New form factors in components and products are continuously being introduced today. Some examples of products for personal use are foldable smartphones, wearable sensors, and smart IoT speakers with AI. Examples of components are curved screens, metal ink compounds, bendable batteries, and bendable antennas. New material components will be needed …
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In this Flexinar, Dr. Carey will describe dpiX’s manufacturing capability, the new technologies that allow dpiX to make products on flexible substrates, and how your company can work with dpiX to leverage its unique manufacturing capability. dpiX is the world’s leading manufacturer of digital X-Ray sensor backplanes for the medical …
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Join us for advanced manufacturing approaches and platforms for accelerating the commercialization of FHE devices and systems from prototype to low volume to high volume production. This workshop will cover FHE applications from wearables to IoT and asset monitoring; FHE manufacturing (scalable printing and integration); and FHE processing (roll-to-roll).
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Join this event to meet potential teaming partners for Project Call 4.0 (PC 4.0). The gathering commences with a review of the PC 4.0 proposal submission process followed by Q&A. Networking to facilitate project teaming rounds out the afternoon. For more information about PC 4.0, please click here. Details Where: …
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Project Call 4.0 (PC 4.0) is scheduled for release on Monday, August 6, 2018. PC 4.0 will continue to focus on the areas identified in the Flexible Hyrid Electronics (FHE) Roadmap developed by NextFlex Technical Working Groups. This roadmap is developed by industry, government, nonprofit, and academic subject matter experts, …
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Registration Closed About During this event, OSD will be seeking partnerships for 6-3 funding of $41.6M over four years to develop and shape proposals in response to the FY 2019 OECIF Call for Proposals to fund multi-year science and technology (S&T) projects that will enhance energy storage to improve lethality …
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