PC 8.0 has been announced. Click here to learn more about the topics and submission guidelines.
Big News from the East Coast! I’m writing this from Binghamton, NY, where I just spoke at the 30th Annual Electronics Packaging Symposium, and NextFlex is very pleased to have just announced the formation of two NextFlex “Nodes” to support regional FHE manufacturing ecosystems in New York and Massachusetts. Since …
Dr. Tom Rucker, VP, Technology Development and Dir-Assembly and Test Technology at Intel, gave an amazing keynote presentation at our event today, reminding us that “packaging is no longer an afterthought; it is an extension of the backend of the fab.” 1/2
#FHE #AdvancedPackaging
Learn the top 3 reasons why prioritizing R&D during the chip shortage is so important!
http://smt.iconnect007.com/index.php/article/134378/rd-takes-back-seat-amidst-chip-shortagebut-it-shouldnt/134381/
#chipshortage #fhe #flexiblehybridelectronics #researchanddevelopment #innovation
Project Call 7.0 awardees have been announced! Learn more about the projects from organizations like @LockheedMartin, @GEResearch, @binghamtonu, @RaytheonDefense, @GDMS, @AuburnU, @UESIncDayton, and @SafetySentinel.
https://www.printedelectronicsnow.com/contents/view_breaking-news/2022-12-05/nextflex-announces-more-than-8-million-in-funding-for-fhe/
For the better part of two years, the supply chain has wrestled with a semiconductor shortage that has impacted numerous sectors of the electronics industry. Learn how to avoid the next chip shortage here!
https://electronics360.globalspec.com/article/18997/q-a-how-to-avoid-the-next-chip-shortage
