NextFlex Project Calls fulfill one of the Institute’s primary goals: fostering technology innovation and commercialization.
Project Call 6.0 (PC 6.0) focuses on areas identified in the Flexible Hybrid Electronics (FHE) Roadmap developed by NextFlex Technical Working Groups. This technology roadmap is developed by industry, government, nonprofit, and academic subject matter experts, then reviewed by the Institute’s Technical and Governing Councils. Project call topics address gaps where the manufacturing readiness lags behind other aspects of the flexible electronics ecosystem.
A wide range of topics comprise this latest project call. The topics were developed by both the Manufacturing Thrust Area and Technology Platform Demonstrator Technical Working Groups to address general and specific advanced manufacturing challenges. Physical hardware deliverables are still strongly desired, and for some topics, are required.
Topics for PC 6.0 include:
- PC 6.1: High Performance and Multi-Layer FHE Devices
- PC 6.2: Improving the Reliability of FHE Devices
- PC 6.3: FHE Demonstrators for Monitoring Systems
- PC 6.4: Advanced FHE Materials Demonstrator
- PC 6.5: Closed-Loop Process Monitoring for Printed Component Manufacturing
- PC 6.6: Advanced FHE Modeling and Design Tools
- PC 6.7: System Development of RF/Microwave FHE Technology
- PC 6.8: Open Topic for New Project Leads
DoD Agency-funded topics:
- PC 6.9: Flexible Hybrid Electronics (FHE) for Highly Integrated and Compact Interconnects for RF Systems
- PC 6.10: Conformal / Flexible FHE-based Active mm-Wave Phased Array Apertures
NextFlex hosted a virtual Proposer’s Day on Wednesday, February 17 to introduce PC 6.0 topics and proposal submission procedures, answer questions regarding the project call, and provide opportunity for interested participants to develop proposal teams.
Then, we held a PC 6.0 Virtual Teaming Event where members pitched their proposal ideas & capabilities to others looking to collaborate. They also heard from potential project proposers looking for teaming opportunities.
PC 6.0 projects have been awarded and will be announced soon.