Join us on June 26 – 28 in Seattle for our workshop: The Hybrid Electronics Commercialization Path for Aerospace Applications

Industry Events

What Else is Happening in FHE

2023 CubeSat Developers Workshop

April 24 – April 27, 2023

In Person Only: San Luis Obispo, CA

The CubeSat Developers Workshop is an annual conference hosted by the Cal Poly CubeSat Laboratory at Cal Poly, San Luis Obispo. We plan to hold the 2023 conference in-person at the Cal Poly Performing Arts Center, as we have in years past. The conference draws more than 500 industry professionals, small satellite developers and students who will take part in three days of live presentations, Q&A panels, exhibit booths, and more!

View the 2023 CubeSat Developers Workshop agenda


SPIE Defense + Commercial Sensing

April 30 – May 4, 2023

In Person Only: Orlando, FL

The Workshop on Semiconductor Manufacturing in the Space Domain brings together stakeholders from the semiconductor industry, commercial space station entities, U.S. government agencies, and academic communities to roadmap semiconductor manufacturing in low-Earth orbit (LEO) for the new space economy. This workshop aims to identify the benefits and challenges of semiconductor manufacturing in microgravity through a variety of formats such as oral presentations, poster sessions, and panel discussions. The multidisciplinary blend of subject matter experts provides a unique forum to bridge the gaps necessary to advance semiconductor commercial endeavors in LEO.

View the SPIE Defense + Commercial Sensing agenda


TIES Convening

May 1 – 3, 2023

In Person Only: Jacksonville, FL

This Convening is designed to afford us time to sit with the challenges that we face in STEM education and workforce. We are going to work together to build plans for world-class experiences in AI with AIedu and others, STEM environments that foster a sense of belonging in STEM, increased access for all students to careers in Data Science, STEM Ecosystems to experience authentic partnership with NASA, eradicating barriers to BIPOC student access to and through higher education, and so much more. We are working daily with thought leaders from countless fields around the world to design this event so that the topics of interest and impact are there. If you are opting to design deeply in AI, bring in school districts, community colleges and tech folks to be in attendance. Alternatively, if you are working on bringing IBM’s SkillsBuild to your STEM Ecosystem, invite local districts’ CTE leadership, community college partners, and advanced manufacturing or cyber folks to come as well. It is so important that the school guidance counselors who work tirelessly in your STEM Ecosystem districts be included as NSF INCLUDES Alliance, STEM PUSH Network and their STEM Ecosystem partners help counselors to understand the opportunities for STEM admissions.

View the TIES Convening agenda

Speaker: Courtney Power, Workforce Development Deputy Director

Talk Title: The NextFlex Generation of Rosie’s Riveters and Hard-Hatted Women (HHW)

Time: Tuesday, May 2nd 2023 (Part I: 9:45am – 11:45am, Part II: 2:00pm – 5:00pm)

Ceramics Expo co-located with the Thermal Management Expo

May 1 – 3, 2023

In Person Only: Novi, MI

Ceramics Expo brings together the global ceramics and glass supply chains to source the latest materials, components and technologies, provide face to face networking and business opportunities and discuss the future challenges and opportunities facing the technical ceramics industry.

View the Conference CEX Agenda


Advanced Semiconductor Manufacturing Conference

May 1 – May 4, 2023

In Person Only: Saratoga Springs, NY

ASMC is the leading international technical conference for discussing solutions that improve the collective manufacturing expertise of the semiconductor industry. Solving the challenges presented by semiconductor manufacturing is a combined effort by device makers, equipment and materials suppliers, and academics. ASMC provides an unparalleled platform for semiconductor professionals to network and learn the latest in the practical application of advanced manufacturing strategies and methodologies.

View the Advanced Semiconductor Manufacturing Conference agenda


IMAPS New England 49th Symposium & Expo

May 2, 2023

In Person Only: Boxboro, MA

The iMAPS New England Symposium and Expo is the leading regional forum for the exchange of information on microelectronic assembly and packaging technologies. Our Society encompasses numerous engineering disciplines including mechanical-electrical-thermal-optical design, materials, manufacturing, environment testing, and more.

View the IMAPS agenda


Space Tech Expo

May 2 – 4, 2023

In Person Only: Long Beach, CA

In 2023, Space Tech Expo USA will celebrate its 11th year of uniting the entire space industry under one roof, in two days of collective learning, the chance to experience the latest technologies and products in-person as well as unparalleled opportunities to network and form new business partnerships.

View the Space Tech Expo agenda


2023 Society of Vacuum Coaters TechCon

May 6 – 11, 2023

In Person Only: Washington, D.C.

For over 60 years, the Society of Vacuum Coaters has delivered stimulating content, mixing basic and applied research along with ideas and tools focusing on transitioning research and development results into production. Each year adds new insights into the latest trends and state-of- the-art developments in the dynamic field of vacuum coating technologies. By attending, participants experience the complete benefits of belonging to a global community of vacuum coating professionals.

View the TechCon Final Program & Exhibit Guide

Speaker: Scott Miller, Director of Technology

Abstract Title: Technology Opportunities in Hybrid Electronics Manufacturing

Time: Wednesday, May 10, 2023, 8:40 AM – 9:20 AM EST, Maryland C Ballroom


23rd Annual Science & Engineering Technology

May 23 – 25, 2023

In Person Only: University of Texas at San Antonio, TX

DoD S&T has provided unquestioned war fighting advantages over 40 years through its unique combination of technology, innovation, creativity, ingenuity, and personnel training. One lesser-known benefit of DoD S&T is its contributions to humanitarian assistance and disaster relief (HA/DR), and Small Business Innovation Research program (SBIR). This year’s conference will bring Industry together with the Department of Defense Research, Engineering, Acquisition, and Sustainment communities to examine the investment priorities and challenges across the OSD, Components, Agencies and Combatant Commands, including top-level strategy updates from Component and COCOM S&T leadership. It will also provide a platform for communities of interest to brief and discuss their issues. There will be a focus on how the department is aligning its investment in technology to the National Defense Strategy and operational need – from technology discovery (BA 6.1 to 6.4) to capability delivery (BA 6.3 to 6.8).  Special featured topics for this year will include the S&T needs of the HA/DR mission as well as success stories from the SBIR program.

View the 23rd Annual Science & Engineering Technology agenda


2023 IEEE ECTC 73nd Electronic Components and Technology Conference

May 30 – June 2, 2023

In Person Only: Orlando, FL

The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology, and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society.

View the ECTC agenda

Speaker: Courtney Power, Workforce Development Deputy Director

Talk Title: Diversifying our Technical Workforce to meet National Needs including the CHIPS Act Initiative

Time: Wednesday May 31st, 2023 6:30pm – 8pm



May 30 – June 2, 2023

In Person Only: Orlando, FL

Sponsored by the IEEE’s Electronics Packaging Society (EPS), ITherm 2023 is an international conference for scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems. ITherm 2023 will be held along with the 73rd Electronic Components and Technology Conference (ECTC 2023 –, a premier electronics packaging conference at the JW Marriott Grande Lakes, Orlando, FL, USA. Joint registrations will be available at a discounted rate. In addition to paper presentations and vendor exhibits, ITherm 2023 will include panel discussions, keynote lectures by prominent speakers, invited technology talks, ECTC/ITherm joint networking events and short courses, and a student design competition.

View the ITherm 2023 agenda and program

Speaker: Art Wall, Director of FAB Operations

Talk Title: Advances in Additive Manufacturing and Topology Optimization for Electronics Applications – Packaging and Thermal Management

Time: Wednesday May 31st 8am – 9am

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