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NextFlex News – July 2018 Newsletter

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NextFlex Innovation Day has Grown to Innovation Week! The excitement is building. If you haven’t already RSVP’d to attend, plan now to join us August 6-10, 2018, for “Innovation Week” — a week of meetings and activities designed to grow the FHE manufacturing supply chain, make critical decisions about the …

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Flex Your FHE Muscle at 2018FLEX

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NextFlex is gearing up for the ultimate gathering of the top minds in flexible hybrid electronics and IoT, smart medtech, smart automotive, and smart manufacturing at 2018FLEX in Monterey, California. On the morning of Monday, February 12th, Mike Mastropietro, NextFlex’s senior engineering manager of printing and additive processing, co-leads a short course …

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Project Call 3.0 Preview

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Project Call 3.0 (PC 3.0) is scheduled for release on Wednesday, May 31, 2017. Here’s what’s in store: PC 3.0 will continue to focus on the areas identified in the Flexible Hyrid Electronics (FHE) Roadmap developed by NextFlex Technical Working Groups. This roadmap is developed by industry, government, nonprofit, and …

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