NextFlex
2244 Blach Place
Suite 150
San Jose, CA 95131
Agenda:
11:00 AM – 12:00 PM
Registration and Lunch
12:00 PM – 12:10 PM
Dr. Scott Miller, Director of Strategic Programs, NextFlex
12:10 PM – 12:40 PM
Dr. Ali Javey, Lam Research Distinguished Chair in Semiconductor Processing Professor of Electrical Engineering and Computer Sciences; Program Leader, Electronic Materials, LBNL Co-Director, Berkeley Sensor & Actuator Center Associate Editor, ACS Nano, University of California, Berkeley
12:40 PM – 1:10 PM
Dr. Melanie Tomczak, Director, Biological and Nanoscale Technologies, UES, Inc.
1:10 PM – 1:40 PM
Dr. Hong Yeo, Assistant Professor, Mechanical Engineering and Biomedical Engineering, Georgia Tech
1:40 PM – 2:10 PM
Dr. Ahyeon Koh, Assistant Professor, Biomedical Engineering, Binghamton University
2:10 PM – 2:30 PM
Coffee Break
2:30 PM – 3:00 PM
Dr. Leanna Levine, President and CEO, ALine, Inc.
3:00 PM – 3:30 PM
Dr. Sheng Xu, Assistant Professor of Nanoengineering, Bioengineering, and Electrical and Computer Engineering, UC San Diego
3:30 PM – 4:00 PM
Hooman Nazari, Product Development Lead, Nypro, a Jabil Company
4:00 PM – 5:00 PM
Health Monitoring Panel Discussion –Progress and Potential Areas of Future InterestDuring this panel, we will hear from each of the panelists about the current and future progress in Human Health Monitoring. We will also hear answers to questions submitted by members of the audience.Moderator: Dr. Scott Miller, Director of Strategic Programs, NextFlex
Panelists:
Roozbeh Ghaffari, CEO and President, Epicore Biosystems
Azar Alizadeh, Principal Scientist, GE Global Research
Stephaney Shanks, Division Director, Integrative Health and Performance Sciences, UES, Inc.
Benjamin Leever, Government CTO, NextFlex Technical Director, Manufacturing & Industrial Technologies, Air Force Research Laboratory
Janos Veres, Program Manager, PARC
5:00 PM
Closing Remarks
Registration Information:
Event is free to NextFlex Member, Government and SEMI Members
Dr. Tom Rucker, VP, Technology Development and Dir-Assembly and Test Technology at Intel, gave an amazing keynote presentation at our event today, reminding us that “packaging is no longer an afterthought; it is an extension of the backend of the fab.” 1/2
#FHE #AdvancedPackaging
Project Call 7.0 awardees have been announced! Learn more about the projects from organizations like @LockheedMartin, @GEResearch, @binghamtonu, @RaytheonDefense, @GDMS, @AuburnU, @UESIncDayton, and @SafetySentinel.
For the better part of two years, the supply chain has wrestled with a semiconductor shortage that has impacted numerous sectors of the electronics industry. Learn how to avoid the next chip shortage here!
https://electronics360.globalspec.com/article/18997/q-a-how-to-avoid-the-next-chip-shortage
