PC 8.0 has been announced. Click here to learn more about the topics and submission guidelines.
Hello NextFlex Friends and Colleagues, It’s hard to believe that we are now six months into the remote working environment, and it doesn’t seem to get any easier. While it may be true that we’re getting used to the video meeting technology that enables our hopping from one meeting to …
Greetings to all, Big news! We recently piloted our newest Workforce Development program here at NextFlex in San Jose. FHE PRO is a professional education program designed to immerse participants in the current state-of the art and the potential future state of flexible hybrid electronics technologies, manufacturing processes, and applications. …
We’re Growing Again As capability in the Technology Hub gains momentum, NextFlex needs new skills and abilities to design, develop, print, integrate devices and test FHE-enabled devices and manufacturing processes. We’ve expanded our technical team to accommodate all these activities and the following staff joined NextFlex over the past six …
Big News from the East Coast! I’m writing this from Binghamton, NY, where I just spoke at the 30th Annual Electronics Packaging Symposium, and NextFlex is very pleased to have just announced the formation of two NextFlex “Nodes” to support regional FHE manufacturing ecosystems in New York and Massachusetts. Since …
2018 NextFlex Innovation Day Tops Expectations The NextFlex team extends our sincere thanks to all who attended our third Innovation Day on August 9th. The day exceeded our wildest expectations, with more than 400 members, educators, government partners and supporters participating to see the latest and greatest in FHE-enabled applications, …
Innovation Day 2018 Announced Save the date for Innovation Day 2018, which will be held August 9th here at NextFlex headquarters in San Jose, California. For those who attended Innovation Day last September, you’ll remember the standing-room-only crowds, the VIP speakers, the 45 FHE-enabled technology displays, and the window tours …
Dr. Tom Rucker, VP, Technology Development and Dir-Assembly and Test Technology at Intel, gave an amazing keynote presentation at our event today, reminding us that “packaging is no longer an afterthought; it is an extension of the backend of the fab.” 1/2
#FHE #AdvancedPackaging
Learn the top 3 reasons why prioritizing R&D during the chip shortage is so important!
http://smt.iconnect007.com/index.php/article/134378/rd-takes-back-seat-amidst-chip-shortagebut-it-shouldnt/134381/
#chipshortage #fhe #flexiblehybridelectronics #researchanddevelopment #innovation
Project Call 7.0 awardees have been announced! Learn more about the projects from organizations like @LockheedMartin, @GEResearch, @binghamtonu, @RaytheonDefense, @GDMS, @AuburnU, @UESIncDayton, and @SafetySentinel.
https://www.printedelectronicsnow.com/contents/view_breaking-news/2022-12-05/nextflex-announces-more-than-8-million-in-funding-for-fhe/
For the better part of two years, the supply chain has wrestled with a semiconductor shortage that has impacted numerous sectors of the electronics industry. Learn how to avoid the next chip shortage here!
https://electronics360.globalspec.com/article/18997/q-a-how-to-avoid-the-next-chip-shortage
