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NextFlex Issues Third Call for Project Proposals Aimed at Bringing Flexible Hybrid Electronic Solutions to Market; More Than $45 Million Awarded in First Two Rounds

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Latest Project Call Gets “Under the Hood,” Focusing on Subsystem Development and Manufacturing Processes/Solutions that Bridge Capability Gaps San Jose, Calif. — NextFlex®, America’s Flexible Hybrid Electronics (FHE) Manufacturing Institute, has released Project Call 3.0 (PC 3.0)—the latest call for proposals to fund projects that seek to further the development and …

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