PC 8.0 has been announced. Click here to learn more about the topics and submission guidelines.
Dear NextFlex Members and Friends, Special Congratulations to Auburn University! Our colleagues at Auburn University were recently recognized with the “Outstanding Paper Award” in the Mechanics and Reliability Track at ITHERM 2018 in San Diego. Their paper, “Flexible Power-Source Survivability Assurance under Bending Loads and Operating Temperatures Representative of Stresses …
Manufacturing USA is helping to honor the next generation of innovative leaders through partnering with the Creators of the Teen Choice awards in an all new, first-of-its-kind Science + Innovation Awards. We need your help in nominating those rising stars already positively impacting their communities through what they make! The …
SAN JOSE, Calif., Dec. 7, 2017 /PRNewswire/ — NextFlex®, America’s Flexible Hybrid Electronics (FHE) Manufacturing Institute, today announced that, together with partners San Jose City College (SJCC) and Jabil, it will host FlexFactor™ Finals: Silicon Valley at 5:30 p.m. this evening in the SJCC Theater. Thirteen teams of high school students from across Silicon Valley were selected …
NextFlex will participate in the first FabLab Science and Innovation Awards, brought to you by the same team that produces the Teen Choice Awards, and the Young Women’s Honors. To be held April 14 in Santa Monica, CA, the award show will be hosted by Mayim Bialik of Big Bang …
The I-Corps @ DoD pilot program is an intensive 7 week entrepreneurial education program, modeled after other lean startup programs, which trains researchers in how to become entrepreneurs. The program seeks to fund as many as 12 teams of three people each to explore the commercial and defense potential of …
The Future of Flexible Hybrid Electronics Has Arrived It’s official: the era of flexible hybrid electronics (FHE) is off and running! NextFlex hosted its Innovation Opening Day on Wednesday, August 31, at its new 34,000-square-foot facility in San Jose. The event drew more than 200 government dignitaries, state and local …
Dr. Tom Rucker, VP, Technology Development and Dir-Assembly and Test Technology at Intel, gave an amazing keynote presentation at our event today, reminding us that “packaging is no longer an afterthought; it is an extension of the backend of the fab.” 1/2
#FHE #AdvancedPackaging
Learn the top 3 reasons why prioritizing R&D during the chip shortage is so important!
http://smt.iconnect007.com/index.php/article/134378/rd-takes-back-seat-amidst-chip-shortagebut-it-shouldnt/134381/
#chipshortage #fhe #flexiblehybridelectronics #researchanddevelopment #innovation
Project Call 7.0 awardees have been announced! Learn more about the projects from organizations like @LockheedMartin, @GEResearch, @binghamtonu, @RaytheonDefense, @GDMS, @AuburnU, @UESIncDayton, and @SafetySentinel.
https://www.printedelectronicsnow.com/contents/view_breaking-news/2022-12-05/nextflex-announces-more-than-8-million-in-funding-for-fhe/
For the better part of two years, the supply chain has wrestled with a semiconductor shortage that has impacted numerous sectors of the electronics industry. Learn how to avoid the next chip shortage here!
https://electronics360.globalspec.com/article/18997/q-a-how-to-avoid-the-next-chip-shortage
