August 11-14, 2019
IEEE International Flexible Electronics Technology Conference
The IEEE invites you to join their premier conference designed for scientists, researchers, engineers, developers, and end-users to exchange technical research milestones and perspectives in the field of flexible electronics. It provides attendees with a unique opportunity to share, discuss and witness new concepts, new ideas and know-hows in flexible electronics technologies and their applications, including; Photovoltaics, Flexible Sensors,Energy Storage Devices, Antennas, Microwave Devices, Energy Harvesting, Lighting and Displays, and Wearables to name a few. The conference offers plenary talks, tutorials, and oral or poster presentations. Hosted at the Simon Fraser University at Harbour Centre in Vancouver BC, Canada.
September 5-6, 2019
31st Annual Electronics Packaging Symposium
GE Research and the Integrated Electronics Engineering Center at Binghamton University invite you to join this two-day symposium that convenes leaders in academia, industry and government to discuss the state of the art in electronics packaging. Hosted by GE Research Center in Niskayuna, New York.
September 30, 2019
iMAPS 2019 52nd Symposium on Microelectronics
The 52nd International Symposium on Microelectronics is being organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The IMAPS 2019 Technical Committee seeks original papers that present progress on technologies throughout the entire microelectronics/packaging supply chain. The Symposium will feature 5 technical tracks, plus iMAPS’ Interactive Poster Session, that span the three days of sessions. Hosted at the Hynes Convention Center in Boston, Massachusetts.
October 7-9, 2019
International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
InterPACK is the premier international conference for exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of electronics packaging and heterogeneous integration. It is the flagship conference of the ASME Electronic and Photonic Packaging Division (EPPD). InterPACK is a systems-focused conference covering topics on Heterogeneous Integration, Servers of the Future, Edge and Cloud Computing, Internet of Things, Flexible and Wearable Electronics, Photonics and Optics, Power Electronics, Energy Conversion and Storage, and Autonomous, Hybrid and Electric Vehicles. Hosted at the Hilton Anaheim in Anaheim, California.
October 7-8, 2019
New York State Innovation Summit
Learn about the technologies that are defining a new generation of products and manufacturing capabilities, showcase your own successes leveraging advanced technologies, and discover how New York State’s innovation ecosystem can accelerate your company’s growth. FuzeHub is hosting a New York State Innovation Summit in collaboration with Empire State Development’s Division of Science, Technology & Innovation (NYSTAR) in Rochester in October 2019.
October 17-18, 2019
HEATT Innovation Technology Summit
The purpose of this summit is to unite individuals within industry and research settings to provide the most up-to-date, accurate information for the attendees and enhance the technology associated with all aspects of optimizing performance and safety in the heat for the athlete, warfighter, and laborer. Attendees will have the opportunity to hear from experts representing leading companies who will speak during the breakout sessions about their newest technology. Industry representatives are invited to present their products at booths during the exhibit portions of the summit.
October 22-24, 2019
MEMS & Sensors Executive Congress
The MSEC 2019 presentations will cut across various market and technology topics. Industry economic and business updates will be covered from different aspects of the ecosystem together with forward-looking strategic and technology trends. The opportunities and challenges brought about by key technologies such as 5G, AI, Machine Learning, Blockchain, and Imaging / Vision, will be front and center. Hosted by SEMI at the Marriott Coronado Island Resort & Spa in Coronado, California.
October 23, 2019
Center for Wearable Sensors at UC San Diego Summit
Focused on bridging the gap between academia and industry to promote the field of hybridized flexible electronics.
October 24-25, 2019
Additive Electronics Conference: PCB Scale to IC Scale
This conference is designed to showcase options and processes entended to enable line width and space from .003″ to 5 microns, and to provide information on supporting materials and processes that are being developed to serve all market segments and expose attendees to other new technogies intended to meet the ever increasing challenges of smaller, lighter, and more powerful electronic devices. Hosted by SMTA at the Double Tree by Hilton in San Jose, California.
November 20-21, 2019
Printed Electronics USA is part of the IDTechEx Show! A series of synergistic events on wearable, sensors, internet of things, graphene & 2D materials, energy storage, electric vehicles. Each of these is a full two-day executive conference with a common exhibition. Hosted at the Santa Clara Convention Center in Santa Clara, California.
December 2-6, 2019
PowerMEMS – Micro and Nanotechnology for Power Generation and Energy Conversion Applications
The PowerMEMS conference provides an excellent opportunity to bring together world scientists and engineers from academia, research institutes and companies to present and discuss the latest results in the general fields of miniaturized devices and systems for power generation and energy conversion in micro and nano scales.
December 2-5, 2019
Defense Manufacturing Conference
The Defense Manufacturing Conference is focused on showcasing manufacturing for defense purposes and will have over 160 exhibitors, 650 organizations, and more.
February 24-27, 2020
From fundamental materials to applications, Flex 2020 delivers sessions packed with valuable intel from more than 120 industry thought leaders and researchers. Professionals in the flexible, hybrid and printed electronics field come to network with customers, industry colleagues, academia, suppliers, and partners on the show floor, and to learn about the latest technology developments through interactive discussions and product demonstrations.
May 10-14, 2020
“The Committees for North America, Asia, and Europe for the International Meeting on Chemical Sensors” invite you to IMCS 2020, to be held in Montreal during May 2020. This will be the 18th in a series of successful meetings for researchers, professionals, and business leaders to see the state of the art in sensors for gases, liquids, biologicals, for applications in health and environment, wearables and fixed infrastructure, as well as wired and wireless.