PC 8.0 has been announced. Click here to learn more about the topics and submission guidelines.
By: Christina Moore, Workforce Development Manager, NextFlex Recently we had the opportunity to catch up with Deanna Strauss Hersko, M. Ed, the FlexFactor Program Director at Lorain County Community College (LCCC). Deanna manages LCCC’s Career Technical Pathways and Programs in addition to leading the local implementation of NextFlex’s FlexFactor program. …
Greetings to all, Big news! We recently piloted our newest Workforce Development program here at NextFlex in San Jose. FHE PRO is a professional education program designed to immerse participants in the current state-of the art and the potential future state of flexible hybrid electronics technologies, manufacturing processes, and applications. …
We’re Growing Again As capability in the Technology Hub gains momentum, NextFlex needs new skills and abilities to design, develop, print, integrate devices and test FHE-enabled devices and manufacturing processes. We’ve expanded our technical team to accommodate all these activities and the following staff joined NextFlex over the past six …
2018 NextFlex Innovation Day Tops Expectations The NextFlex team extends our sincere thanks to all who attended our third Innovation Day on August 9th. The day exceeded our wildest expectations, with more than 400 members, educators, government partners and supporters participating to see the latest and greatest in FHE-enabled applications, …
Dr. Tom Rucker, VP, Technology Development and Dir-Assembly and Test Technology at Intel, gave an amazing keynote presentation at our event today, reminding us that “packaging is no longer an afterthought; it is an extension of the backend of the fab.” 1/2
#FHE #AdvancedPackaging
Learn the top 3 reasons why prioritizing R&D during the chip shortage is so important!
http://smt.iconnect007.com/index.php/article/134378/rd-takes-back-seat-amidst-chip-shortagebut-it-shouldnt/134381/
#chipshortage #fhe #flexiblehybridelectronics #researchanddevelopment #innovation
Project Call 7.0 awardees have been announced! Learn more about the projects from organizations like @LockheedMartin, @GEResearch, @binghamtonu, @RaytheonDefense, @GDMS, @AuburnU, @UESIncDayton, and @SafetySentinel.
https://www.printedelectronicsnow.com/contents/view_breaking-news/2022-12-05/nextflex-announces-more-than-8-million-in-funding-for-fhe/
For the better part of two years, the supply chain has wrestled with a semiconductor shortage that has impacted numerous sectors of the electronics industry. Learn how to avoid the next chip shortage here!
https://electronics360.globalspec.com/article/18997/q-a-how-to-avoid-the-next-chip-shortage
