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NextFlex Member Meetings at FLEX 2019

February 20–22

NextFlex members and government partners convene for a slate of member meetings once again at the annual FLEX Conference in Monterey, California to advance U.S. manufacturing of flexible hybrid electronics. There is no cost to attend NextFlex member meetings. NextFlex members also receive a member discount to attend the FLEX Conference; no code is required. Be sure to stop by and visit the NextFlex booth in the expo!

SCHEDULE

Wednesday, February 20
12:00–1:30PM: Technical Working Groups (TWG)

All TWG members are invited to an update on the current status of the FHE Process Design Kit (PDK) and the Modeling & Design Roadmap. During short breakout sessions, ideas and prioritization of next steps for both the PDK and multi-physics modeling tools will be generated.

Attendance is limited to government personnel and NextFlex members from Tiers 1, 2, and 3 only (multiple delegates welcome).

Thursday, February 21
12:00–4:00PM: NextFlex Technical Council Meeting
Attendance is limited to Technical Council Voting Members only.

1:30–5:00PM: NextFlex Technology Standards and Roadmapping Discussion, Technology Updates 

  • Chris Jorgenson of IPC will lead a strategic discussion of FHE Standards – their importance, their current status, and a path forward to addressing the gaps.
  • NextFlex members AFRL, Kuprion, Averatek, and Sandia National Lab will discuss their unique FHE capabilities and will describe opportunities to collaborate.

Government partners and all NextFlex members are welcome, including Observer-level members.

4:00–6:00PM: NextFlex Governing Council Meeting
Governing Council members only.

6:00–9:00PM: Evening Member Event
Network with fellow NextFlex members at Scales Seafood & Steaks on the wharf of Monterey Bay.

Government partners and all NextFlex members are welcome, including Observer-level members.

Friday, February 22
8:00AM–12:00PM: NextFlex Project Update Technical Council Meeting
Project updates and key outcomes of mechanical test and reliability projects, as well as other projects.

  • Lockheed Martin (Binghamton University) — Conformal printing of conductor and dielectric materials onto complex 3D surfaces
  • MicroConnex (University of Washington) — Bulk conductivity high-density interconnects
  • University of Massachusetts Lowell (DuPont, Raytheon, Jabil) — Test methods for electrical and mechanical durability of flexible/rigid interfaces in multi-axial fatigue and dynamic loadings
  • Binghamton University (DuPont, GE, Georgia Tech) — Assessment and optimization of the reliability of wearable performance monitors
  • Auburn University (Optomec) — Mechanical test methods for flexible hybrid electronics materials and devices
  • Georgia Tech (DuPont, Binghamton) — Development of test methods and standards to assess reliability of FHE components and systems

Attendance is limited to government personnel and NextFlex members from Tiers 1, 2, and 3 only (multiple delegates welcome).

2:00PM and 3:00PM: Tour NextFlex’s state-of-the-art Technology Hub with NextFlex technical staff in San Jose, CA 

 

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