August 2, 2019
12th Annual Northern California Cardiovascular Team Symposium
The California Chapter of the American College of Cardiology invite you to join this symposium that discusses: Driving Innovation through Advanced Sensors and Flexible Technology, industry and government to discuss the state of the art in electronics packaging, and more. This event will take place at the Marriott San Francisco Airport Waterfront in Burlingame, California, from 7:30AM to 5:00 PM.
August 11-14, 2019
IEEE International Flexible Electronics Technology Conference
The IEEE invites you to join their premier conference designed for scientists, researchers, engineers, developers, and end-users to exchange technical research milestones and perspectives in the field of flexible electronics. It provides attendees with a unique opportunity to share, discuss and witness new concepts, new ideas and know-hows in flexible electronics technologies and their applications, including; Photovoltaics, Flexible Sensors,Energy Storage Devices, Antennas, Microwave Devices, Energy Harvesting, Lighting and Displays, and Wearables to name a few. The conference offers plenary talks, tutorials, and oral or poster presentations. Hosted at the Simon Fraser University at Harbour Centre in Vancouver BC, Canada.
September 5-6, 2019
31st Annual Electronics Packaging Symposium
GE Research and the Integrated Electronics Engineering Center at Binghamton University invite you to join this two-day symposium that convenes leaders in academia, industry and government to discuss the state of the art in electronics packaging. Hosted by GE Research Center in Niskayuna, New York.
September 30, 2019
iMAPS 2019 52nd Symposium on Microelectronics
The 52nd International Symposium on Microelectronics is being organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The IMAPS 2019 Technical Committee seeks original papers that present progress on technologies throughout the entire microelectronics/packaging supply chain. The Symposium will feature 5 technical tracks, plus iMAPS’ Interactive Poster Session, that span the three days of sessions. Hosted at the Hynes Convention Center in Boston, Massachusetts.
October 7-9, 2019
International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
InterPACK is the premier international conference for exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of electronics packaging and heterogeneous integration. It is the flagship conference of the ASME Electronic and Photonic Packaging Division (EPPD). InterPACK is a systems-focused conference covering topics on Heterogeneous Integration, Servers of the Future, Edge and Cloud Computing, Internet of Things, Flexible and Wearable Electronics, Photonics and Optics, Power Electronics, Energy Conversion and Storage, and Autonomous, Hybrid and Electric Vehicles. Hosted at the Hilton Anaheim in Anaheim, California.
October 7-9, 2019
New York State Innovation Summit
Learn about the technologies that are defining a new generation of products and manufacturing capabilities, showcase your own successes leveraging advanced technologies, and discover how New York State’s innovation ecosystem can accelerate your company’s growth. FuzeHub is hosting a New York State Innovation Summit in collaboration with Empire State Development’s Division of Science, Technology & Innovation (NYSTAR) in Rochester in October 2019.
October 22-24, 2019
MEMS & Sensors Executive Congress
The MSEC 2019 presentations will cut across various market and technology topics. Industry economic and business updates will be covered from different aspects of the ecosystem together with forward-looking strategic and technology trends. The opportunities and challenges brought about by key technologies such as 5G, AI, Machine Learning, Blockchain, and Imaging / Vision, will be front and center. Hosted by SEMI at the Marriott Coronado Island Resort & Spa in Coronado, California.
October 24, 2019
Additive Electronics Conference: PCB Scale to IC Scale
This conference is designed to showcase options and processes entended to enable line width and space from .003″ to 5 microns, and to provide information on supporting materials and processes that are being developed to serve all market segments and expose attendees to other new technogies intended to meet the ever increasing challenges of smaller, lighter, and more powerful electronic devices. Hosted by SMTA at the Double Tree by Hilton in San Jose, California.
November 20-21, 2019
Printed Electronics USA is part of the IDTechEx Show! A series of synergistic events on wearable, sensors, internet of things, graphene & 2D materials, energy storage, electric vehicles. Each of these is a full two-day executive conference with a common exhibition. Hosted at the Santa Clara Convention Center in Santa Clara, California.