PROJECT CALL 2.0 IS NOW CLOSED AND UNDER REVIEW. TO BE NOTIFIED OF FUTURE OPPORTUNITIES, CLICK HERE.
PROJECT CALL 2.0
The project call process fulfills one of the Institute’s primary goals: accelerate technology adoption into advanced products by developing and commercializing advanced manufacturing technologies through pre-competitive partnerships.
PC 2.0 will continue to focus on the areas identified in the FHE Roadmap established by NextFlex. Topic areas for this proposal include projects that bridge industries such as pharmaceutical, food and agriculture with the Internet of Things (IoT), and wireless communications for real-time data and analysis on temperature, UV exposure, vibration, and other environmental conditions that can be critical for perishable commodity products. These capabilities will be key to delivering efficiency and intelligence not only to commercial sectors, but to American troops as well.
But that’s not all, PC 2.0 is also looking at funding proposals for the advanced manufacturing equipment needed to produce these versatile FHE devices. Besides the markets identified above, FHE devices can be leveraged in health and fitness applications; this includes robotic prosthetic limbs for injured soldiers, amputees, or cancer survivors, or sensor patches that can track stress levels of soldiers on the battlefield or among premature babies that are too fragile for traditional blood work and tests. Other FHE device applications include novel robotics usage, automotive, aerospace, wearables, and even monitoring for the health and safety of structures, such as bridges and buildings.
PC 2.0 is anticipated to fund up to $10 million. Including cost-sharing, the total project value is expected to exceed $20 million.
Project Call 2.0 Reference Documents Kit
Project Call 2.0
Cost Calculations (Excel workbook)
Cost Share Definitions and Guidance
Online Cover Sheet (must be submitted 1 week in advance of pre-proposal and full proposal due dates)
|Project Call Announcement & Posting||5/5/2016|
|Project Call 2.0 Webinar||5/11/2016|
|Pre-Proposal Online Cover Sheet Due||5/30/2016|
|Pre-Proposal Submission Deadline||6/6/2016|
|Invitation for Full Proposal Submission||6/15/2016|
|Full Proposal Online Cover Sheet Due||7/25/2016|
|Full-Proposal Submission Deadline||7/27/2016|
|Anticipated Technical Council Review||8/10/2016|
|Anticipated Governing Council Review||8/16/2016|
NextFlex anticipates announcing Project Call 3.0 in early 2017.
Project Call 2.0 Webinar
On May 11, 2016, NextFlex hosted a webinar to review submission procedures and topics and to answer questions regarding this latest project call. Click here to download webinar slides.