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Technical Working Groups

Via a series of technical working groups (TWGs), NextFlex subject matter experts from across industry, academia, and government have come together to collaborate on roadmaps, key technology gaps, and the necessary technology planning required to advance the flexible hybrid electronics ecosystem.

Each working group is led by a three-person team of co-leads, including one from academia, one from government, and one from industry. Together, with over 150 diverse subject matter experts, the working groups are developing roadmaps that identify gaps in the ecosystem and determine where Project Call focus and funding should be applied for technology development.

Current focus areas include:

Human Monitoring Systems

Wearable, unobtrusive, non-invasive, and minimally invasive devices for sensing and reporting physiological state of warfighters, athletes, geriatric populations, and medical patients in varied environments.

Industry Co-Lead: Azar Alizadeh, GE Research
Academic Co-Lead: Jeff Morse, UMass Amherst
Government Co-Lead: Regina Shia, AFRL

Asset Monitoring Systems

Conformal or integrated devices for sensing and reporting the state of infrastructure, vehicles, logistics, or the environment. Networks of sensors or devices for Internet of Things concepts.

Industry Co-Lead: Michael Mitchell, Boeing Research and Technology
Academic Co-Lead: Pradeep Lall, Auburn University
Government Co-Lead: Ken Blecker, ARDEC

Integrated Array Antennas

Patterning of efficient printed wideband array elements on flexible or conformal surfaces and integration of thinned electronics with printed wideband array elements.

Industry Co-Lead: Joseph Kunze, SI2 Technologies
Academic Co-Lead: Alkim Akyurtlu, UMass Lowell
Government Co-Lead: Steven Weiss, ARL

Soft Robotics

Soft, compressible sensors and devices for robotic functionality, enabling active clothing, wearable robots or robotic tools, and advanced prosthetics. Improved robot-human interactions for surgery, manufacturing, and consumer electronics.

Industry Co-Lead: Deepak Trivedi, GE
Academic Co-Lead: Chuck Zhang, Georgia Tech
Government Co-Lead: Nathan Lazarus, ARL

Flexible Power

Power and energy storage subsystems for FHE devices including batteries, supercapacitors, wireless power, and energy harvesting approaches. These devices are compatible with small, unobtrusive, flexible form factors.

Academic Co-Lead: Devin MacKenzie, University of Washington
Government Co-Lead: Enoch Wang, Government

Device Integration & Packaging

Development of new tools for handling and integrating thin flexible silicon dies, ICs, passive components, and sensors on flexible, stretchable, foldable substrates and 3D surfaces. Leveraging advanced precision printing and high-speed automated pick & place for integration of device components, interconnects, and data lines.

Industry Co-Lead: Stephen Gonya, Lockheed Martin
Industry Co-Lead
: Nancy Stoeffel, GE

Academic Co-Lead: Mark Poliks, Binghamton University
Government Co-Lead: Darren Crum, NSWC Crane

Printed Flexible Components & Microfluidics

Developing and maturing contact and non-contact printing processes that support hybrid device concepts, including sensors and discrete device components. Printing & integration of microfluidic channels and fluidic control elements.

Industry Co-Lead: Chris Stoessel, Eastman Chemical
Academic Co-Lead: Massood Atashbar, Western Michigan University
Government Co-Lead: Chris Tabor, AFRL


Supply scale-up and FHE manufacturing processes for conductive and dielectric inks and pastes, adhesives, encapsulant materials, and flexible substrates.

Industry Co-Lead: John Williams, Boeing Research and Technology
Academic Co-Lead: Joey Mead, UMass Lowell
Government Co-Lead: Giuseppe Di Benedetto, Army ARDEC
Government Co-Lead: Kate Duncan, CERDEC

Modeling & Design

Leveraging existing software & hardware design capabilities, simulation techniques, and manufacturing process control tools while also integrating novel manufacturing design rules for FHE. 

Industry Co-Lead: Jin-Sung Youn, HPE
Academic Co-Lead: Suresh Sitaraman, Georgia Tech
Government Co-Lead: Phil Buskohl, AFRL

Standards, Testing, & Reliability

Developing tools and test protocols to evaluate device-level and system-level FHE performance as well as reliability in both commercial and military environments. Partnering with standards organizations and professional societies to develop specifications & standards.

Industry Co-Lead: David Shaddock, GE
Academic Co-Lead: Mark Poliks, Binghamton University
Government Co-Lead: Emily Heckman, AFRL

Interested in joining a Technical Working Group?

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