Latest Project Call Gets “Under the Hood,” Focusing on Subsystem Development and Manufacturing Processes/Solutions that Bridge Capability Gaps San Jose, Calif. — NextFlex®, America’s Flexible Hybrid Electronics (FHE) Manufacturing Institute, has released Project Call 3.0 (PC 3.0)—the latest call for proposals to fund projects that seek to further the development and …
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Project Call 7.0 awardees have been announced! Learn more about the projects from organizations like @LockheedMartin, @GEResearch, @binghamtonu, @RaytheonDefense, @GDMS, @AuburnU, @UESIncDayton, and @SafetySentinel.
For the better part of two years, the supply chain has wrestled with a semiconductor shortage that has impacted numerous sectors of the electronics industry. Learn how to avoid the next chip shortage here!
While greenhouse gas emissions attributed to industry have declined 22% since 1990, greater strides still need to be made. Learn how the @MFGUSA institutes are working to reduce emissions.