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Project Call 5.0 Details

Accelerating Tech Innovation & Commercialization

Additional Resources FAQs

About

NextFlex Project Calls fulfill one of the Institute’s primary goals: fostering technology innovation and commercialization.

Project Call 5.0 (PC 5.0) focuses on areas identified in the Flexible Hybrid Electronics (FHE) Roadmap developed by NextFlex Technical Working Groups. This roadmap is developed by industry, government, nonprofit, and academic subject matter experts, and reviewed by the Institute’s Technical and Governing Councils. Project call topics address identified gaps where the manufacturing readiness lags other aspects of the FHE ecosystem.

A wide range of topics comprise this latest project call.  PC 5.0 focuses primarily on manufacturing challenges and less on the development of complete functional demonstrator systems than some previous NextFlex Project Calls.  Topics have been developed by both Manufacturing Thrust Area and Technology Platform Demonstrator Technical Working Groups, addressing general and specific manufacturing challenges.  Physical hardware deliverables are still strongly desired, and for some topics, are required.

Among the PC 5.0 topics are some for which DoD agencies may be willing to co-fund projects and/or provide funding for follow-on activities.  These topics are indicated in the Project Call 5.0 Guidebook.

Manufacturing Topics
  • Demonstration of Inkjet Printing as a Path to Digital Manufacturing
  • DataCubes for the FHE Material and Process Database
    • A. Printed Stretchable Conductors
    • B. Adhesives for Surface Mount and Die Attach
  • Flexible Hybrid Electronics Process Design Kit 2.0
  • Structural Health Monitoring: Scalable Manufacturing of Embedded Sensors
  • Trusted Flexible Hybrid Electronics, Anti-Counterfeiting, and Data Privacy
  • Evaluation and Testing of Flexible Batteries
  • Additively Manufactured High Temperature Electronics for Hypersonics
 Agency Co-Funded Topics
  • Temperature and Humidity Sensing in Extreme Environments
  • Conformal Antennas for Telemetry
  • Flexible Interconnects for Large Deployable X-Band Phased Arrays

Through this project call, NextFlex will award multiple projects at a total value expected to exceed $10.5 million, including approximately $4.7 million in government funding.

Important: PC 5.0 represents a major change in the proposal process from previous Project Calls, so proposers are strongly encouraged to carefully review the Project Call Guidebook and proposal timeline.

Full details on submitting a proposal, all supporting documents, and the submission form can be found in the Project Call Reference Documents section on this page.

Timeline

Project Call Announcement and Posting 6/7/2019
PC 5.0 Proposer’s Day – Participation is optional 6/11/2019
PC 5.0 Proposer’s Day Live Webinar – Participation is optional 6/11/2019
PC 5.0 Webinar – Participation is optional 6/19/2019
Full Proposal Online Cover Sheet due 8/1/2019
Full Proposal Submission Deadline 8/15/2019
Anticipated Technical Council Review 10/1/2019
Anticipated Governing Council Review 10/16/2019

Additional Resources

Proposer’s Day

On June 11, 2019,  NextFlex will host a Proposer’s Day in Arlington, Virginia to introduce PC 5.0 topics and proposal submission procedures, answer questions regarding the project call, and provide opportunity for interested participants to develop proposal teams.

Proposer’s Day Live Webinar

Can’t make it to Proposer’s Day in person on June 11th? Join us via webinar for a brief overview of Project Call 5.0 topics and the proposal submission, review, and selection process.

View Recorded Session

PC 5.0 Interactive Webinar

On June 19, 2019, NextFlex will host a webinar to review PC 5.0 topics and proposal submission procedures, and to answer questions regarding the project call.  Interested participants should register for the webinar.

View Webinar Slides View Recorded Session

Manufacturing Readiness Level (MRL) Webinar

In May 2016, NextFlex hosted a webinar on MRLs, including MRL background, classifications/substantiation, and how they can be used within NextFlex Project Call proposals.

View Webinar Slides View Recorded Session

Frequently Asked Questions

How long are projects expected to take?

PC 5.0 projects are expected to range from 6-12 months. This is a change from previous Project Calls, which have included some topics with longer maximum duration.  With all other factors being equal, quicker execution of deliverables will be given priority in the selection process.  PC 5.0 projects will also have a strict end date requirement that will be discussed with successful proposal teams.

Does the term, “scalable,” necessarily refer to high volume manufacturing? For example, is there an interest in soft robotics that are low-volume/customized or in defense applications that may be lower volume than consumer electronics?

Scalable manufacturing refers to the notion that the capability should exist for a device to be produced in a cost-effective and easily replicable manner, e.g., not hand assembled.  The definition of “scalable” manufacturing for low-volume / customized hardware can be addressed by proposal teams individually as it pertains to such soft robotics, defense-related articles, and other projects.

How are costs expected to be shared among partnering companies?

The aggregate of the cost share must meet the requirements set out in the project call. The distribution of the elements between the members of the proposal team is determined by the proposing team itself.

What are the expected sources of the matching funds?

Cash or in-kind from participating organizations, companies, and other backers are all acceptable. There are organizations within states that have funds available for this purpose. Guidelines for reasonable forms of cost share are available in the Reference Documents section on this page “Cost Share Definitions and Guidance.” Still unsure? Contact NextFlex.

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