NextFlex News

Dear Members and Friends, I’m looking forward to hosting you on March 28-29 at the NextFlex Winter Symposium here at the Technology Hub. Not only will we be launching our eighth project call in conjunction with the event, we also will be hosting a Proposer’s Day and Teaming event at …

NextFlex hosted a workshop January 18-19 at its Technology Hub in San Jose, CA, designed to explore and align opportunities for hybrid electronics technologies in new and emerging areas of semiconductor packaging. Attended by 100 subject matter experts from industry, academia, and government, the workshop provided opportunities to brainstorm and …

We’re off to a quick start to 2023 with members, industry experts, and government convening here at the Technology Hub to explore opportunities for flexible and additively manufactured hybrid electronics for new and emerging areas of advanced semiconductor packaging. This workshop is designed to capture inputs from the FHE manufacturing …

Last week NextFlex participated in the Defense Manufacturing Conference held in Tampa, FL, December 5-8. NextFlex speakers in the Electronics Interconnect Panel included: Dr. Scott Miller, Director of Technology, who spoke on “Hybrid Electronics Manufacturing and Applications; Dr. Janos Veres, Director Engineering, who spoke on, “Hybrid Electronics Technology Capabilities for …

Dear Members and Colleagues: It’s been an extremely busy year, and I want to take this opportunity to thank you for your membership and for your support throughout 2022. We look forward to returning fully to in-person events in 2023, starting with a workshop entitled, “Applications of Hybrid Electronics for …

Dear Colleagues and Friends, As we head into the holiday season, it’s my great privilege to look back upon the past year and recognize the accomplishments of so many – our members, government partners, educators delivering FlexFactor® and other NextFlex Learning Programs and, of course, our staff – who work …