Eastman Chemical Co
  • Epicore Biosystems, Inc.
  • EWI – Edison Welding Institute
  • Flex International Inc., USA
  • FUJIFILM Dimatix
  • Georgia Institute of Technology
  • General Electric Global Research
  • Imprint Energy, Inc.
  • Innovize
  • Integrated Deposition Solutions
  • Integrity Industrial Ink Jet Integration, LLC
  • Komori America Corp.
  • Kuprion Inc.
  • Laboratory for Physical Sciences
  • Lockheed Martin
  • Lubrizol Advanced Materials
  • Meyer Burger
  • Millibatt, Inc.
  • NASA Ames Research Center
  • NASA Goddard Space Flight Center
  • nScrypt Inc.
  • Optomec
  • PARC, A Xerox Company
  • Profusa
  • SEMI-FlexTech-NBMC
  • SI2 Technologies, Inc.
  • Stanford University
  • Stretch Med., Inc.
  • systeMECH, Inc.
  • TTM Technologies Inc
  • UES, Inc.
  • United Technologies Research Center
  • Universal Instruments
  • University of Massachusetts Amherst
  • University of Massachusetts Lowell
  • US Army Research Lab
  • Western Michigan University
  • Zeon Specialty Materials Inc

 

CONTACT

Fore more information, please contact Jordan Opet at: jopet@nextflex.us.

Back to Events

Stay up to date with the latest from NextFlex

  • This field is for validation purposes and should be left unchanged.