Project Call 3.0 (PC 3.0) is scheduled for release on Wednesday, May 31, 2017. Here’s what’s in store:
PC 3.0 will continue to focus on the areas identified in the Flexible Hyrid Electronics (FHE) Roadmap developed by NextFlex Technical Working Groups. This roadmap is developed by industry, government, nonprofit, and academic subject matter experts, and reviewed by the Institute’s Technical and Governing Councils.
Topic areas for this proposal include subsystem development, as well as development of manufacturing processes and/or solutions for capability gaps. Specifically, there are four Manufacturing Thrust Area (MTA) and three Technology Platform Demonstration (TPD) topics planned:
- Printed circuit elements for RF and high-speed applications
- Printed passives for FHE including materials, tools, and process documentation
- Z-axis interconnect and via formation
- Additive and semi-additive manufacturing methods for high density interconnects
- Control and/or condition-based monitoring applications for physical or perishable assets
- Adaptive wearable or structural articles with soft robotics response
- Development of a low-cost, high-performing multi-sensor system integrated in a user-friendly “wear and forget” format for medical or worker safety applications
Project Call 3.0 is anticipated to award multiple projects at a value totaling approximately $14 million, comprised of $7 million in government funding and cost-share contribution from participants.
Learn more at the following events (links to register to be announced):
- June 8: PC 3.0 Webinar taking place online at 10:00 AM Pacific (1:00 PM Eastern)
- June 22: PC 3.0 Topic Networking session taking place at 4:45 PM, co-located with 2017FLEX at Hyatt Regency Hotel, Monterey, California
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