Project Call 3.0 Opens May 31, 2017. 

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Latest News: Project Call 3.0 Preview

Project Call 3.0 (PC 3.0) is scheduled for release on Wednesday, May 31, 2017. Here’s what’s in store:

PC 3.0 will continue to focus on the areas identified in the Flexible Hyrid Electronics (FHE) Roadmap developed by NextFlex Technical Working Groups. This roadmap is developed by industry, government, nonprofit, and academic subject matter experts, and reviewed by the Institute’s Technical and Governing Councils.

Topic areas for this proposal include subsystem development, as well as development of manufacturing processes and/or solutions for capability gaps. Specifically, there are four Manufacturing Thrust Area (MTA) and three Technology Platform Demonstration (TPD) topics planned:

  • MTA
    • Printed circuit elements for RF and high-speed applications
    • Printed passives for FHE including materials, tools, and process documentation
    • Z-axis interconnect and via formation
    • Additive and semi-additive manufacturing methods for high density interconnects
  • TPD
    • Control and/or condition-based monitoring applications for physical or perishable assets
    • Adaptive wearable or structural articles with soft robotics response
    • Development of a low-cost, high-performing multi-sensor system integrated in a user-friendly “wear and forget” format for medical or worker safety applications

Project Call 3.0 is anticipated to award multiple projects at a value totaling approximately $14 million, comprised of $7 million in government funding and cost-share contribution from participants.

Learn more at the following events (links to register to be announced):

  • June 8: PC 3.0 Webinar taking place online at 10:00 AM Pacific (1:00 PM Eastern)
  • June 22: PC 3.0 Topic Networking session taking place at 4:45 PM, co-located with 2017FLEX at Hyatt Regency Hotel, Monterey, California

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Featured Press: NextFlex Awards Next Round of Grants

Printed Electronics Now

The field of flexible electronics is very promising, and developing hybrid manufacturing capabilities that include printing and traditional silicon-based electronics is seen as a strong option going forward.

With that in mind, NextFlex, America’s Flexible Hybrid Electronics (FHE) Manufacturing Institute was formed in 2015 by the Department of Defense (DoD) and FlexTech Alliance to advance manufacturing of FHE in the US. As part of its mission, NextFlex is issuing project awards for promising applications. The second batch of four projects was just announced, with $8.6 million worth of contracts issued.

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Featured Event: FHE and the Opportunities for Advanced Packaging

NextFlex Headquarters, San Jose, CA

MEPTEC in association with IMAPS

NextFlex Headquarters, 2244 Blach Pl, Ste 150, San Jose, CA 95131

Wednesday, June 7, 2017, 11:30 AM-1:30 PM

$45, includes box lunch and NextFlex Technology Hub Tour

MEPTEC is pleased to offer an exclusive presentation on Flexible Hybrid Electronics and the Opportunities for Advanced Packaging, to be presented by Jason Marsh, Director of Technology at NextFlex.

This will provide an introduction to NextFlex, Flexible Hybrid Electronics (FHE), and its applications. Mr. Marsh will then outline specific benefits FHE brings to microelectronics manufacturing and how these attributes will enable the much anticipated growth of wearables, medical, and IoT categories. Collaborative developments currently underway in the 20+ funded NextFlex projects will be highlighted. Finally, key developments being driven by FHE that may be useful to advance packaging manufacturing will be covered.

In addition, Paul Semenza, NextFlex’s Director of Commercialization, will discuss how companies are getting involved and possible participation opportunities with NextFlex.

A tour of the NextFlex Technology Hub will round out the session. The cleanroom is designed to be a Class 10,000 manufacturing pilot line for FHE, with dedicated areas for printing and additive processing, assembly and integration, and test and measurement, supported by labs. The purpose of the Technology Hub is for NextFlex member company use, primarily to support ongoing collaborative project work, but also for prototyping products, development of manufacturing process, and training. Technical staff will be on hand to talk with attendees about the cleanroom, the status of the equipment on site, and development plans.

11:00 AM Registration Opens / Lunch

11:30 AM Welcome – Dr. Malcolm J. Thompson, Executive Director, NextFlex

11:45 AM Jason Marsh, Director of Technology, NextFlex

12:15 PM Paul Semenza, Director of Commercialization, NextFlex

12:30 PM Technology Hub Tour

1:30 PM End


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Project Call

Through the Project Call, NextFlex focuses on accelerating technology innovation and commercialization through pre-competitive partnerships. Learn about our current Project Call, details about past calls, and what’s coming up for future Project Calls.

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