July 21-31, 2021
SEMI FlexTech organizes this series of Flexible Electronics Master Classes on topics proving most challenging to the design, manufacture and use of flexible and printed electronics. The series enables product designers, integrators, and others new to the fields to evaluate technologies and components and make the best choices for their product.
July 27-28, 2021
DSI’s 5th Annual Military Additive Manufacturing Summit is designed as an educational “Town Hall” forum, where thought leaders & key policy-makers across military services, defense agencies, & civilian organizations can come together for actionable discussions & debate. This year’s Summit will focus on the latest innovations in 3D printing technologies & the push across the DoD to rapidly supply durable, effective equipment & parts to the Warfighter on the battlespace. Additive manufacturing methods are being quickly integrated across the Armed Services to increase the current level of capability, while reducing the cost of parts, in order to deliver greater operational flexibility to the Warfighter and further enhance the defense industrial base.
August 8-11, 2021
IFETC-3’s Technical Program covers a wide range of cutting-edge developments in printed and flexible electronics. IFETC, started in Ottawa, Canada (2018) is a new EDS-lead international conference, focusing upon printed and flexible hybrid and non-hybrid materials, devices and systems. It will rotate between the Americas, Asia and Europe, heading to Shanghai PRC in 2022. IFETC aims to bring together a wide variety of stakeholders, from chemists, materials scientists, physicists, to mechanical and electrical engineers, the fabrication and manufacturing communities, as well as end-users, e.g. packaging and medical communities.
August 9-13, 2021
Sep 13-16, 2021
This year’s IMAT is expected to be an even bigger and better conference, featuring a NEW co-location with Heat Treat 2021 and the Motion & Power Technology Expo. Special IMAT virtual preview sessions are currently being planned and coming soon!
Sep 14-15, 2021
Adaptive Structures and Materials Systems by definition are intelligent, flexible systems that sense and respond to ever changing environments. The field has rapidly matured due to synergistic interdisciplinary efforts across sectors of universities, government, and industry. To continue the high impact growth of this field and lead it into the future, the purpose of this conference is to assemble world experts across engineering and scientific disciplines (mechanical, aerospace, electrical, materials, and civil engineering, biology, physics chemistry, etc.) to actively discuss the latest breakthroughs in smart materials, the cutting edge in adaptive structure applications and the recent advances in both new device technologies and basic engineering research exploration.
September 21-23, 2021
Meet engineers sharing real stories and the latest technology applications that impact the world around us. Join the sensors and electronics community this September at the one in-person and virtual event covering the biggest design engineering trends. From sensors and chips to the cloud, Sensors Converge covers the technologies and applications driving innovation today.
Oct 26-28, 2021
InterPACK is the premier international conference for exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of electronics packaging and heterogeneous integration. It is the flagship conference of the ASME Electronic and Photonic Packaging Division (EPPD). InterPACK is a systems-focused conference covering topics on Heterogeneous Integration, Servers of the Future, Edge and Cloud Computing, Internet of Things, Flexible and Wearable Electronics, Photonics and Optics, Power Electronics, Energy Conversion and Storage, and Autonomous, Hybrid and Electric Vehicles. The international nature of the meeting has been highly beneficial in promoting global interactions between industry, academia, research institutions, funding agencies, start-ups and entrepreneurs. In addition to paper presentations and exhibits, InterPACK 2021 will include panel discussions, workshops, tutorials, keynote and technology talks by prominent speakers, and a joint industry, national laboratory, and academia poster session.
Nov 8-9, 2021
The 2021 New York State Innovation Summit will feature companies and researchers at the forefront of emerging technologies and new advancements in production capabilities. This event celebrates New York State leadership in technology-led economic growth with experts in biotechnology, new materials, energy innovation, and artificial intelligence that will explore current technology convergence opportunities, ways to accelerate commercialization, and issues of manufacturing sustainability.
Dec 7-9, 2021
Hybrid SEMICON West 2021 connects the entire extended electronics supply chain—in one place, at one time. It’s the smart way to re-connect with your contacts, customers, partners, plus drive your business forward.
Dec 13-16, 2021
DMC is the nation’s annual forum for enhancing and leveraging the efforts of engineers, managers, technology leaders, scientists, and policy makers across the defense manufacturing industrial base. Leaders and manufacturing subject matter experts from government, industry, and academia exchange information and perspectives on defense manufacturing policies, strategic direction, best practices, funding opportunities, and the latest manufacturing innovations that will benefit our warfighters.
Dec 15-17, 2021
This inaugural International Conference on Micro- and Nano-devices Enabled by Roll-to-Roll Manufacturing is intended to be a forum for engineers and scientists to present recent advances in all areas encompassing R2R manufacturing systems, processes, metrology & data analytics, scalable materials, devices, and applications.