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Bringing The FHE Community Together

Technical Council Meeting


San Jose, CA

Location:

NextFlex
2244 Blach Place
Suite 150
San Jose, CA 95131

Agenda:

10:00 AM – 11:00 AM Registration
11:00 AM – 11:20 AM Welcome and NextFlex Updates

  • Scott Miller, Director of Strategic Programs, NextFlex
11:20 AM – 11:40 AM NextFlex Engineering Update

  • Wilfried Bair, Director of Engineering, NextFlex
11:40 AM – 11:55 AM NextFlex Fab Update

  • Art Wall, Director of Fab Operations, NextFlex
11:55 AM – 12:05 PM FHE PRO Introduction

  • Brynt Parmeter, Director of Workforce Development, Education & Training, NextFlex
12:05 PM – 12:45 PM Working Lunch with Guest Speaker

“Safe and Effective Wireless Medical Devices: An FDA Perspective”

  • Don Witters, CDRH, OSEL, DBP, U.S. Food and Drug Administration
PC 4.0 Kickoffs
12:45 PM – 1:00 PM PC 4.5: “Multilayer Printed Transmit Antenna with Integrated Electronics”

  • Azar Alizadeh, Principal Scientist, GE Global Research
1:00 PM – 1:20 PM PC 4.5: “Multilayer Printed Transmit Antenna with Integrated Electronics”
PC 4.7: “Smart Textile with Embedded and printed sensors (STEPS)”
PC 4.9: “FHE Demonstrator for UAV Applications”

  • John Williams, Associate Technical Fellow, Advanced Electromechanical Technologies (AET), Boeing Research and Technology
1:20 PM – 1:35 PM PC4.1: “Application-Responsive Encapsulation Processes for FHE Devices”

  • Chris H. Stoessel, Sr. Manager, Process Development, Eastman Chemical Company
1:35 PM – 1:55 PM Coffee Break
Final Reports Out
1:55 PM – 2:40 PM PC 3.7: “Soft, Epidermal Biosystems with Advanced Sensing and Microfluidics Capabilities”

  • Roozbeh Ghaffari, CEO and President, Epicore Biosystems
2:40 PM – 3:25 PM PC 3.2: “Printed Passives for FHE with Process Documentation and Hyperspectral Metrology”

  • John Williams, Associate Technical Fellow, Advanced Electromechanical Technologies (AET), Boeing Research and Technology
3:25 PM – 4:10 PM PC 2.4: “Flexible Hybrid Electronics Process Design Kit (Phase-I)”

  • Jim Huang, Senior Research Scientist, Hewlett Packard Labs
4:10 PM – 4:15 PM Closing
4:15 PM – 6:00 PM Networking Reception

 

Registration:

  • Register for Innovation Day and choose to attend the Technical Council Meeting
  • Attendance is limited to government personnel and NextFlex members from Tiers 1, 2, and 3 only (multiple delegates welcome)
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