Innovation Days 2022 was fantastic! Click here to see photos.
Dear Members and Friends, Last week NextFlex participated in the 33rd IEEE Electronics Packaging Symposium held at Binghamton University. Dr. Scott Miller, Director of Technology; Robert McManus, Engineering Manager, Software and Test; and Dr. Janos Veres, Director of Engineering, participated in the symposium. The event was organized by the IEEC …
Join us for a follow-on discussion on plans for a NextFlex response to an anticipated RFP on Advanced Packaging manufacturing capability development in the US as part of the CHIPS Act. The momentum behind this topic continues in the microelectronics community so we will be prepared to put forth a …
Through the Project Call, NextFlex focuses on accelerating technology innovation and commercialization through pre-competitive partnerships. Learn about our current Project Call, details about past calls, and what’s coming up for future Project Calls.
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