READ THE MARCH NEWSLETTER Dear NextFlex Members and Friends, It is hard to believe that it has been a month already since we ended a successful Flex Conference in Monterey, CA. We at NextFlex contributed greatly to the success of the event, and we got so much back in return. …
Completed NextFlex Project Offers Prime Opportunity to Broaden Awareness of FHE by Capitalizing on Arduino’s Popularity with Open-source Developer Community San Jose, Calif.—NextFlex®, America’s Flexible Hybrid Electronics (FHE) Manufacturing Institute, today announced it has successfully proven the robustness of the FHE manufacturing process, producing multiple functional samples of a flexible …
Republished from EE Times. By Wilfried Bair, Senior Engineering Manager – Device Integration & Packaging, NextFlex Wearables require flexible hybrid electronics with die thinned to less than 30mum, and handling these ultrathin die is turning out to be a critical part of the manufacturing process. Ultrathin die (<50 µm) have been …
NextFlex will once again open the doors to its manufacturing facility in San Jose for its second annual Innovation Day on Thursday, Sept. 21, 2017. Since its inception in 2015 – when the U.S. Dept. of Defense announced a $75-million award to advance the country’s manufacturing ecosystem and workforce for …
Republished guest column from Photonics Online. By Jason Marsh and Benjamin Leever, NextFlex From a Department of Defense (DoD) standpoint, flexible hybrid electronics (FHE) is a highly interesting technology area. FHE is a new category of microelectronics using novel materials with stretchable, conformable, and flexible form factors. This emerging technology …
iNEMI’s largest and most extensive roadmap is on sale online Herndon, Virginia — The 2017 Roadmap from the International Electronics Manufacturing Initiative (iNEMI) is now on sale on the iNEMI website. With 28 chapters (the most ever published by iNEMI) and 2,300+ pages, this latest edition of the roadmap provides …