NextFlex Press
Sharing What Others Are Saying About Us
NextFlex Announces More than $8 Million in Funding for FHE
Q&A: How to avoid the next chip shortage
Electronics360
Reducing Industrial Emissions to Create an Equitable Clean Energy Future
Manufacturing USA
Advanced Packaging Gets an Additive Upgrade
iConnect 007
R&D Institutes Transport Future to Here and Now
EE Times
Additive Techniques For Flexible Hybrid Electronics Packaging And Integration With Human Body
Semiconductor Engineering
Latest Tweets
Project Call 7.0 awardees have been announced! Learn more about the projects from organizations like @LockheedMartin, @GEResearch, @binghamtonu, @RaytheonDefense, @GDMS, @AuburnU, @UESIncDayton, and @SafetySentinel.
https://www.printedelectronicsnow.com/contents/view_breaking-news/2022-12-05/nextflex-announces-more-than-8-million-in-funding-for-fhe/
For the better part of two years, the supply chain has wrestled with a semiconductor shortage that has impacted numerous sectors of the electronics industry. Learn how to avoid the next chip shortage here!
https://electronics360.globalspec.com/article/18997/q-a-how-to-avoid-the-next-chip-shortage
While greenhouse gas emissions attributed to industry have declined 22% since 1990, greater strides still need to be made. Learn how the @MFGUSA institutes are working to reduce emissions.
https://www.manufacturingusa.com/studies/reducing-industrial-emissions-create-equitable-clean-energy-future?utm_source=InstituteSyndication&utm_medium=Institutes