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NextFlex News

Updating you on the latest from NextFlex

NextFlex Issues Third Call for Project Proposals Aimed at Bringing Flexible Hybrid Electronic Solutions to Market; More Than $45 Million Awarded in First Two Rounds

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Latest Project Call Gets “Under the Hood,” Focusing on Subsystem Development and Manufacturing Processes/Solutions that Bridge Capability Gaps San Jose, Calif. — NextFlex®, America’s Flexible Hybrid Electronics (FHE) Manufacturing Institute, has released Project Call 3.0 (PC 3.0)—the latest call for proposals to fund projects that seek to further the development and …

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Two Webinars Will Preview the 2017 INEMI Roadmap

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Asia Webinar is April 6; North America & Europe is April 7 HERNDON, VIRGINIA — The International Electronics Manufacturing Initiative (iNEMI) today announced that two webinars are scheduled to review highlights of the 2017 iNEMI Roadmap. The first webinar, scheduled for April 6, will review the new Internet of Things …

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