Autonomous and electric vehicles are reshaping the transportation environment, and a vibrant technology ecosystem is developing to support this new paradigm. Join a fleet of experts on Thursday, October 22nd from 9am – 11:00am PDT, for a stimulating discussion on how the development and deployment of emerging automotive technologies are driving demand for innovative semiconductor-based solutions and creating new opportunities for collaboration within the electronics industry.
The Forum will cover the key technologies, drivers, collaborations and market trends shaping the future of the Smart Mobility.
Register to hear Lucid Motors, Uber, Gartner & Intel Corporation present.
IEEE SENSORS 2020 is intended to provide a forum for research scientists, engineers, and practitioners throughout the world to present their latest research findings, ideas, and applications in the area of sensors and sensing technology.
IEEE SENSORS 2020 will include keynote addresses and invited presentations by eminent scientists and engineers. The conference solicits original state-of-the-art contributions as well as review papers.
InterPACK is the premier international conference for exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of electronics packaging and heterogeneous integration. It is the flagship conference of the ASME Electronic and Photonic Packaging Division (EPPD). InterPACK is a systems-focused conference covering topics on Heterogeneous Integration, Servers of the Future, Edge and Cloud Computing, Internet of Things, Flexible and Wearable Electronics, Photonics and Optics, Power Electronics, Energy Conversion and Storage, and Autonomous, Hybrid and Electric Vehicles. The international nature of the meeting has been highly beneficial in promoting global interactions between industry, academia, research institutions, funding agencies, start-ups and entrepreneurs. In addition to paper presentations and exhibits, InterPACK 2020 will include panel discussions, workshops, tutorials, keynote and technology talks by prominent speakers, and a joint industry, national laboratory, and academia poster session.
The 2021 New York State Innovation Summit will feature companies and researchers at the forefront of emerging technologies and new advancements in production capabilities. This event celebrates New York State leadership in technology-led economic growth with experts in biotechnology, new materials, energy innovation, and artificial intelligence that will explore current technology convergence opportunities, ways to accelerate commercialization, and issues of manufacturing sustainability.
Embedded Technologies Expo & Conference (ETC), in the largest embedded and IoT market in North America, is the ONLY event focused on what is most important to designers and implementers – education and training. At the second annual event, attendees will experience over 100 hours of unparalleled education and training covering embedded systems, IoT, connectivity, edge computing, AI, machine learning, and more. Co-located with Sensors Expo & Conference, the largest North American event to focus on sensors and connectivity, attendees will have the opportunity to see hundreds of leading exhibitors and network with thousands of industry peers and innovators.
The IDTechEx Show! is hosted twice a year – in Berlin in Germany and in Santa Clara in the USA. It covers a number of high growth emerging technologies, providing insight on the applications and latest technical and market progress of each.
Each of the technologies have their own full two-day conference, with a combined exhibition. Attendees to any conference can attend all conference sessions for any topic with their conference pass.
Healthcare Sensor Innovations USA 2020 is a conference and table-top exhibition focusing on the latest developments in the use of wearables and sensors in continuous monitoring of individuals and point-of-care diagnostics.
February 22-24, 2021
You’ll hear experts highlight the latest technical breakthroughs, unique electronics applications, and business strategies giving insight into the future of next-generation Integration beyond Moore’s law era.
Flexible hybrid electronics (FHE) present unique heterogeneous integration capabilities with unprecedented continuity with us and our world. This softer side of electronics represents high performance integrated devices that are curved and variable in form factor. Electronics that augment our daily activities and interact with our surroundings like no personal computing device ever has are emerging in new and varied application spaces.
NOTE: This year’s conference takes place Monday–Wednesday, February 22-24, 2021, at the Doubletree Hotel in San Jose, California. Due to the COVID-19 world health-safety situation, it is possible FLEX will be a virtual event.