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NextFlex Speaks – June 2019 Schedule

Come see Nextflex speak about microelectronics assembly and packaging:

JUN 12 Wilfried Bair Session I: Microelectronics Assembly and Packaging:  Advanced Manufacturing, Security, and the U.S. Supply Chain NextFlex Workshop: FHE for Defense Applications
JUN 25 – 27 Scott Miller Out of the Box:  Flexible Hybrid Electronics Light & Sound Interactive
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