Join us on June 26 – 28 in Seattle for our workshop: The Hybrid Electronics Commercialization Path for Aerospace Applications

NextFlex News

Updating you on the latest from NextFlex

NextFlex News – December 2017 Newsletter


Read the December Newsletter Warm holiday greetings, As we approach the 2017 holiday season, I pause to reflect on the progress we have made this year as we continue to fit out the Technology Hub with equipment and process know-how. Soon, NextFlex will be home to the greatest collection of …

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SBIR BAA Topics Now in Pre-release

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The DOD 18.1 and 18.A Broad Agency Announcement (BAA) topics are now in pre-release! View topics, ask questions through the SITIS Q&A system, and contact topic authors directly through the link below. This BAA will officially open for proposal submission on January 8, 2018. Topics of note include: Chronological Sweat …

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See You at DMC in Tampa, FL, December 4-7

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NextFlex and its members are participating at DMC! Tuesday, Dec. 5, 3:30 to 5:00 pm, Ballroom A “Status of Manufacturing Institutes” Dr. Malcolm Thompson, Executive Director, NextFlex Wednesday, Dec. 6, 10:30 to 11:30 am, Ballrooms B-D “Manufacturing Institutes – What We’ve Learned in the Last 5 Years” Panel Discussion Dr. …

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Member Spotlight: Uniqarta

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Meet Uniqarta. Uniqarta is commercializing next-generation chip assembly technology that places ICs 10,000 times faster than today’s solutions and accommodates ICs that are ten times thinner or smaller. What would you like others to know about Uniqarta and/or its capabilities? FlexChip™, one of Uniqarta’s technologies, is a flip-chip assembly solution …

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