Projects include disposable health monitors that adhere to the skin, epidermal sensors for robotic knees, and conditional monitors for industry and infrastructure San Jose, Calif. – NextFlex®, America’s Flexible Hybrid Electronics (FHE) Manufacturing Institute, today announced $12 million (including $7M in cost-share contribution from participants) in funding for seven projects …
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Latest Project Call Gets “Under the Hood,” Focusing on Subsystem Development and Manufacturing Processes/Solutions that Bridge Capability Gaps San Jose, Calif. — NextFlex®, America’s Flexible Hybrid Electronics (FHE) Manufacturing Institute, has released Project Call 3.0 (PC 3.0)—the latest call for proposals to fund projects that seek to further the development and …
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We are pleased to announce the release of the inaugural issue of NextFlex News, our monthly newsletter designed to keep members and the flexible hybrid electronics community informed about funded project work, technology advancements, workforce development activities, and industry events. Project Call 3.0 With 24 active projects already underway from …
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Project Call 3.0 (PC 3.0) is scheduled for release on Wednesday, May 31, 2017. Here’s what’s in store: PC 3.0 will continue to focus on the areas identified in the Flexible Hyrid Electronics (FHE) Roadmap developed by NextFlex Technical Working Groups. This roadmap is developed by industry, government, nonprofit, and …
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