Register for our Workshop: Applications of Hybrid Electronics for Advanced Packaging – January 18 & 19!

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THE LATEST FLEXIBLE HYBRID ELECTRONICS AND ADVANCED MANUFACTURING NEWS, PRESS, AND EVENT INFO

Latest News: Hybrid Electronics for Advanced Packaging: FHE Manufacturing Community Convenes at NextFlex

NextFlex hosted a workshop January 18-19 at its Technology Hub in San Jose, CA, designed to explore and align opportunities for hybrid electronics technologies in new and emerging areas of semiconductor packaging. Attended by 100 subject matter experts from industry, academia, and government, the workshop provided opportunities to brainstorm and …

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Featured Press: 10 Years After Start, FHE in Commercial Use

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Featured Event: Advanced Packaging Roundtable for NextFlex Members

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Join us for a follow-on discussion on plans for a NextFlex response to an anticipated RFP on Advanced Packaging manufacturing capability development in the US as part of the CHIPS Act. The momentum behind this topic continues in the microelectronics community so we will be prepared to put forth a …

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Project Call

Through the Project Call, NextFlex focuses on accelerating technology innovation and commercialization through pre-competitive partnerships. Learn about our current Project Call, details about past calls, and what’s coming up for future Project Calls.

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