NextFlex Events

Description The Occam Process for the design and manufacturing of electronic assemblies was first introduced to industry in 2007. The process eliminates most soldering operations from the electronics assembly process, thereby potentially reducing cost and size while increasing performance, reliability and environmental friendliness. This 60-minute Flexinar will describe the Occam …

Wed, Sep 20 1:00 PM – 5:00 PM
NextFlex Technical Council Meeting
This Technical Council meeting will include updates on:

Summary Nascent Flexible Hybrid Electronics-based products (FHE) offer important potential to supplement advancements in this market and also to provide technological solutions for new use-cases to enhance safety, capability, and user-experience across the commercial automobile and military ground vehicles. Flexible, conformable electronic systems that merge high performance with the efficiency …

Last August saw the launch of the newly established NextFlex Headquarters and Technical Hub with Innovation Opening Day. Please join us for Innovation Day 2017 to celebrate a year of Manufacturing, Innovating, and Educating with demos, networking, and a tour of our state-of-the-art Flexible Hybrid Electronics pilot manufacturing facility.

When Thursday, June 22, 2017, 4:45-6:00 PM Where Hyatt Regency Monterey 1 Old Golf Course Road Monterey, CA 93940 Room: Regency Grand Ballroom (Main) Co-located with 2017FLEX Description Review key components of Project Call 3.0 and meet potential collaboration partners at this event created to foster project call proposal teaming. …

WHEN Thursday, June 8, 2017, 10:00-11:00 AM Pacific (1:00-2:00 PM Eastern) DESCRIPTION Project Call 3.0 was released on May 31, 2017. This webinar will provide an overview for those considering submitting a proposal. Topics include cost-share, the project call process and timeline, and a review of topic areas, after which the floor will open …