Dear Members and Friends,
Congratulations are in order! During the recently held ASME InterPACK event, Auburn University, for the second year in a row, was awarded “Best Paper” for their work on “Process-Consistency in Additive Printed Multilayer Substrates with Offset-vias using Aerosol Jet Technology.” Authors Pradeep Lall and Kartik Goyal of Auburn University and Scott Miller of NextFlex were recognized for work on moving additive printed electronics toward high-volume production by focusing on quality control of the manufacturing process. Specifically, process recipes developed through fundamental studies of the interactions between the process parameters and the mechanical-electrical performance achieved for multilayer substrates with special emphasis on printed vias known as donut vias were highlighted in the paper. We are proud of the work that Auburn University is doing to forge a sustainable manufacturing path for flexible hybrid electronics! To view the presentation on-demand, please visit ASME InterPACK where you may also view Dr. Scott Miller’s keynote on Flexible Electronics and several other talks on flexible electronics and additive manufacturing from NextFlex members Komori, nScrypt, Optomec, and Binghamton University. The presentations will be available on the InterPACK site for registered users through January 24, 2021.
NextFlex held an informative virtual workshop on November 12 that focused on FHE in automotive applications. Speakers touched on the role of FHE in autonomy, In-car informatics, and communications and sensing. We were thrilled to have over 200 people register for the workshop, indicating strong member interest (see Scott Miller’s write-up later in this newsletter for details). Members have also indicated that they would like to see NextFlex form a Technical Working Group for this application area so if you’re interested in that, please email us to let us know.
As 2020 winds down, we’re astonished at what the NextFlex community has been able to accomplish, even with the most unusual barrier of a global pandemic. We’re hopeful that the new year will bring more opportunity to collaborate as we look forward to issuing PC 6.0 early in 2021.
Have a safe and wonderful Thanksgiving holiday.
Malcolm J. Thompson, Ph.D.