Mark Your Calendar: September 21st is the 2nd Annual NextFlex Members’ Innovation Day.

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Bringing The FHE Community Together

FLEXINAR: Optimizing Proven Best Practices from Semiconductor and Electronics Packaging for FHE

GoToWebinar (online)
Cost: $0
Members and Government Partners Only


This 60-minute Flexinar will highlight the need for connection among the semiconductor, electronics packaging, and flexible printed electronics industries. Knowledge gained from material and process innovation can certainly help advance the evolving flexible printed electronic industry. Likewise, requirements of printed electronics can feed into design integration for microprocessors and memory devices. This inter-industry communication will help recognize critical points of overlap and feedback loops to enable advancements in designs of integrated flexible substrate and interconnects, developing advanced semiconductors with significantly more processing capability & reduced power consumption.

The main goal of this Flexinar is to initiate conversation among the experts of these three industries and highlight some of the key challenges and potential solutions in realizing the FHE manufacturing ecosystem.


Jyoti Malhotra, Brewer Science


Wednesday, October 25, 2017
10:00-11:00 AM PDT / 1:00-2:00 PM EDT

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