REMINDERS JAN 24 Flexinar: “Low Power Solutions for Flexible Hybrid Electronics Today and Tomorrow” presented by Analog Devices” Register Now FEB 12-15 2018FLEX – Flexible and Printed Electronics Conference (Monterey, CA). Register Now. Important: Early bird rate ends JAN 4 NextFlex members save an additional $300. No code required; just be sure …
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Flexible hybrid electronics (FHE) integrate ultra-thin, flexible semiconductor devices and printed components with functions such as power, communications, fluidics, and sensing in flexible systems that can bend, fold, stretch, and conform to create products that fit the natural, curved form of our world while preserving the full operational integrity of …
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NextFlex joins Jabil on Manufacturing Day at their Blue Sky Center in San Jose, Calif., to celebrate modern manufacturing. Participants can meet with technologists, tour the facility, and learn about how 21st century manufacturing is transforming lives in aerospace, automotive, healthcare, energy, digital home, and wearables. NextFlex will showcase FlexFactor, …
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Innovation Day is a celebration of progress on project work, results achieved in the Technology Hub, outcomes from Workforce Development programs, and connections made in developing the FHE manufacturing ecosystem. This invitation-only event is an opportunity for members to network, discover new technology, and meet influencers in the FHE manufacturing supply chain. Innovation Day will include 60 exhibit tabletop demonstrations by NextFlex members and government partners showing the latest and greatest demonstrations of FHE-enabled prototypes and products.
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This 60-minute Flexinar will cover existing and emerging conductive paste technologies such as new thermoplastic silver compositions that offer greater flexibility and stretch. It will answer the question, “What is Polymer Thick film?” and provide a understanding of the critical processing parameters for these materials. Substitutes to silver such as …
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This 60-minute Flexinar will highlight the need for connection among the semiconductor, electronics packaging, and flexible printed electronics industries. Knowledge gained from material and process innovation can certainly help advance the evolving flexible printed electronic industry. Likewise, requirements of printed electronics can feed into design integration for microprocessors and memory …
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