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NextFlex Member Meetings at FLEX 2019


Hyatt Regency Hotel, Monterey, CA
Cost: $0
Members and Government Partners Only

NextFlex members convene for a Technical Council, a Governing Council meeting, a Member Reception, and a Technical Working Groups meeting (“Member Meetings”) once again at the annual FLEX Conference at Monterey, California, to advance U.S. manufacturing of flexible hybrid electronics.

There is no cost to attend NextFlex Member Meetings. NextFlex members receive a member discount to attend the FLEX Conference; no code is required.

SCHEDULE

WED, FEB 20

12:00-1:30 PM: Technical Working Groups (TWG)

All TWG members are invited to an update on the current status of the FHE Process Design Kit (PDK) and the Modeling & Design Roadmap. During short breakout sessions, we will solicit ideas and prioritization of next steps for both the PDK and multi-physics modeling tools.

Attendance is limited to government personnel and NextFlex members from Tiers 1, 2, and 3 only (multiple delegates welcome).

THU, FEB 21

12:00-4:00 PM: NextFlex Technical Council Meeting

Attendance is limited to Technical Council Voting Members only.

2:00-5:00 PM: NextFlex Technology Standards and Roadmapping Discussion 

• Chris Jorgenson of IPC will lead discussion of FHE Standards – their importance, their current status, and a path forward to addressing the gaps.
• NextFlex members AFRL, Kuprion, Averatek, and Sandia National Lab will discuss their unique FHE capabilities and opportunities to collaborate with their teams.

Government partners and all NextFlex members are welcome, including Observer-level members.

4:00-6:00 PM: NextFlex Governing Council Meeting

Governing Council members only.

6:00-9:00 PM: Evening Member Event

Network with fellow NextFlex members at Scales Seafood & Steaks on the wharf of Monterey Bay.

Government partners and all NextFlex members are welcome, including Observer-level members.

FRI, FEB 22

8:00 AM-12:00 PM: NextFlex Project Update Technical Council Meeting

To include Project Updates and key outcomes of the PC2.5 and 2.8 projects to help inform members where we go with respect to testing and standards.
UMASS LOWELL – Test Methods for Electrical and Mechanical Durability of Flexible/Rigid Interfaces in Multi-Axial Fatigue and Dynamic Loadings
• BINGHAMTON UNIVERSITY – Assessment and Optimization of the Reliability of Wearable Performance Monitors
• AUBURN UNIVERSITY – Mechanical Test Methods for Flexible Hybrid Electronics Materials and Devices
• GEORGIA TECH – Development of Test Methods and Standards to Assess Reliability of FHE Components and Systems
• MicroConnex – Bulk conductivity High-density interconnects

Attendance is limited to government personnel and NextFlex members from Tiers 1, 2, and 3 only (multiple delegates welcome).

2:00 PM and 3:00 PM: Tour NextFlex’s state-of-the-art Technology Hub with NextFlex technical staff in San Jose, CA 

REGISTER

 

Unable to view the registration form? Contact us.

QUESTIONS?

Email or call 408-797-2247.

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